SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

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EH&S

4316MLine Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0715, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision related to Fail-to-safe Equipment Control Systems (FECS)See Line Items Below Region of Action- NA
4316M
LI - 1
Clarification/Improvement of the FECS criteriaPublished 01/29/2016Region of Action- NA
4449FLine Item Revisions to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and LaddersSee Line Items Below Region of Action- NA
4449F
LI - 1
Addition of a Delayed Revisions Section Related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and LaddersPublished 01/29/2016Region of Action- NA
4683HLine Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683H
LI - 1
Delayed Revisions Related to Chemical Exposure CriteriaFailed Technical Review and Returned to TF 04/07/2016Region of Action- NA
4683ILine Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683I
LI - 1
Delayed Revisions Related to Chemical Exposure CriteriaFailed Technical Review and Returned to TF 07/14/2016Region of Action- NA
4683JLine Item Revision to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683J
LI - 1
Revisions to SEMI S2 related to chemical exposurePassed Technical Review - Awaiting Procedural Review 07/27/2016Region of Action- NA
5110
LI - 2
Revision to SEMI S3, Table 3Published 12/20/2011Region of Action- NA
5110
LI - 3
Revisions to SEMI S2 related to Process Liquid HeatingPublished 12/20/2011Region of Action- NA
5556ALine Item Revisions to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Revisions Related to Section 19 Seismic ProtectionSee Line Items Below Region of Action- Japan
5556BLine Item Revisions to SEMI S2-0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Section 19 Seismic ProtectionSee Line Items Below Region of Action- Japan
5556B
LI - 1
Line Item 1 Revision to §19 “Seismic Protection” Part A Revision to “§19 Seismic Protection” Part B Revision to “Related Information 4 Seismic Protection”Published 02/28/2017Region of Action- Japan
5761ANew Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesFailed Technical Review and Returned to TF 07/14/2016Region of Action- NA
5761BNew Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesFailed Technical Review and Returned to TF 11/09/2017Region of Action- NA
5761CNew Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesFailed Technical Review and Returned to TF 04/12/2018Region of Action- NA
5761DNew Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesFailed Technical Review and Returned to TF 11/08/2018Region of Action- NA
5761ENew Standard: Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesPublished as SEMI S30-0719 07/02/2019Region of Action- NA
5875Line Item Revisions to S26-0415: Environmental, Health, and Safety Guideline for FPD Manufacturing SystemSee Line Items Below Region of Action- Japan
5875
LI - 1
Revision Related to Location for Table of Contents Published 05/27/2016Region of Action- Japan
5875
LI - 2
Revision to “Appendix 6” and “Related Information 3” for Non-Ionizing Radiation (other than Laser) and Electromagnetic FieldsPublished 05/27/2016Region of Action- Japan
5892Revision to SEMI S5-0310 With Title Change From: Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves To: Safety Guideline for Sizing and Identifying Flow Limiting Devices for GasesPublished 06/30/2016Region of Action- NA
5917Line Item Revisions to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Addition of reference to a manual material-handling guide in SEMI-S8, Appendix 2, Lifting, Strength, and Materials HandlingSee Line Items Below Region of Action- NA
5917
LI - 1
Add a Definition for “hand-object coupling point” in the Terminology SectionPublished 11/25/2016Region of Action- NA
5917
LI - 2
Add a reference to SEMATECH ISMI Manual Material Handling Application Guide Published 11/25/2016Region of Action- NA
5917
LI - 3
Revisions and additions to hand/arm clearancesFailed Technical Review and Returned to TF 07/14/2016Region of Action- NA
5917
LI - 4
Add a new Related Information section to assist with determining what tasks are within the scope of an assessment to SEMI S8Failed Technical Review and Returned to TF 07/14/2016Region of Action- NA
5917ALine Item Revisions to SEMI S8-1116, Safety Guideline For Ergonomics Engineering Of Semiconductor Manufacturing Equipment (Revisions on Multiple Topics)See Line Items Below Region of Action- NA
5917A
LI - 1
Revisions and additions to hand/arm clearancesPublished 02/23/2018Region of Action- NA
5917A
LI - 2
Add a new Related Information section “Z” to assist with determining what tasks are within the scope of an assessment to SEMI S8Published 02/23/2018Region of Action- NA
5947ARevision to SEMI S23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment. New Scope and Small ChangesPublished 12/07/2016Region of Action- Other
5969Line Item Revisions to SEMI S2-0715, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Fire Protection) See Line Items Below Region of Action- NA
5969
LI - 1
Addition of criteria to determine which method of assessing fire risk is to be used. Failed Technical Review and Returned to TF 04/07/2016Region of Action- NA
5969
LI - 2
Restructuring of portions of Section 14.Published 10/14/2016Region of Action- NA
5969ALine Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (pertaining to Fire) See Line Items Below Region of Action- NA
5969A
LI - 1
Addition of criteria to determine which method of assessing fire risk is to be usedPublished 01/24/2020Region of Action- NA
5969A
LI - 2
Addition of use of the S10 ranking tables in place of the S14 ranking tablesPublished 01/24/2020Region of Action- NA
5970Line Item Revisions to SEMI S14, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
5970
LI - 1
Changes to Terminology to Align with SEMI S10. Failed Procedural Review 05/11/2016Region of Action- NA
5970
LI - 1
Changes to Terminology to Align with SEMI S10. Failed Procedural Review 07/25/2016Region of Action- NA
5970
LI - 2
Change “Grouping” to “Group” to Align with SEMI S10.Published 10/14/2016Region of Action- NA
5970
LI - 3
Changes to Risk Categories to Align with SEMI S10.Published 10/14/2016Region of Action- NA
5972Reapproval of SEMI S19-0311 Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service PersonnelPublished 08/12/2016Region of Action- Japan
6049Line-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation ProcessSee Line Items Below Region of Action- NA
6049
LI - 1
Changes to Appendix 1 Failed Technical Review and Returned to TF 07/13/2017Region of Action- NA
6049
LI - 2
Addition of Related Information 6Failed Technical Review and Returned to TF 07/13/2017Region of Action- NA
6049ALine-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation ProcessSee Line Items Below Region of Action- NA
6049A
LI - 1
Changes pertaining to Severity Groups: People Failed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6049A
LI - 2
Changes pertaining to Severity Groups: EnvironmentFailed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6049A
LI - 3
Changes pertaining to Severity Groups: Equipment/Facility Failed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6049A
LI - 4
Changes pertaining to Likelihood GroupsFailed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6049BLine-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation ProcessSee Line Items Below Region of Action- NA
6049B
LI - 1
Changes to Appendix 1: Changes pertaining to Severity Groups: People Published 11/15/2019Region of Action- NA
6049B
LI - 2
Changes to Appendix 1: Changes pertaining to Severity Groups: Property Failed Technical Review and Returned to TF 07/11/2019Region of Action- NA
6049B
LI - 3
Changes to Appendix 1: Changes pertaining to Severity Groups: Equipment/Facility Failed Technical Review and Returned to TF 07/11/2019Region of Action- NA
6049B
LI - 4
Changes to Appendix 1: Changes pertaining to Likelihood GroupsPublished 11/15/2019Region of Action- NA
6098Reapproval of SEMI S3-1211, Safety Guideline for Process Liquid Heating Systems Published 10/20/2017Region of Action- NA
6171Line Item Revision to SEMI S2-1016, Environmental, Health, and Safety Guideline For Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6171
LI - 1
Revision to Section 23 Related to Oxygen Deficiency Risk AssessmentPublished 08/31/2018Region of Action- NA
6171
LI - 2
Revisions Related to Oxygen Deficiency Assessment CriteriaFailed Technical Review and Returned to TF 07/12/2018Region of Action- NA
6171ALine Item Revision to SEMI S2-0818E, Environmental, Health, and Safety Guideline For Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6171A
LI - 1
Revisions Related to Oxygen Deficiency Assessment CriteriaFailed Technical Review and Returned to TF 11/07/2019Region of Action- NA
6171BLine Item Revision to SEMI S2-1016, Environmental, Health, and Safety Guideline For Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6171B
LI - 1
Revisions Related to Oxygen Deficiency Assessment CriteriaPublished 08/27/2021Region of Action- NA
6172Line Item Revision to SEMI S14-1016: Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment (To correct nonconforming title)See Line Items Below Region of Action- NA
6172
LI - 1
Correct title and concomitant textsFailed Procedural Review 05/17/2017Region of Action- NA
6172ALine item revision to SEMI S14-1016: Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment to correct nonconforming titleSee Line Items Below Region of Action- NA
6172A
LI - 1
Correct title for conformanceFailed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6204Line Item Revisions to SEMI S6-0707E With Title Change To: Environmental, Health, and Safety Guideline for Exhaust Ventilation of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
6204
LI - 1
Title change to align with procedure manualPublished 06/08/2018Region of Action- NA
6204
LI - 2
Add Table of Contents and remove list of sections from scope sectionPublished 06/08/2018Region of Action- NA
6204
LI - 3
Update retroactive clause to refer to more versions than S6-93 and align with S2 revisionPublished 06/08/2018Region of Action- NA
6204
LI - 4
Clean up some references to other documentsPublished 06/08/2018Region of Action- NA
6288Line Item Revision to SEMI S21-1106E (Reapproved 0612): Safety Guideline for Worker ProtectionSee Line Items Below Region of Action- Japan
6288
LI - 1
Addition of Table of Contents, and Removal of the list of section numbers and titles from section 2 and add a NOTE to explain replacement and relocation of the list.Published 08/31/2018Region of Action- Japan
6289Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS with title change to ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDSPublished 08/31/2018Region of Action- Japan
6310Reapproval of SEMI S28-1011 Safety Guideline for Robots and Load Ports Intended for Use in Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 04/12/2018Region of Action- NA
6354Line Item Revision to SEMI S2-0818, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6354
LI - 1
Delayed Revisions related to High Pressure Gas Safety Failed Technical Review and Returned to TF 11/08/2018Region of Action- NA
6366Line Item Revision SEMI S2-1016b Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revision to Delayed Revision 2 on Anchorage)See Line Items Below Region of Action- NA
6366
LI - 1
Revision to Delayed Revision 2 on AnchorageFailed Technical Review and Returned to TF 07/12/2018Region of Action- NA
6366ALine Item Revision SEMI S2-0818E Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision to Fall Protection Criteria)See Line Items Below Region of Action- NA
6366A
LI - 1
Delayed Revision to Fall Protection CriteriaDrafting 02/08/2019Region of Action- NA
6372Line Item Revision SEMI S2-1016b Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revision to Delayed Revision 3 on Seismic)See Line Items Below Region of Action- NA
6372
LI - 1
Delete the exception to section 19.1.2Failed Technical Review and Returned to TF 07/12/2018Region of Action- NA
6372
LI - 2
Delete the exception to section 19.1.3 Published 08/31/2018Region of Action- NA
6372
LI - 3
Replace “facilities” with “utilities” in section 19.1.5 Published 08/31/2018Region of Action- NA
6372
LI - 4
Modifications to section 19.4 Published 08/31/2018Region of Action- NA
6392Line Item Revision to SEMI S17-0113 "Safety Guideline for Unmanned Transport Vehicle (UTV) Systems"See Line Items Below Region of Action- Japan
6392
LI - 1
Revision Related to Location for Table of ContentsPublished 03/29/2019Region of Action- Japan
6393Line Item Revision to SEMI S25-0213 "Safety Guideline for Hydrogen Peroxide Storage and Handling Systems"See Line Items Below Region of Action- Europe
6393
LI - 1
Revision Related to Location for Table of ContentsPublished 03/29/2019Region of Action- Japan
6439New Standard: Practice For Restricting The Use Of PFOA, Its Related Compounds, Or Their SaltsFailed Technical Review and Returned to TF 12/17/2020Region of Action- NA
6453Reapproval of SEMI S13-0113 “Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use With Manufacturing Equipment”Published 08/02/2019Region of Action- Japan
6515Line Item Revision of SEMI S23-1216 - Guide for Energy, Utilities, and Materials Use Efficiency of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
6515
LI - 1
Changes related to process cooling water.Published 10/22/2021Region of Action- NA
6551Line Item Revision to SEMI S2-0818E Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment ( Re: Delayed Revision on Mechanical Design, Hinged Load Assembly)See Line Items Below Region of Action- NA
6551
LI - 1
Deletion of criteria titled Subsequently Produced Lifting Equipment as noted in Section 18.7.5 in its entirety. Failed Technical Review and Returned to TF 11/07/2019Region of Action- NA
6593Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment ( Section 18 Mechanical Design)See Line Items Below Region of Action- NA
6593
LI - 1
Revision to section 18.7.5Published 04/30/2021Region of Action- NA
6594Line Item Revision to SEMI S14-1016: Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment (Risk Ranking Criteria and Title)See Line Items Below Region of Action- NA
6594
LI - 1
Changes to Title and Concomitant textPublished 05/13/2021Region of Action- NA
6594
LI - 2
Changes to Risk Assessment CriteriaPublished 05/13/2021Region of Action- NA
6651Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Addition of Pressure section)See Line Items Below Region of Action- NA
6651
LI - 1
Delayed Revision Related to Pressure SystemFailed Technical Review and Returned to TF 11/15/2020Region of Action- NA
6651ALine Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Addition of Pressure section)See Line Items Below Region of Action- NA
6651A
LI - 1
Delayed Revision Related to Pressure SystemFailed Technical Review and Returned to TF 05/06/2021Region of Action- NA
6651BLine Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Delayed Revision Related to Pressure Systems)See Line Items Below Region of Action- NA
6651B
LI - 1
Delayed Revision Related to Pressure SystemFailed Technical Review and Returned to TF 12/09/2021Region of Action- NA
6651CLine Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Delayed Revision Related to Pressure Systems)See Line Items Below Region of Action- NA
6651C
LI - 1
Delayed Revision Related to Pressure SystemPublished 03/24/2023Region of Action- NA
6696Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Delayed Revision Related to Sections 18.6.3 and 18.7.5)See Line Items Below Region of Action- NA
6696
LI - 1
Delayed Revisions related to Sections 18.6 and 18.7Published 08/27/2021Region of Action- NA
6776Reapproval of SEMI S19-0311 (Reapproved 0816): Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service PersonnelFailed Technical Review and Returned to TF 08/26/2021Region of Action- Japan
6777Reapproval of SEMI S26-0516: Environmental, Health, and Safety Guideline for FPD Manufacturing SystemDrafting 05/25/2021Region of Action- Japan
6781Line Item Revision of SEMI S5 - Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gases See Line Items Below Region of Action- NA
6781
LI - 1
Clarification of a NOTE in the Scope sectionPublished 11/29/2021Region of Action- NA
6781
LI - 2
Editting §3 for ClarityPublished 11/29/2021Region of Action- NA
6781
LI - 3
Updating the Address of NFPA in a footnote.Published 11/29/2021Region of Action- NA
6781
LI - 4
Updating the URL for GHS in a NOTEPublished 11/29/2021Region of Action- NA
6781
LI - 5
Editting §6 for Clarity and for Conformance to SEMI Style ManualPublished 11/29/2021Region of Action- NA
6781
LI - 6
Editting Table 1 Headers and ¶¶7.3, 7.4, 7.5 for ClarityPublished 11/29/2021Region of Action- NA
6781
LI - 7
Editting ¶8.1, the Headers of Table 3, ¶8.2.2 and two NOTEs for Clarity and for Conformance to SEMI Style Manual Published 11/29/2021Region of Action- NA
6781
LI - 8
Updating the Address of CGA in a Footnote.Published 11/29/2021Region of Action- NA
6781
LI - 9
Adding Data to Table R1-1Published 11/29/2021Region of Action- NA
6822Reapproval of SEMI S12-0211E - Environmental, Health and Safety Guideline for Manufacturing Equipment DecontaminationFailed Technical Review and Returned to TF 12/09/2021Region of Action- NA
6823Reapproval of SEMI S7 - Safety Guideline for Evaluating Personnel and Evaluating Company QualificationsFailed Technical Review and Returned to TF 12/09/2021Region of Action- NA
6831Revision to SEMI S1-1015 Safety Guideline for Equipment Safety LabelsFailed Technical Review and Returned to TF 12/09/2021Region of Action- NA
6831ARevision to SEMI S1-1015 Safety Guideline for Equipment Safety LabelsFailed Technical Review and Returned to TF 03/31/2022Region of Action- NA
6831BRevision to SEMI S1-1015 Safety Guideline for Equipment Safety LabelsFailed Technical Review and Returned to TF 07/14/2022Region of Action- NA
6831CRevision to SEMI S1-1015 Safety Guideline for Equipment Safety LabelsPublished 09/14/2023Region of Action- NA
6884Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions related to lifting equipment and hinged loads (§§ 5, 18.6, and 18.7))See Line Items Below Region of Action- NA
6884
LI - 1
Delayed Revisions related to lifting equipment and hinged loads (§§ 5, 18.6, and 18.7))Failed Technical Review and Returned to TF 07/14/2022Region of Action- NA
6884ALine Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
6884A
LI - 1
Delayed Revisions related to lifting equipment and hinged loads (§§ 5.2, 18.6, and 18.7)Failed Technical Review and Returned to TF 07/13/2023Region of Action- NA
6884BLine Item Revision to SEMI S2-0821Eb, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
6884B
LI - 1
Delayed Revisions related to lifting equipment and hinged loads (§§ 5.2, 18.6, and 18.7)Failed Technical Review and Returned to TF 11/09/2023Region of Action- NA
6885Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision Related to the Invocation of SEMI S12)See Line Items Below Region of Action- NA
6885
LI - 1
Delayed Revision Related to the Invocation of SEMI S12Failed Technical Review and Returned to TF 03/31/2022Region of Action- NA
6885ALine Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision Related to Equipment Decommissioning)See Line Items Below Region of Action- NA
6885A
LI - 1
Add Delayed Revision Section X to SEMI S02-0821Published 03/24/2023Region of Action- NA
6887Revision to SEMI S10-1119, Safety Guideline for Risk Assessment and Risk Evaluation ProcessFailed Technical Review and Returned to TF 03/31/2022Region of Action- NA
6887ARevision to SEMI S10-1119, Safety Guideline for Risk Assessment and Risk Evaluation ProcessPublished 04/13/2023Region of Action- NA
6888Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment DecontaminationFailed Technical Review and Returned to TF 03/31/2022Region of Action- NA
6909Withdrawal of SEMI S26 Environmental, Health, and Safety Guideline for FPD Manufacturing SystemPublished 01/13/2023Region of Action- Japan
6910Revision of SEMI S19-0311 (Reapproved 0816), Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service PersonnelPublished 02/28/2023Region of Action- Japan
6940Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision Related to the Invocation of SEMI S18 (Flammable Silicon Compounds) and S30 (Energetic Materials))See Line Items Below Region of Action- NA
6940
LI - 1
Add Delayed Revision Section X to SEMI S02-0821Failed Technical Review and Returned to TF 11/10/2022Region of Action- NA
6940
LI - 2
Add Delayed Revision Section Y to SEMI S02-0821Drafting 07/27/2022Region of Action- NA
6940ALine Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions Related to Mention of SEMI S18 and the Invocation of SEMI S30)See Line Items Below Region of Action- NA
6940A
LI - 1
Add Delayed Revision Section X to SEMI S02-0821Published 08/31/2023Region of Action- NA
6940A
LI - 2
Add Delayed Revision Section Y to SEMI S02-0821Published 08/31/2023Region of Action- NA
6941Line Item Revision to SEMI S30-0719E, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes (regarding heating of piping) See Line Items Below Region of Action- NA
6941
LI - 1
Add section 8.13 and modify paragraph 17.3.3Failed Technical Review and Returned to TF 11/10/2022Region of Action- NA
6941
LI - 2
Adding, as ¶17.8.8, criteria specific to managing the risks of loss of heating downstream of process chambers. Failed Technical Review and Returned to TF 11/10/2022Region of Action- NA
6941ALine Item Revision to SEMI S30-0719E, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes (regarding heating of piping) See Line Items Below Region of Action- NA
6941A
LI - 1
Modify sections 5, 8 and 17.3.3.Drafting 02/02/2023Region of Action- NA
6941A
LI - 2
Adding, as ¶17.8.8, criteria specific to managing the risks of loss of heating downstream of process chambers. Drafting 02/02/2023Region of Action- NA
6944Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions Related to Fire Protection)See Line Items Below Region of Action- NA
6944
LI - 1
Add Delayed Revision Section X to SEMI S02-0821Failed Technical Review and Returned to TF 11/10/2022Region of Action- NA
6944
LI - 2
Add Delayed Revision Section Y to SEMI S02-0821Failed Technical Review and Returned to TF 11/10/2022Region of Action- NA
6944ALine Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions Related to Fire Protection)See Line Items Below Region of Action- NA
6944A
LI - 1
Add Delayed Revision Section X to SEMI S02-0821Published 08/31/2023Region of Action- NA
6944A
LI - 2
Add Delayed Revision Section Y to SEMI S02-0821Published 08/31/2023Region of Action- NA
6980Line Item Revisions to SEMI S2-0821Eb, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision Related to Flammable Substances)See Line Items Below Region of Action- NA
6980
LI - 1
Delayed Revision Related to Flammable SubstancesDrafting 02/07/2024Region of Action- NA
7022Line Item Revision to SEMI S30-0719E, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing ProcessesSee Line Items Below Region of Action- NA
7022
LI - 1
Enhancing guidance on overtemperature and undertemperature risk management.Published 10/20/2023Region of Action- NA
7022
LI - 2
Adding, as ¶17.8.8, criteria specific to managing the risks of loss of heating downstream of process chambers.Published 10/20/2023Region of Action- NA
7022
LI - 3
Improving the alignment of the Safety Guideline’s text with the Energetic Materials TF’s understanding of what criteria apply to which substancesPublished 10/20/2023Region of Action- NA
7023Reapproval of SEMI S6-0618, Environmental, Health, And Safety Guideline For Exhaust Ventilation Of Semiconductor Manufacturing Equipment Failed Technical Review and Returned to TF 07/13/2023Region of Action- NA
7028Reapproval of SEMI S21-0818, Safety Guideline for Worker ProtectionFailed Technical Review and Returned to TF 09/07/2023Region of Action- Japan
7108Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (labels)See Line Items Below Region of Action- NA
7108
LI - 1
Delayed Revision Related to Safety LabelsFailed Technical Review and Returned to TF 11/06/2023Region of Action- NA
7108ALine Item Revision to SEMI S2-0821Eb, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision Related to Safety Labels)See Line Items Below Region of Action- NA
7108A
LI - 1
Delayed Revision Related to Safety LabelsDrafting 11/06/2023Region of Action- NA
7109 Line Item Revisions to SEMI S1-0923, S2-0821Eb, and S30 -0719E (Delayed Revisions Related to Risks)See Line Items Below Region of Action- NA
7109
LI - 1
Delayed Revisions Related to RiskPublished 02/09/2024Region of Action- NA
7134Revision to SEMI S8-0218, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment Drafting 02/13/2024Region of Action- NA
7158Line Item Revision to SEMI S2-0821Eb, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revisions related to lifting equipment and hinged loads (§§ 5.2, 18))See Line Items Below Region of Action- NA
7158
LI - 1
Delayed Revisions related to lifting equipment and hinged loads (§§ 5.2, 18.6)Drafting 02/01/2024Region of Action- NA
7159Reapproal of SEMI S25-0319, Safety Guideline for Hydrogen Peroxide Storage & Handling SystemsDrafting 01/17/2024Region of Action- NA
R4683JRevisions to SEMI S2 related to chemical exposurePublished 03/24/2017Region of Action- NA
R5556BLine Item Revisions to SEMI S2-0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Revisions Related to Section 19 Seismic ProtectionPublished 02/28/2017Region of Action- Japan
R5917ALine Item Revisions to SEMI S8-1116, Safety Guideline For Ergonomics Engineering Of Semiconductor Manufacturing Equipment (Revisions and Additions to Hand/Arm Clearances)See Line Items Below Region of Action- NA
R5917A
LI - 1
Revisions and additions to hand/arm clearancesPublished 02/23/2018Region of Action- NA
R5947ARevision to SEMI S23, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment. New Scope and Small ChangesPublished 12/07/2016Region of Action- Other
R6204Line Item Revision to SEMI S6-0707E - Environmental, Health, And Safety Guideline For Exhaust Ventilation Of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
R6204
LI - 1
Changes to section 3.7.1Published 06/08/2018Region of Action- NA
R6593Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Delayed Revision related to Mechanical Design, Hinged Load Assembly)See Line Items Below Region of Action- NA
R6593
LI - 1
Delayed Revision related to Section 18.7.5Published 04/30/2021Region of Action- NA
R6651CLine Item Revision to SEMI S2-0821 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Delayed Revision Related to Pressure Guideline)See Line Items Below Region of Action- NA
R6651C
LI - 1
Delayed Revision Related to Pressure SystemsPublished 03/24/2023Region of Action- NA
R6831CRevision to SEMI S1-1015 Safety Guideline for Equipment Safety LabelsPublished 09/14/2023Region of Action- NA
R6887ARevision to SEMI S10-1119, Safety Guideline for Risk Assessment and Risk Evaluation ProcessPublished 04/13/2023Region of Action- NA