| 5835 | New Standard: Specification for Adhesive Tray Used for Thin Chip Handling | Published as SEMI G97-0116 01/29/2016 | Region of Action- Japan |
| 6027 | Line Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending | See Line Items Below | Region of Action- Japan |
6027
LI - 1 | Add SEMI G96 to § 3 as a referenced Standard | Published 02/24/2017 | Region of Action- Japan |
6027
LI - 2 | Add a note to ¶ 8.2 in order to clarify the conditions of the procedure | Published 02/24/2017 | Region of Action- Japan |
| 6028 | Line Item Revision to SEMI G97-0116: SPECIFICATION FOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING | See Line Items Below | Region of Action- Japan |
6028
LI - 1 | Modify the Figure 3, Figure 9 and Table 2 in order to clarify the original drawings | Published 06/28/2017 | Region of Action- Japan |
| 6029 | Reapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer | Published 02/24/2017 | Region of Action- Japan |
| 6031 | Revision to SEMI G21-0094: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES | Published 03/10/2017 | Region of Action- Japan |
| 6032 | Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME | Published 03/10/2017 | Region of Action- Japan |
| 6148 | Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” | See Line Items Below | Region of Action- Japan |
6148
LI - 1 | Change nonconforming title | Published 03/02/2018 | Region of Action- Japan |
6148
LI - 2 | Change section titles to meet the requirement which is specified section 3.2 of Procedure Manual | Published 03/02/2018 | Region of Action- Japan |
| 6149 | Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages” | See Line Items Below | Region of Action- Japan |
6149
LI - 1 | Change section titles to meet the requirement which is specified section 3.2 of Procedure Manual | Published 03/02/2018 | Region of Action- Japan |
6149
LI - 2 | Add “Calculation” section title and get re-formatted to meet the requirement which is specified section 3.2 of Procedure Manual | Published 03/02/2018 | Region of Action- Japan |
| 6150 | Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness” | See Line Items Below | Region of Action- Japan |
6150
LI - 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Published 03/02/2018 | Region of Action- Japan |
| 6151 | Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages” | See Line Items Below | Region of Action- Japan |
6151
LI - 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Published 03/02/2018 | Region of Action- Japan |
| 6153 | Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes | Published 03/02/2018 | Region of Action- Japan |
| 6154 | Line Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes” | Drafting 10/25/2017 | Region of Action- Japan |
| 6155 | Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality” | See Line Items Below | Region of Action- Japan |
6155
LI - 1 | Re-format some parts as to meet the requirement which is specified section 3.2 of Procedure Manual. | Published 03/02/2018 | Region of Action- Japan |
| 6157 | Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages | Published 03/02/2018 | Region of Action- Japan |
| 6158 | Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages | Published 03/02/2018 | Region of Action- Japan |
| 6159 | Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes | Published 03/02/2018 | Region of Action- Japan |
| 6160 | Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials | Published 03/02/2018 | Region of Action- Japan |
| 6161 | Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds | Published 03/02/2018 | Region of Action- Japan |
| 6162 | Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials | Published 03/02/2018 | Region of Action- Japan |
| 6163 | Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages | Published 03/02/2018 | Region of Action- Japan |
| 6164 | Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
| Published 03/02/2018 | Region of Action- Japan |
| 6165 | Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials | Published 03/02/2018 | Region of Action- Japan |
| 6166 | Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size | Published 03/02/2018 | Region of Action- Japan |