SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

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Assembly & Packaging

4563Specifications for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging ProsessesFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4563ANew Standard: Specification for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging ProsessesPublished as SEMI G90-0811 08/12/2011Region of Action- Japan
4814New Standard: Specification for Tape Frame Cassette for 450 mm WaferFailed Technical Review and Returned to TF 08/05/2011Region of Action- Japan
4814ANew Standard: Specification for Tape Frame Cassette for 450 mm WaferPublished as SEMI G92-0412 04/27/2012Region of Action- Japan
4815New Standard: Specification for Tape Frame for 450 mm WaferPublished as SEMI G88-0211 01/27/2011Region of Action- Japan
4860Reapproval of SEMI G18-96, Standard for Integrated Circuit Leadframe Material Used in the Production of Etched LeadframesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4860AReapproval of SEMI G18-96, Standard for Integrated Circuit Leadframe Material Used in the Production of Etched LeadframesPublished 08/19/2011Region of Action- Japan
4861Reapproval of SEMI G19-0997, Specification for Dip Leadframes Produced by EtchingFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4861AReapproval of SEMI G19-0997, Specification for Dip Leadframes Produced by EtchingPublished 08/19/2011Region of Action- Japan
4862Reapproval of SEMI G23-0996, Test Method of Inductance for Internal Traces of Semiconductor PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4862AReapproval of SEMI G23-0996, Test Method of Inductance for Internal Traces of Semiconductor PackagesPublished 08/19/2011Region of Action- Japan
4863Reapproval of SEMI G24-89, Test Method for Measuring the Lead-To-Lead and Loading Capacitance of Package LeadsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4863AReapproval of SEMI G24-89, Test Method for Measuring the Lead-To-Lead and Loading Capacitance of Package LeadsPublished 08/19/2011Region of Action- Japan
4864Reapproval of SEMI G25-89, Test Method for Measuring the Resistance of Package LeadsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4864AReapproval of SEMI G25-89, Test Method for Measuring the Resistance of Package LeadsPublished 08/19/2011Region of Action- Japan
4865Reapproval of SEMI G28-0997, Specification for Leadframes for Plastic Molded S.O. PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4865AReapproval of SEMI G28-0997, Specification for Leadframes for Plastic Molded S.O. PackagesPublished 08/19/2011Region of Action- Japan
4866Reapproval of SEMI G30-88, Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4866AReapproval of SEMI G30-88, Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic PackagesPublished 08/26/2011Region of Action- Japan
4868Reapproval of SEMI G38-0996, Test Method for Still - and - Forced - Air Junction -to-Ambient Thermal Resistance Measurements of Integrated Circuit PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4868AReapproval of SEMI G38-0996, Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit PackagesPublished 08/26/2011Region of Action- Japan
4869Reapproval of SEMI G4-0302, Specification for Integrated Circuit Leadframe Materials Used in The Production of Stanmped Leadframes Failed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4869AReapproval of SEMI G4-0302, Specification for Integrated Circuit Leadframe Materials Used in The Production of Stanmped Leadframes Published 08/26/2011Region of Action- Japan
4870AReapproval of SEMI G42-0996, Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor PackagesPublished 08/26/2011Region of Action- Japan
4871Reapproval of SEMI G43-87, Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4871AReapproval of SEMI G43-87, Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic PackagesPublished 08/26/2011Region of Action- Japan
4872Reapproval of SEMI G51-90, Specification for Plastic Molded (METRIC) Quad Flat Pack LeadframesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4872AReapproval of SEMI G51-90, Specification for Plastic Molded (METRIC) Quad Flat Pack LeadframesPublished 08/26/2011Region of Action- Japan
4873Reapproval of SEMI G55-93, Test Method for Measurement of Silver Planting BrightnessFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4873AReapproval of SEMI G55-93, Test Method for Measurement of Silver Plating BrightnessPublished 08/26/2011Region of Action- Japan
4874Reapproval of SEMI G56-93, Test Method for Measurement of Silver Planting ThicknessFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4874AReapproval of SEMI G56-93, Test Method for Measurement of Silver Plating ThicknessPublished 08/26/2011Region of Action- Japan
4876Reapproval of SEMI G29-1296E, Test Method for Trace Contaminants in Molding CompoundsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4876AReapproval of SEMI G29-1296E, Test Method for Trace Contaminants in Molding CompoundsPublished 08/26/2011Region of Action- Japan
4877Reapproval of SEMI G58-94, Specification for Cerquad Package ConstructionsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4877AReapproval of SEMI G58-94, Specification for Cerquad Package ConstructionsPublished 08/26/2011Region of Action- Japan
4878Reapproval of SEMI G59-94, Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the LeadframesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4878AReapproval of SEMI G59-94, Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the LeadframesPublished 08/26/2011Region of Action- Japan
4879Reapproval of SEMI G60-94, Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing MaterialsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4879AReapproval of SEMI G60-94, Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing MaterialsPublished 08/26/2011Region of Action- Japan
4880Reapproval of SEMI G62-95 Test Method for Silver Palting QualityFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4880AReapproval of SEMI G62-95, Test Method for Silver Plating QualityPublished 08/26/2011Region of Action- Japan
4881Reapproval of SEMI G63-95 Test Method for Measurement of Die Shear StrengthFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4881AReapproval of SEMI G63-95, Test Method for Measurement of Die Shear StrengthPublished 08/26/2011Region of Action- Japan
4882Reapproval of SEMI G64-96 Specification for Full-Plated Intergrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) Failed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4882AReapproval of SEMI G64-96, Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) Published 08/26/2011Region of Action- Japan
4883Reapproval of SEMI G65-96 Test Method for Evaluation of Leadframe Materials Used For L-Leaded (GULL WING TYPE) Packages Failed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4883AReapproval of SEMI G65-96, Test Method for Evaluation of Leadframe Materials Used for L-Leaded (GULL WING TYPE) Packages Published 08/26/2011Region of Action- Japan
4884Reapproval of SEMI G66-96 Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding CompoundsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4884AReapproval of SEMI G66-96, Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding CompoundsPublished 08/26/2011Region of Action- Japan
4885Reapproval of SEMI G67-0996 Test Method for the Measurement of Particle Generation from Sheet MaterialsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4885AReapproval of SEMI G67-0996, Test Method for the Measurement of Particle Generation from Sheet MaterialsPublished 08/26/2011Region of Action- Japan
4886Reapproval of SEMI G69-0996 Test Method for Measurement of Adhesive Strength between Leadframes and Molding CompoundsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4886AReapproval of SEMI G69-0996, Test Method for Measurement of Adhesive Strength between Leadframes and Molding CompoundsPublished 08/26/2011Region of Action- Japan
4887Reapproval of SEMI G70-0996 Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package LeadframesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4887AReapproval of SEMI G70-0996, Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package LeadframesPublished 08/26/2011Region of Action- Japan
4888Reapproval of SEMI G71-0996 Specification for Barcode Marking of Intermediate Container for Packaging MaterialsFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4888AReapproval of SEMI G71-0996, Specification for Barcode Marking of Intermediate Container for Packaging MaterialsPublished 08/26/2011Region of Action- Japan
4889Reapproval of SEMI G72-0997 Specification for Ball Grid Array Design LibraryFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4889AReapproval of SEMI G72-0997, Specification for Ball Grid Array Design LibraryPublished 08/26/2011Region of Action- Japan
4890Reapproval of SEMI G73-0997 Test Method for Pull Strength for Wire BondingFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4890AReapproval of SEMI G73-0997, Test Method for Pull Strength for Wire BondingPublished 09/02/2011Region of Action- Japan
4891Reapproval of SEMI G8-94, Test Method for Gold PlantingFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4891AReapproval of SEMI G8-94, Test Method for Gold PlatingPublished 09/02/2011Region of Action- Japan
4892Reapproval of SEMI G86-0303 Test Method for Measurement of Chip (DIE) Strength by Mean of 3-Point BendingFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4892AReapproval of SEMI G86-0303, Test Method for Measurement of Chip (DIE) Strength by Mean of 3-Point BendingPublished 09/02/2011Region of Action- Japan
4894Reapproval of SEMI G68-0996 Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor PackagesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4894AReapproval of SEMI G68-0996, Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor PackagesPublished 09/02/2011Region of Action- Japan
4908Reapproval of SEMI G10-96, Standard Method for Mechanical Measurement of Plastic Package LeadframesFailed Technical Review and Returned to TF 03/18/2010Region of Action- Japan
4908AReapproval of SEMI G10-96, Standard Method for Mechanical Measurement of Plastic Package LeadframesPublished 09/02/2011Region of Action- Japan
4960Reapproval of SEMI G11-88, Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding CompoundsFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4960AReapproval of SEMI G11-88, Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding CompoundsPublished 09/02/2011Region of Action- Japan
4961Reapproval of SEMI G13-88, Standard Test Method for Expansion Characteristics of Molding CompoundsFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4961AReapproval of SEMI G13-88, Standard Test Method for Expansion Characteristics of Molding CompoundsPublished 09/02/2011Region of Action- Japan
4962Reapproval of SEMI G15-93, Standard Test Method for Differential Scanning Calorimetry of Molding CompoundsFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4962AReapproval of SEMI G15-93, Standard Test Method for Differential Scanning Calorimetry of Molding CompoundsPublished 09/02/2011Region of Action- Japan
4963Reapproval of SEMI G32-94, Guideline for Unencapsulated Thermal Test ChipFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4963AReapproval of SEMI G32-94, Guideline for Unencapsulated Thermal Test ChipPublished 09/02/2011Region of Action- Japan
4964Specification for Leadframe Strip SizeFailed Technical Review and Returned to TF 08/06/2010Region of Action- Japan
4964ANew Standard: Specification for Leadframe Strip SizePublished as SEMI G89-0211 01/27/2011Region of Action- Japan
4965New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend ProcessFailed Technical Review and Returned to TF 08/05/2011Region of Action- Japan
4965ANew Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend ProcessFailed Procedural Review - Returned to Committee 02/21/2012Region of Action- Japan
4965BNew Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend ProcessFailed Procedural Review - Returned to Committee 02/21/2012Region of Action- Japan
4965CNew Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in The Backend ProcessPublished as SEMI G95-0613 06/28/2013Region of Action- Japan
5294New Standard: Measurement Method for Solder Sphere Size for Ball Grid Array PackagePublished as SEMI G93-0412 04/27/2012Region of Action- Japan
5295New Standard: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm WaferPublished as SEMI G94-0113 01/25/2013Region of Action- Japan
5636Revision of SEMI G92-0412, Specification for Tape Frame Cassette for 450mm WaferPublished 08/29/2014Region of Action- Japan
5637Revision of SEMI G95-0613, Mechanical Interface Specification for 450mm Load Port for Tape Frame Cassettes in the Backend ProcessPublished 03/14/2014Region of Action- Japan
5691New Standard: Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever BendingPublished as SEMI G96-1014 10/10/2014Region of Action- Japan
5753Reapproval of SEMI G74-0699 (Reapproved 0706) - Specification for Tape Frame for 300 mm WafersPassed Technical Review - Awaiting Procedural Review 09/29/2014Region of Action- Japan
5754Reapproval of SEMI G77-0699 (Reapproved 0706) - Specification for Frame Cassette for 300 mm WafersPassed Technical Review - Awaiting Procedural Review 09/29/2014Region of Action- Japan
5755Reapproval of SEMI G81-0307 Specification for Map Data ItemsPassed Technical Review - Awaiting Procedural Review 09/29/2014Region of Action- Japan
5756Reapproval of SEMI G81.1-0307 - Specification of Grand Concept of Map Data for Characteristics of Dice on SubstratePassed Technical Review - Awaiting Procedural Review 09/29/2014Region of Action- Japan
5757Reapproval of SEMI G87-1108 Specification for Plastic Tape Frame for 300 mm WaferPassed Technical Review - Awaiting Procedural Review 09/29/2014Region of Action- Japan
5780Reapproval of G75-0698 (Reapproved 0706) Standard Test Method of the Properties of Leadframe TapeDrafting 10/22/2014Region of Action- Japan
5781Reapproval of G75.01-0698 (Reapproved 0706)Test Method for Measurement of Ionic Impurities in Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5782Reapproval of G75.02-0698 (Reapproved 0706)Test Method for Measurement of Adhesive Strength of Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5783Reapproval of G75.03-0698 (Reapproved 0706) Test Method for Measurement of The Peel Strength of Protective Film on Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5784Reapproval of G75.04-0698 (Reapproved 0706) Test Method for Measurement of Water Absorption of Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5785Reapproval of G75.05-0698 (Reapproved 0706) Test Method for Measurement of Weight Loss of Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5786Reapproval of G75.06-0698 (Reapproved 0706) Test Method for Measurement of the Shrinkage Factor of Leadframe TapeDrafting 10/22/2014Region of Action- Japan
5787Reapproval of G75.07-0698 (Reapproved 0706) Test Method for Measurement of Thermal Decomposition Temperature of Leadframe Tape and AdhesiveDrafting 10/21/2014Region of Action- Japan
5788Reapproval of G75.08-0698 (Reapproved 0706) Test Method for Measurement of the Coefficient of Thermal Expansion and Glass Transition Temperature of Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5789Reapproval of SEMI G75.9-0698 (Reapproved 0706), Test Method for Measurement of Tensile Strength, Elongation, and Tensile Modulus of Leadframe TapeDrafting 10/22/2014Region of Action- Japan
5790Reapproval of G75.10-0698 (Reapproved 0706) Test Method for Measurement of Volume and Surface Resistivity of the Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5791Reapproval of G75.11-0698 (Reapproved 0706) Test Method for Measurement of the Dielectric Constant and Dissipation Factor of the Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5792Reapproval of G75.12-0698 (Reapproved 0706) Test Method for Measurement of Breakdown Strength of Leadframe TapeDrafting 10/21/2014Region of Action- Japan
5793Reapproval of G75.13-0698 (Reapproved 0706) Test Method for Measurement of the Leakage Current in Leadframe TapeDrafting 10/21/2014Region of Action- Japan