| 4563 | Specifications for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging Prosesses | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4563A | New Standard: Specification for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging Prosesses | Published as SEMI G90-0811 08/12/2011 | Region of Action- Japan |
| 4814 | New Standard: Specification for Tape Frame Cassette for 450 mm Wafer | Failed Technical Review and Returned to TF 08/05/2011 | Region of Action- Japan |
| 4814A | New Standard: Specification for Tape Frame Cassette for 450 mm Wafer | Published as SEMI G92-0412 04/27/2012 | Region of Action- Japan |
| 4815 | New Standard: Specification for Tape Frame for 450 mm Wafer | Published as SEMI G88-0211 01/27/2011 | Region of Action- Japan |
| 4860 | Reapproval of SEMI G18-96, Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4860A | Reapproval of SEMI G18-96, Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes | Published 08/19/2011 | Region of Action- Japan |
| 4861 | Reapproval of SEMI G19-0997, Specification for Dip Leadframes Produced by Etching | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4861A | Reapproval of SEMI G19-0997, Specification for Dip Leadframes Produced by Etching | Published 08/19/2011 | Region of Action- Japan |
| 4862 | Reapproval of SEMI G23-0996, Test Method of Inductance for Internal Traces of Semiconductor Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4862A | Reapproval of SEMI G23-0996, Test Method of Inductance for Internal Traces of Semiconductor Packages | Published 08/19/2011 | Region of Action- Japan |
| 4863 | Reapproval of SEMI G24-89, Test Method for Measuring the Lead-To-Lead and Loading Capacitance of Package Leads | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4863A | Reapproval of SEMI G24-89, Test Method for Measuring the Lead-To-Lead and Loading Capacitance of Package Leads | Published 08/19/2011 | Region of Action- Japan |
| 4864 | Reapproval of SEMI G25-89, Test Method for Measuring the Resistance of Package Leads | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4864A | Reapproval of SEMI G25-89, Test Method for Measuring the Resistance of Package Leads | Published 08/19/2011 | Region of Action- Japan |
| 4865 | Reapproval of SEMI G28-0997, Specification for Leadframes for Plastic Molded S.O. Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4865A | Reapproval of SEMI G28-0997, Specification for Leadframes for Plastic Molded S.O. Packages | Published 08/19/2011 | Region of Action- Japan |
| 4866 | Reapproval of SEMI G30-88, Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4866A | Reapproval of SEMI G30-88, Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages | Published 08/26/2011 | Region of Action- Japan |
| 4868 | Reapproval of SEMI G38-0996, Test Method for Still - and - Forced - Air Junction -to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4868A | Reapproval of SEMI G38-0996, Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages | Published 08/26/2011 | Region of Action- Japan |
| 4869 | Reapproval of SEMI G4-0302, Specification for Integrated Circuit Leadframe Materials Used in The Production of Stanmped Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4869A | Reapproval of SEMI G4-0302, Specification for Integrated Circuit Leadframe Materials Used in The Production of Stanmped Leadframes | Published 08/26/2011 | Region of Action- Japan |
| 4870A | Reapproval of SEMI G42-0996, Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages | Published 08/26/2011 | Region of Action- Japan |
| 4871 | Reapproval of SEMI G43-87, Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4871A | Reapproval of SEMI G43-87, Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages | Published 08/26/2011 | Region of Action- Japan |
| 4872 | Reapproval of SEMI G51-90, Specification for Plastic Molded (METRIC) Quad Flat Pack Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4872A | Reapproval of SEMI G51-90, Specification for Plastic Molded (METRIC) Quad Flat Pack Leadframes | Published 08/26/2011 | Region of Action- Japan |
| 4873 | Reapproval of SEMI G55-93, Test Method for Measurement of Silver Planting Brightness | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4873A | Reapproval of SEMI G55-93, Test Method for Measurement of Silver Plating Brightness | Published 08/26/2011 | Region of Action- Japan |
| 4874 | Reapproval of SEMI G56-93, Test Method for Measurement of Silver Planting Thickness | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4874A | Reapproval of SEMI G56-93, Test Method for Measurement of Silver Plating Thickness | Published 08/26/2011 | Region of Action- Japan |
| 4876 | Reapproval of SEMI G29-1296E, Test Method for Trace Contaminants in Molding Compounds | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4876A | Reapproval of SEMI G29-1296E, Test Method for Trace Contaminants in Molding Compounds | Published 08/26/2011 | Region of Action- Japan |
| 4877 | Reapproval of SEMI G58-94, Specification for Cerquad Package Constructions | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4877A | Reapproval of SEMI G58-94, Specification for Cerquad Package Constructions | Published 08/26/2011 | Region of Action- Japan |
| 4878 | Reapproval of SEMI G59-94, Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4878A | Reapproval of SEMI G59-94, Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes | Published 08/26/2011 | Region of Action- Japan |
| 4879 | Reapproval of SEMI G60-94, Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4879A | Reapproval of SEMI G60-94, Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials | Published 08/26/2011 | Region of Action- Japan |
| 4880 | Reapproval of SEMI G62-95 Test Method for Silver Palting Quality | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4880A | Reapproval of SEMI G62-95, Test Method for Silver Plating Quality | Published 08/26/2011 | Region of Action- Japan |
| 4881 | Reapproval of SEMI G63-95 Test Method for Measurement of Die Shear Strength | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4881A | Reapproval of SEMI G63-95, Test Method for Measurement of Die Shear Strength | Published 08/26/2011 | Region of Action- Japan |
| 4882 | Reapproval of SEMI G64-96 Specification for Full-Plated Intergrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4882A | Reapproval of SEMI G64-96, Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) | Published 08/26/2011 | Region of Action- Japan |
| 4883 | Reapproval of SEMI G65-96 Test Method for Evaluation of Leadframe Materials Used For L-Leaded (GULL WING TYPE) Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4883A | Reapproval of SEMI G65-96, Test Method for Evaluation of Leadframe Materials Used for L-Leaded (GULL WING TYPE) Packages | Published 08/26/2011 | Region of Action- Japan |
| 4884 | Reapproval of SEMI G66-96 Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4884A | Reapproval of SEMI G66-96, Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds | Published 08/26/2011 | Region of Action- Japan |
| 4885 | Reapproval of SEMI G67-0996 Test Method for the Measurement of Particle Generation from Sheet Materials | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4885A | Reapproval of SEMI G67-0996, Test Method for the Measurement of Particle Generation from Sheet Materials | Published 08/26/2011 | Region of Action- Japan |
| 4886 | Reapproval of SEMI G69-0996 Test Method for Measurement of Adhesive Strength between Leadframes and Molding Compounds | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4886A | Reapproval of SEMI G69-0996, Test Method for Measurement of Adhesive Strength between Leadframes and Molding Compounds | Published 08/26/2011 | Region of Action- Japan |
| 4887 | Reapproval of SEMI G70-0996 Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4887A | Reapproval of SEMI G70-0996, Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes | Published 08/26/2011 | Region of Action- Japan |
| 4888 | Reapproval of SEMI G71-0996 Specification for Barcode Marking of Intermediate Container for Packaging Materials | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4888A | Reapproval of SEMI G71-0996, Specification for Barcode Marking of Intermediate Container for Packaging Materials | Published 08/26/2011 | Region of Action- Japan |
| 4889 | Reapproval of SEMI G72-0997 Specification for Ball Grid Array Design Library | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4889A | Reapproval of SEMI G72-0997, Specification for Ball Grid Array Design Library | Published 08/26/2011 | Region of Action- Japan |
| 4890 | Reapproval of SEMI G73-0997 Test Method for Pull Strength for Wire Bonding | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4890A | Reapproval of SEMI G73-0997, Test Method for Pull Strength for Wire Bonding | Published 09/02/2011 | Region of Action- Japan |
| 4891 | Reapproval of SEMI G8-94, Test Method for Gold Planting | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4891A | Reapproval of SEMI G8-94, Test Method for Gold Plating | Published 09/02/2011 | Region of Action- Japan |
| 4892 | Reapproval of SEMI G86-0303 Test Method for Measurement of Chip (DIE) Strength by Mean of 3-Point Bending | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4892A | Reapproval of SEMI G86-0303, Test Method for Measurement of Chip (DIE) Strength by Mean of 3-Point Bending | Published 09/02/2011 | Region of Action- Japan |
| 4894 | Reapproval of SEMI G68-0996 Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4894A | Reapproval of SEMI G68-0996, Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages | Published 09/02/2011 | Region of Action- Japan |
| 4908 | Reapproval of SEMI G10-96, Standard Method for Mechanical Measurement of Plastic Package Leadframes | Failed Technical Review and Returned to TF 03/18/2010 | Region of Action- Japan |
| 4908A | Reapproval of SEMI G10-96, Standard Method for Mechanical Measurement of Plastic Package Leadframes | Published 09/02/2011 | Region of Action- Japan |
| 4960 | Reapproval of SEMI G11-88, Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4960A | Reapproval of SEMI G11-88, Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds | Published 09/02/2011 | Region of Action- Japan |
| 4961 | Reapproval of SEMI G13-88, Standard Test Method for Expansion Characteristics of Molding Compounds | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4961A | Reapproval of SEMI G13-88, Standard Test Method for Expansion Characteristics of Molding Compounds | Published 09/02/2011 | Region of Action- Japan |
| 4962 | Reapproval of SEMI G15-93, Standard Test Method for Differential Scanning Calorimetry of Molding Compounds | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4962A | Reapproval of SEMI G15-93, Standard Test Method for Differential Scanning Calorimetry of Molding Compounds | Published 09/02/2011 | Region of Action- Japan |
| 4963 | Reapproval of SEMI G32-94, Guideline for Unencapsulated Thermal Test Chip | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4963A | Reapproval of SEMI G32-94, Guideline for Unencapsulated Thermal Test Chip | Published 09/02/2011 | Region of Action- Japan |
| 4964 | Specification for Leadframe Strip Size | Failed Technical Review and Returned to TF 08/06/2010 | Region of Action- Japan |
| 4964A | New Standard: Specification for Leadframe Strip Size | Published as SEMI G89-0211 01/27/2011 | Region of Action- Japan |
| 4965 | New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process | Failed Technical Review and Returned to TF 08/05/2011 | Region of Action- Japan |
| 4965A | New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process | Failed Procedural Review - Returned to Committee 02/21/2012 | Region of Action- Japan |
| 4965B | New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process | Failed Procedural Review - Returned to Committee 02/21/2012 | Region of Action- Japan |
| 4965C | New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in The Backend Process | Passed Technical Review - Awaiting Procedural Review 03/25/2013 | Region of Action- Japan |
| 5294 | New Standard: Measurement Method for Solder Sphere Size for Ball Grid Array Package | Published as SEMI G93-0412 04/27/2012 | Region of Action- Japan |
| 5295 | New Standard: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer | Published as SEMI G94-0113 01/25/2013 | Region of Action- Japan |