SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

Use the pull-down menu below to browse a particular committee.


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EH&S

3560ANew Safety Guideline: Safety Guideline for Semiconductor Manufacturing Equipment Robots, Automation, and Load PortsDrafting 02/16/2005Region of Action- NA
3560LNew Safety Guideline: Safety Guideline for Semiconductor Manufacturing Equipment Robots, Automation, and Load PortsFailed Technical Review and Returned to TF 07/16/2009Region of Action- NA
3560MNew Safety Guideline: Safety Guideline for Robots and Load Ports Intended for Use in Semiconductor Manufacturing EquipmentPublished as SEMI S28-1011 10/07/2011Region of Action- NA
4196Revision to SEMI S24-0705, Safety Guideline for Multi-employer Work AreasSee Line Items Below Region of Action- Japan
4316F
LI - 5
Drafting 12/29/2009Region of Action- NA
4316GDelayed Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-1110, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Line Item Changes to SEMI S2 and SEMI S22 (In Delayed Effective Date Format)See Line Items Below Region of Action- NA
4316G
LI - 1
Revisions related to AC enclosure openingsPublished 01/27/2011Region of Action- NA
4316G
LI - 2
Revisions related to fail-to-safe equipment control systemsFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4316G
LI - 3
Revisions related to the definition of accredited testing laboratoryPublished 01/27/2011Region of Action- NA
4316HLine Item Revision to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-1110, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Delayed Revision Related to Safe Electrical DesignSee Line Items Below Region of Action- NA
4316H
LI - 1
Fail-to-Safe Equipment Control Systems RevisionFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4316ILine Item Revision to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0712, Safety Guideline for the Electrical Design of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
4316I
LI - 1
Fail-to-safe Equipment Control Systems RevisionFailed Technical Review and Returned to TF 04/04/2013Region of Action- NA
4316JLine Item Revision to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0712, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision Related to Programmable Safety CircuitsSee Line Items Below Region of Action- NA
4316J
LI - 1
Fail-to-safe Equipment Control Systems RevisionFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
4316KLine Item Revision to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22-0712a, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment. Delayed Revision on Multiple TopicsSee Line Items Below Region of Action- NA
4316K
LI - 1
Improvements to the FECS criteriaFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
4316K
LI - 2
Allowing additional flexibility to the UPS disconnect criteriaFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
4316K
LI - 3
Allowing an alternate grounding methodology from IEC 60204-33 and has been found to be useful with larger equipmentFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
4327BRevision to SEMI S17-0701: Safety Guideline for Unmanned Transport Vehicle (UTV) SystemsFailed Technical Review and Returned to TF 04/14/2009Region of Action- Japan
4327CRevision to SEMI S17-0701: Safety Guideline for Unmanned Transport Vehicles (UTV) SystemFailed Technical Review and Returned to TF 09/17/2009Region of Action- Japan
4327DRevision to SEMI S17-0701: Safety Guideline for Unmanned Transport Vehicles (UTV) SystemFailed Technical Review and Returned to TF 04/15/2010Region of Action- Japan
4327ERevision to SEMI S17-0701, Safety Guideline for Unmanned Transport Vehicle (UTV) SystemFailed Technical Review and Returned to TF 09/16/2010Region of Action- Japan
4327FRevision to SEMI S17-0701, Safety Guideline for Unmanned Transport Vehicle (UTV) SystemPublished 04/08/2011Region of Action- Japan
4399BRevision to S23-0705: Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- Japan
4400ARevision to SEMI S18-1102: Environmental, Health and Safety Guideline for Silane Family Gases Handling with title change to “Environmental, Health and Safety Guideline for Flammable Silicon Compounds”Failed Technical Review and Returned to TF 09/16/2010Region of Action- Japan
4400BRevision to SEMI S18-1102: Environmental, Health and Safety Guideline for Silane Family Gases Handling with title change to “Environmental, Health and Safety Guideline for Flammable Silicon Compounds”Failed Technical Review and Returned to TF 04/19/2011Region of Action- Japan
4400CRevision to SEMI S18-1102: Environmental, Health and Safety Guideline for Silane Family Gases Handling with title change to “Environmental, Health and Safety Guideline for Flammable Silicon Compounds”Published 03/09/2012Region of Action- Japan
4449
LI - 1
Provisions related to elevated workDrafting 02/12/2009Region of Action- NA
4449
LI - 2
To be deleted laterDrafting 02/12/2009Region of Action- NA
4449A
LI - 1
Revisions related to elevated workDrafting 11/09/2009Region of Action- NA
4449BDelayed Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
4449B
LI - 1
Delayed revisions related to platforms, stairs, ladders, and elevated locationsFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4449B
LI - 2
Delayed Revisions related to removal of burrs and sharp edgesFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4449CDelayed Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Line Item Revisions related to Work at Elevated Locations and to Removal of Burrs and Sharp EdgesSee Line Items Below Region of Action- NA
4449C
LI - 1
Provisions for work at elevated locationsFailed Technical Review and Returned to TF 10/27/2011Region of Action- NA
4449C
LI - 2
General safety precaution concerning the removal of burrs and sharp edgesPublished 02/24/2012Region of Action- NA
4449DDelayed Line Item Revision to SEMI S2-0712, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Line Item Revisions related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and LaddersSee Line Items Below Region of Action- NA
4449D
LI - 1
Addition of a Delayed Revisions Section Related to Work at Elevated Locations, and Design Criteria for Platforms, Steps, and LaddersFailed Technical Review and Returned to TF 11/01/2012Region of Action- NA
4574ALine Item Changes to SEMI S2Drafting 08/03/2009Region of Action- NA
4605CDelayed Line Item Revisions to SEMI S22-1110, Safety Guideline for the Electrical Design of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
4605C
LI - 1
Delayed revisions related to plug and socket connectionsFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4605C
LI - 2
Delayed revisions related to creepage and clearanceFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4605C
LI - 3
Delayed revisions related to transformer tablesPublished 01/27/2011Region of Action- NA
4605C
LI - 4
Delayed revisions related to transformer impedancePublished 01/27/2011Region of Action- NA
4605DLine Item Revisions to SEMI S22-1110, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Delayed Revisions on Multiple TopicsSee Line Items Below Region of Action- NA
4605D
LI - 1
Creepage and Clearance ClarificationFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4605D
LI - 2
Electrical Shock vs. BurnPublished 06/03/2011Region of Action- NA
4605D
LI - 3
Transformer Impedance Test MethodPublished 06/03/2011Region of Action- NA
4605D
LI - 4
Ampacity Tables RevisionFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4605ELine Item Revisions to SEMI S22-1110, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Delayed Revisions on Multiple TopicsSee Line Items Below Region of Action- NA
4605E
LI - 1
Clarification of the creepage and clearance materialPublished 03/22/2012Region of Action- NA
4605E
LI - 2
Clarification of Ampacity TablesPublished 03/22/2012Region of Action- NA
4616Revision to S26-0308, Environmental, Health, and Safety Guideline for FPD Manufacturing SystemSee Line Items Below Region of Action- Japan
4616
LI - 1
Revision to the scope of lifting equipmentPublished 1/28/2009Region of Action- Japan
4616
LI - 2
Update of “Referenced Standards and Documents Published 1/28/2009Region of Action- Japan
4625BLine Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revisions related to ventilation)Drafting 04/02/2009Region of Action- NA
4683Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683
LI - 1
Chemical Exposure CriteriaFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4683
LI - 2
OEL ClarificationFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4683
LI - 3
Fire Risk Within an EnclosureFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4683ALine Item Revisions to SEMI S2-0310e, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683A
LI - 1
Chemical Exposure CriteriaFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
4683A
LI - 2
OEL ClarificationFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
4683A
LI - 3
Change to applied OEL percentage for normal, maintenance and fault conditionsFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
4683BLine Item Revisions to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical Exposure CriteriaSee Line Items Below Region of Action- NA
4683B
LI - 1
Delayed Revisions Related to Chemical Exposure CriteriaFailed Technical Review and Returned to TF 04/04/2013Region of Action- NA
4683CLine Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683C
LI - 1
Added explanatory materials for valid air sampling and measurement methods and accredited laboratoriesFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
4683C
LI - 2
Added suggested clarification on reporting of sampling related to 23.5Failed Technical Review and Returned to TF 07/10/2014Region of Action- NA
4683DLine Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Chemical ExposureSee Line Items Below Region of Action- NA
4683D
LI - 1
Add explanatory materials for valid air sampling and measurement methods and accredited laboratoriesDrafting 08/19/2014Region of Action- NA
4683D
LI - 2
Clarify the reporting criteriaDrafting 08/19/2014Region of Action- NA
4712New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and ReductionFailed Technical Review and Returned to TF 09/26/2011Region of Action- Japan
4712ANew Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and ReductionFailed Technical Review and Returned to TF 12/09/2011Region of Action- Japan
4712BNew Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and ReductionPublished as SEMI S29-0712 07/20/2012Region of Action- Japan
4773Line Item Revisions to SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment Revisions related to Short Circuit Current RatingsPublished 09/09/2010Region of Action- NA
4774Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to Non-Ionizing Radiation See Line Items Below Region of Action- NA
4774
LI - 1
Section 25 Reference and Appendix 4 Introductory Material CleanupFailed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4774
LI - 2
Revise Static Magnetic Field CriteriaPublished 06/03/2011Region of Action- NA
4774
LI - 3
Revise Sub-Radio-Frequency Field CriteriaPublished 06/03/2011Region of Action- NA
4774
LI - 4
Revision to Induced and Contact Current criteria in Table A4-1Published 06/03/2011Region of Action- NA
4774
LI - 5
Revision of RF Field Criteria in Appendix 4Published 06/03/2011Region of Action- NA
4774
LI - 6
Revision of Optical Radiation Criteria in Appendix 4Failed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4774ALine Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to Non-Ionizing RadiationSee Line Items Below Region of Action- NA
4774A
LI - 1
Section 25 Reference and Appendix 4 Introductory Material CleanupFailed Technical Review and Returned to TF 07/14/2011Region of Action- NA
4774A
LI - 2
Revision of Optical Radiation Criteria in Appendix 4Failed Technical Review and Returned to TF 07/14/2011Region of Action- NA
4774A
LI - 3
Revision of Static Magnetic Radiation Criteria in Appendix 4Failed Technical Review and Returned to TF 07/14/2011Region of Action- NA
4774BLine Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Non-Ionizing RadiationSee Line Items Below Region of Action- NA
4774B
LI - 1
Section 25 Reference and Appendix 4 Introductory Material CleanupPublished 02/24/2012Region of Action- NA
4774B
LI - 2
Revision of Static Magnetic Radiation Criteria in Appendix 4Published 02/24/2012Region of Action- NA
4910Reapproval of SEMI S13-0305, Safety Guideline for Operation and Maintenance Manuals used with Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 04/15/2010Region of Action- Japan
4930Rewrite of SEMI E34-95, Guideline for Mass Flow Device Return, with title change to: Safety Guideline for Mass Flow Device Removal and ShipmentPublished 10/25/2010Region of Action- NA
4931Revision to SEMI S7-0310, Safety Guideline for Evaluation Personnel and Evaluating Company QualificationsSee Line Items Below Region of Action- NA
4931
LI - 1
Addition of content related to business continuity plansFailed Technical Review and Returned to TF 11/11/2010Region of Action- NA
4931ALine Item Revision of SEMI S7-0310, Safety Guideline for Evaluation Personnel and Evaluating Company QualificationsSee Line Items Below Region of Action- NA
4931A
LI - 1
Changes to section 7.2 and Table R1-1Failed Technical Review and Returned to TF 03/31/2011Region of Action- NA
4952Removal of SEMI E20-0697, Cluster Tool Module Interface: Electrical Power and Emergency Off StandardPublished 10/07/2010Region of Action- NA
4966New Auxiliary Information: S2 Mapping into the Machinery Directive (2006/42/EC) Essential Health and Safety RequirementsPublication Process Started 08/25/2014Region of Action- NA
4976Revision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 09/16/2010Region of Action- Japan
4976ARevision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 12/09/2011Region of Action- Japan
4976BRevision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment with title change to: Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for use with Manufacturing EquipmentFailed Technical Review and Returned to TF 04/19/2012Region of Action- Japan
4976CRevision to SEMI S13-0305, Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment with Title Change to: Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Manufacturing EquipmentPublished 01/31/2013Region of Action- Japan
4977Line Item Revision to SEMI S23-0708, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- Japan
4977
LI - 1
Addition of the Related Information 2Failed Technical Review and Returned to TF 09/16/2010Region of Action- Japan
4977ALine Item Revision to SEMI S23-0708, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- Japan
4977A
LI - 1
Addition of Related Information 2Published 03/30/2011Region of Action- Japan
4977A
LI - 2
Addition of a definition and guidance on metrics for an equipment sleep modePublished 03/30/2011Region of Action- Japan
4977A
LI - 3
Addition of a definition and guidance on metrics for an equipment hibernation modeFailed Technical Review and Returned to TF 12/03/2010Region of Action- Japan
4977A
LI - 4
Alignment of terminology regarding idle mode and process modePublished 03/30/2011Region of Action- Japan
4978Line Item Revision to SEMI S26-0709, Environmental, Health, and Safety Guideline for FPD Manufacturing SystemSee Line Items Below Region of Action- Japan
4978
LI - 1
Update of Referenced Standards and DocumentsPublished 04/18/2011Region of Action- Japan
4978
LI - 2
Revision to 8 “Evaluation for Design Review and Inspection”Failed Technical Review and Returned to TF 12/03/2010Region of Action- Japan
4978
LI - 3
Revision to “Lifting Equipment” and “Mechanisms Supporting and Moving Hinged Loads” in 18 “Mechanical Design”Published 04/18/2011Region of Action- Japan
4978
LI - 4
Revision to “Exhaust Ventilation”Failed Technical Review and Returned to TF 12/03/2010Region of Action- Japan
4978
LI - 5
Editorial Changes Including Deletion of UnderlinesPublished 04/18/2011Region of Action- Japan
4978ALine Item Revision to SEMI S26-0709, Environmental, Health, and Safety Guideline for FPD Manufacturing SystemSee Line Items Below Region of Action- Japan
4978A
LI - 1
Revision to S26, 8 “Evaluation for Design Review and Inspection”Published 08/26/2011Region of Action- Japan
5000Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Addition of Related Information: Selection of Interlock ReliabilityFailed Technical Review and Returned to TF 04/05/2012Region of Action- NA
5000ADelayed Revisions to SEMI S2-0310e, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Addition of Related Information to S2: Selection of Interlock ReliabilityFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5000BDelayed Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Addition of Related Information to S2: Selection of Interlock ReliabilityFailed Technical Review and Returned to TF 11/01/2012Region of Action- NA
5000CLine Item Revisions to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Addition of Related Information to S2: Selection of Interlock Reliability (In Delayed Effective Date Format)See Line Items Below Region of Action- NA
5000C
LI - 1
Addition of Related Information to S2: Selection of Interlock Reliability (In Delayed Effective Date Format)Published 11/15/2013Region of Action- NA
5001Withdrawal of SEMI S9-0307, Guide to Electrical Design Verification Tests for Semiconductor Manufacturing Equipment that have been moved to SEMI S22Published 02/28/2011Region of Action- NA
5007Reaproval of SEMI S3-0306, Safety Guidelines for Process Liquid Heating System Failed Technical Review and Returned to TF 11/11/2010Region of Action- NA
5008Revision to SEMI S12-0309, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination See Line Items Below Region of Action- NA
5008
LI - 1
Changes to 5.2.14Published 02/28/2011Region of Action- NA
5008
LI - 2
Changes to 8.1.4Published 02/28/2011Region of Action- NA
5009Delayed Line Items Revisions to SEMI S8-0308E, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
5009
LI - 1
Delayed Revisions 1 (Effective July 2012) Add Definition for Hand-Object Coupling Failed Technical Review and Returned to TF 04/05/2012Region of Action- NA
5009
LI - 10
Delayed Revisions 10 (Effective July 2012) Update Related Information 1-2, “Neutral and Awkward Postures”Published 07/31/2012Region of Action- NA
5009
LI - 2
Delayed Revisions 2 (Effective July 2012) Addition of Pictograms to Appendix 1 SESC Checklist Published 07/31/2012Region of Action- NA
5009
LI - 3
Delayed Revisions 3 (Effective July 2012) Change Pliers Handle Criteria to “Squeeze Handle” CriteriaPublished 07/31/2012Region of Action- NA
5009
LI - 4
Delayed Revisions 4 (Effective July 2012) Add Design Criteria to SESC, Section 7, “Full Body Clearance”Failed Technical Review and Returned to TF 04/05/2012Region of Action- NA
5009
LI - 5
Delayed Revisions 5 (Effective July 2012) Change Recommendations for Laterally Offset DisplayPublished 07/31/2012Region of Action- NA
5009
LI - 6
Delayed Revisions 6 (Effective July 2012) Change Display RecommendationsPublished 07/31/2012Region of Action- NA
5009
LI - 7
Delayed Revisions 7 (Effective July 2012) Change Display RecommendationsPublished 07/31/2012Region of Action- NA
5009
LI - 8
Delayed Revisions 8 (Effective July 2012) Add Criteria for Critical Controls on EquipmentFailed Technical Review and Returned to TF 04/05/2012Region of Action- NA
5009
LI - 9
Delayed Revisions 9 (Effective July 2012) Add Work Surface Thickness CriteriaPublished 07/31/2012Region of Action- NA
5009ALine Item Revisions to SEMI S8-0308E, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Delayed revisions related to the SESC checklistSee Line Items Below Region of Action- NA
5009A
LI - 1
Modify Appendix 1, SESC checklist to expand whole body clearance criteria to include equipment operation tasks and provide criteria for additional posturesFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5009A
LI - 2
Modify Appendix 1, SESC checklist to add design criteria for hand and arm clearances which provide guidance for clearances when a variety of hand tools are used and objects are handledFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5009A
LI - 3
Modify Appendix 1, SESC checklist to add provisions for controls on equipment lower than 838 mm (33 in.) and placement of controls outside of recommended reach ranges for postures other standing or sitting adopted during maintenance and service tasksFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5009BLine Item Revisions to SEMI S8-0712, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Delayed Revisions on Multiple TopicsSee Line Items Below Region of Action- NA
5009B
LI - 1
Changes to Terminology for Critical Controls and DisplaysPublished 02/14/2014Region of Action- NA
5009B
LI - 2
Ergonomic Clearances ClarificationFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5009B
LI - 3
Changes to Appendix 1: “Actual/Conforms?” Column ModificationsPublished 02/14/2014Region of Action- NA
5009B
LI - 4
Changes to Appendix 1, 6.4.1: Ball Handle Minimum DiameterPublished 02/14/2014Region of Action- NA
5009B
LI - 5
Changes to Appendix 1, 7: New Whole Body Clearance Criteria and Movement of Select Criteria to a New Maintenance and Service SectionFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5009B
LI - 6
Changes to Appendix 1, 9: Hand Control Location ApplicationsPublished 02/14/2014Region of Action- NA
5009B
LI - 7
Changes to Appendix 1, 9.1: Hand Control Location Pictogram AdditionPublished 02/14/2014Region of Action- NA
5009CLine Item Revisions to SEMI S8-0712a, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment. Delayed Revisions on Multiple TopicsSee Line Items Below Region of Action- NA
5009C
LI - 1
Ergonomic clearances clarification. These changes are intended to better define ergonomics-related clearances for equipment design and installationFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5009C
LI - 2
Modifications to Appendix 1, SESC checklist, Section 6 enclosed handle design guidelines to allow for a wider range of acceptable handle shapes and sizesFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5009C
LI - 3
Modifications to Appendix 1, SESC checklist, Section 7 to expand whole body clearance criteria to include equipment operation tasks and provide design criteria for a seated posture. Whole body clearance recommendations are separated into two categories: walking/crawling and working postures. Existing recommendations specific to maintenance and service tasks are moved to a new Section 11Failed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5068Revision to SEMI S19-1102, with Title Change from: Safety Guideline for Training of Semiconductor Manufacturing Equipment Installation, Maintenance and Service Personnel to: Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service PersonnelPublished 04/04/2011Region of Action- Japan
5109Reapproval of SEMI S25-0706, Safety Guideline for Hydrogen Peroxide Storage & Handling SystemsFailed Technical Review and Returned to TF 03/31/2011Region of Action- Europe
5110Revisions to SEMI S3-0306, Safety Guidelines for Process Liquid Heating Systems and Delayed Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmenSee Line Items Below Region of Action- NA
5110
LI - 1
Miscellaneous small clarifications and corrections to SEMI S3Published 12/20/2011Region of Action- NA
5110
LI - 2
Revision to SEMI S3, Table 3Published 12/20/2011Region of Action- NA
5110
LI - 3
Revisions to SEMI S2 related to Process Liquid HeatingPublication Process Started 09/12/2011Region of Action- NA
5113Reapproval of SEMI S24-0306, Safety Guideline for Multi-employer Work AreasPublished 09/02/2011Region of Action- Japan
5170Line Item Revisions to SEMI S2-0310e, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to LimitationsSee Line Items Below Region of Action- NA
5170
LI - 1
Section 3.3 RevisionPublished 09/19/2012Region of Action- NA
5171Revision to SEMI S25-0706, Safety Guideline for Hydrogen Peroxide Storage & Handling SystemsPublished 02/18/2013Region of Action- Europe
5172Withdrawal of SEMI F15-0308, Test Method (SF6 Tracer Gas) for Enclosures Has Been Moved to SEMI S6Published 10/25/2011Region of Action- NA
5323Reapproval of SEMI S21-1106E, Safety Guideline for Worker ProtectionPublished 06/18/2012Region of Action- Japan
5353Line Item Revision to SEMI S17-0311, Safety Guideline for Unmanned Transport Vehicle (UTV) SystemsSee Line Items Below Region of Action- Japan
5353
LI - 1
Revision to 11 “Design for Injury Prevention in UTV System Hazard Zone”Published 01/25/2013Region of Action- Japan
5353
LI - 2
Revision to 13 “Emergency Operation”Published 01/25/2013Region of Action- Japan
5353
LI - 3
Revision to 16 “Interface to Automated Material Handler of Semiconductor or FPD Manufacturing Equipment”Published 01/25/2013Region of Action- Japan
5353
LI - 4
Revision to APPENDIX 1 "SEISMIC PROTECTION"Published 01/25/2013Region of Action- Japan
5357Line Item Revisions to SEMI S2-0310e, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Optical RadiationSee Line Items Below Region of Action- NA
5357
LI - 1
Revision to Optical Radiation CriteriaFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5357ALine Item Revisions to SEMI S2-0712a, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Optical RadiationSee Line Items Below Region of Action- NA
5357A
LI - 1
Delayed Revisions Related to Optical RadiationPublished 11/15/2013Region of Action- NA
5374Reapproval of SEMI S16-0307, Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of LifePublished 08/17/2012Region of Action- Japan
5513Line Item Revision to SEMI S23-0311, Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- Japan
5513
LI - 1
The expansion of Related Information (RI) 2Failed Technical Review and Returned to TF 04/18/2013Region of Action- Japan
5513
LI - 2
The addition of text explaining the meaning and limits of the exhaust energy conversion factorPublished 08/09/2013Region of Action- Japan
5513
LI - 3
A small editorial change in the sleep mode definitions, and the addition of a criterion related to load port availability during sleep modePublished 08/09/2013Region of Action- Japan
5521Reapproval of SEMI S1-0708E, Safety Guideline for Equipment Safety LabelsFailed Technical Review and Returned to TF 04/04/2013Region of Action- NA
5522Reapproval of SEMI S6-0707E, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 04/04/2013Region of Action- NA
5590Reapproval of SEMI S14-0309, Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing EquipmentFailed Technical Review and Returned to TF 07/11/2013Region of Action- NA
5591Line Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed revisions related to fire protectionSee Line Items Below Region of Action- NA
5591
LI - 1
Audibility and visibility of annunciators of fire detection systemsFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5591
LI - 2
Location of manual activation devices of fire detection systemsPublication Process Started 08/25/2014Region of Action- NA
5591
LI - 3
Audibility and visibility of annunciators of fire suppression systemsFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5591
LI - 4
Location of manual activation devices of fire suppression systemsPublication Process Started 08/25/2014Region of Action- NA
5591A Line Item Revisions to SEMI S2-0712b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed revisions related to fire protectionSee Line Items Below Region of Action- NA
5591A
LI - 1
Audibility and visibility of annunciators of fire detection systemsDrafting 08/19/2014Region of Action- NA
5591A
LI - 2
Audibility and visibility of annunciators of fire suppression systemsDrafting 08/19/2014Region of Action- NA
5599Reapproval of S10-0307E, Safety Guideline for Risk Assessment and Risk Evaluation ProcessFailed Technical Review and Returned to TF 10/10/2013Region of Action- Europe
5623Line Item Revisions to SEMI S1-0708E, Safety Guideline for Equipment Safety LabelsSee Line Items Below Region of Action- NA
5623
LI - 1
Clarifying the Purpose Statement in Section 1.1Drafting 07/22/2014Region of Action- NA
5623
LI - 2
Adding “NOTICE” to Note 4 of the Scope SectionDrafting 07/22/2014Region of Action- NA
5623
LI - 3
Revising Related Information 1 – Letter Height of Text in Message PanelDrafting 07/22/2014Region of Action- NA
5623
LI - 4
Adding Test Method for Determining “Durability”Drafting 07/22/2014Region of Action- NA
5623
LI - 5
Addition of NOTICE to Allow for Italics or Non-italicized LettersDrafting 07/22/2014Region of Action- NA
5623
LI - 6
Changing Reference to Appendix 1 from Within Note 12 to a New Section 9.6Drafting 07/22/2014Region of Action- NA
5623
LI - 7
Adding Tolerance to the Nominal Dimensions for Surround Shapes in Section 9.10Drafting 07/22/2014Region of Action- NA
5623
LI - 8
Adding New Symbol and Updating Sources in Appendix 1Drafting 07/22/2014Region of Action- NA
5623
LI - 9
Correcting the Arabic and Farsi Translations in Table A2-1Drafting 07/22/2014Region of Action- NA
5649Delayed Line Item Revisions to SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
5649
LI - 1
Termination of the Supply ConductorsFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5649
LI - 2
Modification to Main Disconnecting Means GuardingFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5649
LI - 3
Modification to Uninterruptible Power Supply InterruptionFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5649
LI - 4
Modification to Local Lighting Overcurrent Protection CriteriaPublished 04/04/2014Region of Action- NA
5649
LI - 5
Modification to Electrical Motor CriteriaFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5649
LI - 6
Addition of Motor Overload Test MethodPublished 04/04/2014Region of Action- NA
5649
LI - 7
Grounding CriteriaFailed Technical Review and Returned to TF 10/31/2013Region of Action- NA
5649
LI - 8
Modification to Phase MarkingPublished 04/04/2014Region of Action- NA
5649
LI - 9
Modification to Cord and Plug Disconnect CriteriaPublished 04/04/2014Region of Action- NA
5718Line Item Revisions to SEMI S10-0307E, Safety Guideline for Risk Assessment and Risk Evaluation ProcessSee Line Items Below Region of Action- NA
5718
LI - 1
Addition of NOTE on product and equipment under considerationPublication Process Started 08/25/2014Region of Action- NA
5718
LI - 2
Change “loss” to “harm” (section 5.1.1)Publication Process Started 08/25/2014Region of Action- NA
5718
LI - 3
Remove Note 4Failed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5718
LI - 4
Clarification of the life cycle stages to be consideredPublication Process Started 08/25/2014Region of Action- NA
5718
LI - 5
Clarification section 6.5 on risk estimation, remove the term benchmarking. Multiple changes in the sectionFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5718
LI - 6
Change “loss” to “harm” (Table A1-1)Failed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5718
LI - 7
Add pointer to ISO 12100Failed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5718ALine Item Revisions to SEMI S10-0307E, Safety Guideline for Risk Assessment and Risk Evaluation ProcessSee Line Items Below Region of Action- NA
5718A
LI - 1
Modify Note 3 and 4 in definitions sectionDrafting 07/31/2014Region of Action- NA
5718A
LI - 2
Clarification section 6.5 on risk estimation, remove the term benchmarking. Multiple changes in the sectionDrafting 07/31/2014Region of Action- NA
5718A
LI - 3
Update standards (remove years and add note to latest version). Line item 3 is to bring standards references in line with other SEMI S standards (like SEMI S2, S22, ..)Drafting 07/31/2014Region of Action- NA
5718A
LI - 4
Correct pointer to ISO 12100 in Appendix 1Drafting 07/31/2014Region of Action- NA
5719Line Item Revisions to SEMI S26-0811, Environmental, Health, and Safety Guideline for FPD Manufacturing System, Delayed Revisions Related to LimitationsSee Line Items Below Region of Action- Japan
5719
LI - 1
Line Item 1: Delayed Revision to 3 “Limitations”Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5720Line Item Revisions to SEMI S26-0811, Environmental, Health, and Safety Guideline for FPD Manufacturing System, General Harmonization to SEMI S2See Line Items Below Region of Action- Japan
5720
LI - 1
Line Item 1: Revision to “accredited testing laboratory” of 5 “Terminology”Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5720
LI - 2
Line Item 2: Revision to 11 “Safety Interlock Systems” Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5720
LI - 3
Line Item 3: Revision to 13 “Electrical Design”Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5720
LI - 4
Line Item 4: Revision to 18 “Mechanical Design”Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5720
LI - 5
Line Item 5: Revision to 25 “Non-Ionizing Radiation and Fields”Passed Technical Review - Awaiting Procedural Review 07/24/2014Region of Action- Japan
5760Line Item Revisions to SEMI S7-0310, Safety Guideline for Evaluation Personnel and Evaluating Company QualificationsSee Line Items Below Region of Action- NA
5760
LI - 1
Change to make qualifications statement available when work startsDrafting 07/24/2014Region of Action- NA
5760
LI - 2
Add document retention criteriaDrafting 07/24/2014Region of Action- NA