| 5175 | New Standard: Guide for Multi-Wafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | Published as SEMI 3D3-0613 06/28/2013 | Region of Action- NA |
| 5269A | New Standard: Terminology for Through Silicon Via Geometrical Metrology | Published as SEMI 3D1-0912 09/18/2012 | Region of Action- NA |
| 5270 | New Standard: Guide for Measuring Voids in Bonded Wafer Stacks | Published as SEMI 3D13-0715 07/31/2015 | Region of Action- NA |
| 5409 | New Standard: Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | Published as SEMI 3D4-0613 06/28/2013 | Region of Action- NA |
| 5410 | New Standard: Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | Published as SEMI 3D5-0613 06/28/2013 | Region of Action- NA |
| 5447A | New Standard: Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology | Published as SEMI 3D11-1214 12/05/2014 | Region of Action- NA |
| 5473 | New Standard: Guide for Alignment Mark for 3DS-IC Process | Published as SEMI 3D7-0913 09/27/2013 | Region of Action- Taiwan |
| 5482 | New Standard: Specification for Glass Carrier Wafers for 3DS-IC Applications | Published as SEMI 3D2-0113 01/25/2013 | Region of Action- NA |
| 5485 | New Standard: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products | Published as SEMI 3D14-0615 06/19/2015 | Region of Action- Taiwan |
| 5506A | New Standard: Guide for Measuring Flatness and Shape of Low Stiffness Wafers | Published as SEMI 3D12-0315 03/31/2015 | Region of Action- NA |
| 5688A | New Standard: GUIDE FOR OVERLAY PERFORMANCE ASSESSMENT FOR 3DS-IC PROCESS | Published as SEMI 3D15-0316 03/30/2016 | Region of Action- Taiwan |
| 5693 | New Standard: Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process | Published as SEMI 3D8-0514 05/30/2014 | Region of Action- NA |
| 5694 | New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stacks | Published as SEMI 3D9-0914 09/26/2014 | Region of Action- NA |
| 5695 | New Standard: Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack | Published as SEMI 3D10-0814 08/15/2014 | Region of Action- NA |
| 5713 | New Standard: SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING | Failed Technical Review and Returned to TF 04/05/2016 | Region of Action- NA |
| 5713A | New Standard: SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING | Published as SEMI 3D16-1116 11/25/2016 | Region of Action- NA |
| 5822 | New Standard: Specification for Reference Material for Bonded Wafer Stack Void Metrology | Failed Technical Review and Returned to TF 04/04/2017 | Region of Action- NA |
| 5822A | New Standard, Specification for Reference Material for Bonded Wafer Stack Void Metrology | Published as SEMI 3D17-1217 12/29/2017 | Region of Action- NA |
| 5823A | Revision to SEMI 3D2-1113, Specification for Glass Carrier Wafers for 3DS-IC Applications | Published 02/26/2016 | Region of Action- NA |
| 6179 | Reapproval of SEMI 3D1-0912, Terminology for Through Silicon via Geometrical Metrology | Published 04/13/2018 | Region of Action- NA |