| 5173 | New Standard: Guide for Describing Materials Properties and Test Methods for a 300 mm 3DS-IC Wafer Stack | Failed Technical Review and Returned to TF 04/03/2012 | Region of Action- NA |
| 5173A | New Standard: Guide for Describing Materials Properties and Test Methods for a 300 mm 3DS-IC Wafer Stack | Failed Technical Review and Returned to TF 07/10/2012 | Region of Action- NA |
| 5173B | New Standard: Guide for Describing Materials Properties and Test Methods for a 300 mm 3DS-IC Wafer Stack | Failed Technical Review and Returned to TF 10/30/2012 | Region of Action- NA |
| 5173C | New Standard: Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack | Failed Technical Review and Returned to TF 04/02/2013 | Region of Action- NA |
| 5175 | New Standard: Guide for Multi-Wafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | Passed Technical Review - Awaiting Procedural Review 04/02/2013 | Region of Action- NA |
| 5269 | New Standard: Terminology for Through Silicon Via Geometrical Metrology | Failed Technical Review and Returned to TF 04/03/2012 | Region of Action- NA |
| 5269A | New Standard: Terminology for Through Silicon Via Geometrical Metrology | Published as SEMI 3D1-0912 09/18/2012 | Region of Action- NA |
| 5409 | New Standard: Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | Passed Technical Review - Awaiting Procedural Review 04/02/2013 | Region of Action- NA |
| 5410 | New Standard: Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | Passed Technical Review - Awaiting Procedural Review 04/02/2013 | Region of Action- NA |
| 5474 | New Standard: Guide for CMP and Micro-bump Processes for Frontside Through Silicon Via (TSV) Integration | Drafting 02/13/2013 | Region of Action- Taiwan |
| 5482 | New Standard: Specification for Glass Carrier Wafers for 3DS-IC Applications | Published as SEMI 3D2-0113 01/25/2013 | Region of Action- NA |
| 5588 | Line Item Revision to SEMI 3D2-0113, Specification for Glass Carrier Wafers for 3DS-IC Applications | Drafting 04/29/2013 | Region of Action- NA |