SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

Use the pull-down menu below to browse a particular committee.


Browse


Metrics

5596New Standard: Guide To Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Drafting 05/16/2016Region of Action- NA
5596New Standard: Guide To Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Drafting 01/13/2017Region of Action- NA
5596ANew Standard: Guide To Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Published as SEMI E176-1017 10/13/2017Region of Action- NA
5819AReapproval of SEMI E114-0302E (Reapproved 0309) - Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery SystemsPublished 06/30/2016Region of Action- NA
5820AReapproval of SEMI E115-0302E (Reapproved 0309) - Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery SystemsPublished 08/26/2016Region of Action- NA
6017Line-item Revision to SEMI E33-1012 Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC)See Line Items Below Region of Action- NA
6017
LI - 1
To update the referenced EC Directive in section 4.2 and Related Information 3.Published 02/10/2017Region of Action- NA
6115Reapproval for SEMI E163-0212, Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items within Specially Designated AreasPublished 12/29/2017Region of Action- NA
6144Line-item Revisions to SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems See Line Items Below Region of Action- NA
6144
LI - 1
Clarify that the accompanying spreadsheet is of the Various Materials type of Supplementary Materials. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6144
LI - 2
Add clarification on the different types of COO values calculated. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6144
LI - 3
Add missing Reporting Results section. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6144
LI - 4
Miscellaneous minor technical and/or editorial changes needed. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6144ALine-item Revision to SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems See Line Items Below Region of Action- NA
6144A
LI - 1
Clarify that the accompanying spreadsheet is of the Various Materials type of Supplementary Materials Published 06/15/2018Region of Action- NA
6144A
LI - 2
Add clarification on the different types of COO values calculated.Published 06/15/2018Region of Action- NA
6144A
LI - 3
Add missing Reporting Results section.Published 06/15/2018Region of Action- NA
6144A
LI - 4
Miscellaneous minor technical and/or editorial changes needed.Published 06/15/2018Region of Action- NA
6145Line-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6145
LI - 1
Standardize terminology (e.g., measurement system, measurement system analysis [MSA]) to harmonize with SEMI E89. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6145
LI - 2
Implement required changes due to the major revision and scope change implemented in referenced SEMI S16. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6145
LI - 3
Add clarification on the ‘good unit equivalents (GUE) per year’ term. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6145
LI - 4
Update the Related Documents section. Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6145
LI - 5
Miscellaneous minor technical and/or editorial changes needed. Justification: Failed Technical Review and Returned to TF 07/12/2017Region of Action- NA
6145ALine-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment See Line Items Below Region of Action- NA
6145A
LI - 1
Standardize terminology (e.g., measurement system, measurement system analysis [MSA]) to harmonize with SEMI E89.Published 06/15/2018Region of Action- NA
6145A
LI - 2
Line-Item 2: Implement required changes due to the major revision and scope change implemented in referenced SEMI S16. Published 06/15/2018Region of Action- NA
6145A
LI - 3
Add clarification on the ‘good unit equivalents (GUE) per year’ term. Published 06/15/2018Region of Action- NA
6145A
LI - 4
Update the Related Documents section. Published 06/15/2018Region of Action- NA
6145A
LI - 5
Miscellaneous minor technical and/or editorial changes needed. Published 06/15/2018Region of Action- NA
6146Line-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment and SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems See Line Items Below Region of Action- NA
6146
LI - 1
Change definition and calculation of cost footprint (CF) to cost footprint rectangle area (Acf). Drafting 05/23/2017Region of Action- NA
6146
LI - 2
Provide additional guidance for calculating/estimating throughput per SEMI E79. Drafting 05/23/2017Region of Action- NA
6146
LI - 3
Provide additional guidance for calculating/estimating utilization and uptime metrics per SEMI E10. Drafting 05/23/2017Region of Action- NA
6146
LI - 4
Clarify what types of engineering should be included. Drafting 05/23/2017Region of Action- NA
6146
LI - 5
Clarify the difference between initial training vs. ongoing training and clarify what training-related costs are included. Drafting 05/23/2017Region of Action- NA
6146
LI - 6
Update the definitions of ‘consumable material’ and ‘consumable part’ to match the ones in referenced SEMI E10. Drafting 05/23/2017Region of Action- NA
6146
LI - 7
Revise and harmonize the SEMI E35 Cost Elements Section 9 with the SEMI E140 Definitions worksheet. Drafting 05/23/2017Region of Action- NA
6146
LI - 8
Miscellaneous minor technical and/or editorial changes needed. Drafting 05/23/2017Region of Action- NA
6146ALine-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment and SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems See Line Items Below Region of Action- NA
6146A
LI - 1
Change definition and calculation of cost footprint (CF) to cost footprint rectangle area (Acf)Published 06/15/2018Region of Action- NA
6146A
LI - 2
Provide additional guidance for calculating/estimating throughput per SEMI E79. Published 06/15/2018Region of Action- NA
6146A
LI - 3
Provide additional guidance for calculating/estimating utilization and uptime metrics per SEMI E10.Published 06/15/2018Region of Action- NA
6146A
LI - 4
Clarify what types of engineering should be included. Published 06/15/2018Region of Action- NA
6146A
LI - 5
Clarify the difference between initial training vs. ongoing training and clarify what training-related costs are included. Published 06/15/2018Region of Action- NA
6146A
LI - 6
Update the definitions of ‘consumable material’ and ‘consumable part’ to match the ones in referenced SEMI E10. Published 06/15/2018Region of Action- NA
6146A
LI - 7
Revise and harmonize the SEMI E35 Cost Elements Section 9 with the SEMI E140 Definitions worksheet. Published 06/15/2018Region of Action- NA
6146A
LI - 8
Miscellaneous minor technical and/or editorial changes needed. Published 06/15/2018Region of Action- NA
6184Revision to SEMI E135, Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems Used in Semiconductor Processing EquipmentPublished 09/28/2018Region of Action- NA
6241Reapproval of SEMI E113-0306 (Reapproved 0512), Specification for Semiconductor Processing Equipment RF Power Delivery SystemsPublished 05/25/2018Region of Action- NA
6242Reapproval of SEMI E136-1104 (Reapproved 0512), Test Method for Determining the Output Power of RF Generators Used in Semiconductor Processing Equipment RF Power Delivery SystemsPublished 05/25/2018Region of Action- NA
6243Reapproval of SEMI E143-0306 (Reapproved 0512), Test Method for Measuring Power and Variation into a 50-Ω Load and Power Variation and Spectrum into a Load with a VSWR of 2.0 at Any Phase AnglePublished 05/25/2018Region of Action- NA
6400Record of Editorial Change by TC and approved by ISC A&R for SEMI E33-0217, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) Published 10/19/2018Region of Action- NA
6467Line-Item Revision to SEMI E129-0912, Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing FacilitySee Line Items Below Region of Action- NA
6467
LI - 1
Update ITRS referencesPublished 02/10/2022Region of Action- NA
6467
LI - 2
Update referenced documents and remove obsolete or outdated documentsPublished 02/10/2022Region of Action- NA
6467
LI - 3
Editorial and minor technical changesPublished 02/10/2022Region of Action- NA
6468Line-Item Revision to SEMI E78-0912, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for EquipmentSee Line Items Below Region of Action- NA
6468
LI - 1
Update ITRS referencesPublished 02/10/2022Region of Action- NA
6468
LI - 2
Update referenced documents and remove obsolete or outdated documents Published 02/10/2022Region of Action- NA
6468
LI - 3
Editorial and minor technical changesPublished 02/10/2022Region of Action- NA
6472New Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer ProcessingPublished as SEMI E180-1219 12/13/2019Region of Action- NA
6508Reapproval to SEMI E43-0813: Guide for Electrostatic Measurements on Objects and SurfacesPublished 10/18/2019Region of Action- NA
6550Revision to SEMI E113-0306 (Reapproved 0518), "Specification for Semiconductor Processing Equipment RF Power Delivery Systems" with title change to "Specification for RF Power Delivery Systems Used in Semiconductor Processing Equipment"Failed Technical Review and Returned to TF 12/12/2019Region of Action- Japan
6550ARevision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery SystemsPassed Technical Review - Awaiting Procedural Review 12/13/2023Region of Action- Japan
6567Reapproval to SEMI E149-0314: Guide for Equipment Supplier-Provided Documentation for the Acquisition and Use of Manufacturing EquipmentDrafting 07/24/2019Region of Action- NA
6568Reapproval to SEMI E150-0314: Guide for Equipment Training Best PracticesDrafting 07/25/2019Region of Action- NA
6569Reapproval to SEMI E165-0813: Guide for a Comprehensive Equipment Training System when Dedicated Training Equipment is not AvailableDrafting 07/24/2019Region of Action- NA
6578Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Drafting 10/25/2019Region of Action- NA
6578Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization Failed Technical Review and Returned to TF 09/04/2020Region of Action- NA
6579Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment ProductivityDrafting 10/25/2019Region of Action- NA
6579Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment ProductivityFailed Technical Review and Returned to TF 09/04/2020Region of Action- NA
6599Line Item Revision to SEMI E180-1219, Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing.See Line Items Below Region of Action- NA
6599
LI - 1
SEMI E180 - To clarify what is discarded after the extraction solution is collected Published 12/18/2020Region of Action- NA
6676Revision to SEMI E136-1104 (Reapproved 0512) TEST METHOD FOR DETERMINING THE OUTPUT POWER OF RF GENERATORS USED IN SEMICONDUCTOR PROCESSING EQUIPMENT RF POWER DELIVERY SYSTEMSPublished 01/28/2022Region of Action- NA
6678Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and UtilizationPublished 02/26/2021Region of Action- NA
6679Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment ProductivityPublished 02/26/2021Region of Action- NA
6785LINE ITEM REVISIONS TO SEMI E10-0221: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and UtilizationSee Line Items Below Region of Action- NA
6785
LI - 1
Add the advanced concepts of predictive maintenancePublished 04/29/2022Region of Action- NA
6785
LI - 2
Add additional guidance for calculating the metrics for an automated material handling system (AMHS)Published 04/29/2022Region of Action- NA
6785
LI - 3
Add additional guidance in Appendix 2 for calculating the reliability growth and degradationPublished 04/29/2022Region of Action- NA
6785
LI - 4
Update definition of ‘consumable part’Published 04/29/2022Region of Action- NA
6785
LI - 5
Update definition of ‘failure’ to address safety errors.Published 04/29/2022Region of Action- NA
6785
LI - 6
Clarification on initiation of equipment state transitionsPublished 04/29/2022Region of Action- NA
6785
LI - 7
Clarification on use of the Productive (PRD) equipment statePublished 04/29/2022Region of Action- NA
6785
LI - 8
Implement miscellaneous minor technical and editorial changes as neededPublished 04/29/2022Region of Action- NA
6786LINE ITEM REVISIONS TO SEMI E79-0221: Specification for Definition and Measurement of Equipment ProductivitySee Line Items Below Region of Action- NA
6786
LI - 1
Harmonize ‘consumable part” term and definition with SEMI E10Published 04/29/2022Region of Action- NA
6786
LI - 2
Implement editorial and minor technical changes as needed (e.g., to comply with Style Manual, Regulations, and/or Procedure ManualPublished 04/29/2022Region of Action- NA
6838Reapproval of SEMI E114-0302E (Reapproved 0616), Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery SystemsPublished 09/29/2023Region of Action- NA
6839Reapproval of SEMI E115-0302E (Reapproved 0816), Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery SystemsPublished 09/29/2023Region of Action- NA
6841Line-item Revisions to SEMI E35-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing EquipmentSee Line Items Below Region of Action- NA
6841
LI - 1
Update terms and/or definitions with SEMI E10 and E79Published 10/14/2022Region of Action- NA
6841
LI - 2
Update the definition of equipment yield (EY)Published 10/14/2022Region of Action- NA
6841
LI - 3
Miscellaneous, minor, technical and editorial changesPublished 10/14/2022Region of Action- NA
6842Line-item Revisions to SEMI E140-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery SystemsSee Line Items Below Region of Action- NA
6842
LI - 1
Update terms and/or definitions with SEMI E10 and E79Published 10/14/2022Region of Action- NA
6842
LI - 2
Update the definition of equipment yield (EY)Published 10/14/2022Region of Action- NA
6842
LI - 3
Miscellaneous, minor, technical and editorial changesPublished 10/14/2022Region of Action- NA
6894Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing EnvironmentSee Line Items Below Region of Action- NA
6894
LI - 1
Move Appendix 1 from SEMI E33 to E176Drafting 02/10/2024Region of Action- NA
6894
LI - 2
Update References and Other Editorial ChangesDrafting 02/10/2024Region of Action- NA
6931New Standard: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionFailed Technical Review and Returned to TF 11/09/2023Region of Action- NA
6971Revision of SEMI E163-0212 (Reapproved 1217) With Title Change To: Guide for the Handling of Extremely Electrostatic Sensitive (EES) Items Within Specially Designated AreasFailed Technical Review and Returned to TF 10/26/2022Region of Action- NA
7056Reapproval of SEMI E168-0915, Specification for Product Time MeasurementPublished 09/29/2023Region of Action- NA
7057Reapproval of SEMI E168.1-1114, Specification for Product Time Measurement in GEM 300 Production EquipmentPublished 09/29/2023Region of Action- NA
7058Reapproval of SEMI E168.2-0915, Specification for Product Time Measurement for Material Control SystemsPublished 09/29/2023Region of Action- NA
7059Reapproval of SEMI E168.3-0915, Specification for Product Time Measurement for TransportPublished 09/29/2023Region of Action- NA
7129New Standard: Test Method for Measuring Particles and Contamination by A Liquid Particle Counter of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionFailed Technical Review and Returned to TF 11/09/2023Region of Action- NA
7129ANew Standard: Test Method for Liquid Particle Counter Measuring Particles Contamination of Critical Chamber Components and CouponsDrafting 01/18/2024Region of Action- NA
7130New Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionFailed Technical Review and Returned to TF 11/09/2023Region of Action- NA
7130ANew Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionDrafting 01/12/2024Region of Action- NA
7131Reapproval of SEMI E135-0918, Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems Used in Semiconductor Processing EquipmentPublished 03/15/2024Region of Action- NA
7132Reapproval of SEMI E143-0306 (Reapproved 0518), Test Method for Measuring Power and Variation into a 50-Ω Load and Power Variation and Spectrum into a Load with a VSWR of 2.0 at any phase AnglePublished 03/15/2024Region of Action- NA
R5596ANew Standard: Guide To Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Published as SEMI E176-1017 10/13/2017Region of Action- NA
R6184Revision to SEMI E135-0704, Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems Used in Semiconductor Processing EquipmentPublished 09/28/2018Region of Action- NA
R6472New Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer ProcessingPublished as SEMI E180-1219 12/13/2019Region of Action- NA