SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

Use the pull-down menu below to browse a particular committee.


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MEMS / NEMS

4691New Standard: Specification for High Density Permanent Connections between Microfluidic DevicesPublished as SEMI MS9-0611 06/17/2011Region of Action- NA
4719ARevision to SEMI MS03-07, Terminology for MEMS Technology with title change to: Terminology for MEMS / NEMS TechnologyFailed Technical Review and Returned to TF 10/29/2012Region of Action- NA
4719BRevision to SEMI MS3-0307, Terminology for MEMS Technology with title change to: Terminology for MEMS / NEMS TechnologyDrafting 08/21/2014Region of Action- NA
5046Revision to SEMI MS5-0310, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test StructuresPublished 12/20/2011Region of Action- NA
5117Revision of SEMI MS2-1109, Test Method for Step-Height Measurements of Thin FilmsFailed Technical Review and Returned to TF 03/28/2011Region of Action- NA
5117ARevision of SEMI MS2-1109, Test Method for Step-Height Measurements of Thin FilmsPublished 02/29/2012Region of Action- NA
5118Revision of SEMI MS4-1109, Test Method for Young’s Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in ResonancePublished 02/29/2012Region of Action- NA
5266New Standard: Test Method to Measure Fluid Permeation through MEMS Packaging MaterialsPublished as SEMI MS10-0912 09/28/2012Region of Action- NA
5266InfoNew Standard: Guide for Determining Fluid Permeation through MEMS Packaging MaterialsDrafting 11/18/2011Region of Action- NA
5267New Standard: Specification for Microfluidic Port and Pitch DimensionsFailed Technical Review and Returned to TF 04/01/2013Region of Action- NA
5352Reapproval of SEMI MS1-0307, Guide to Specifying Wafer-Wafer Bonding Alignment TargetsPublished 08/31/2012Region of Action- NA
5514Line Items Revisions to SEMI MS5-1211, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test StructuresSee Line Items Below Region of Action- NA
5514
LI - 1
Revision to Referenced Standards and DocumentsPublished 08/21/2013Region of Action- NA
5514
LI - 2
Revisions to TerminologyPublished 08/21/2013Region of Action- NA
5515Revision to SEMI MS7-0708, Specification for Microfluidic Interfaces to Electronic Device PackagesFailed Technical Review and Returned to TF 04/01/2013Region of Action- NA
5586Line Item Revision to SEMI MS2-0212, Test Method for Step-Height Measurements of Thin FilmsSee Line Items Below Region of Action- NA
5586
LI - 1
Update a Reference Supplied in Footnote #5Published 11/15/2013Region of Action- NA
5587Line Items Revision to SEMI MS4-0212, Standard Test Method for Young’s Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in ResonanceSee Line Items Below Region of Action- NA
5587
LI - 1
Update a Reference Supplied in Footnote #7Published 11/15/2013Region of Action- NA
5587
LI - 2
Update a Reference Supplied in Footnote #10Published 11/15/2013Region of Action- NA