| 4580 Info | New Standard: EUV Reticle Reference Fiducial Marks | Drafting 04/08/2010 | Region of Action- NA |
| 4580 | New Standard: Specification Of Fiducial Marks For Euv Mask Blank | Published as SEMI P48-1110 09/16/2010 | Region of Action- NA |
| 4584 | Revision to P40, Specification for Mounting Requirements and Alignment Reference Locations for Extreme Ultraviolet Lithography Masks | Failed Technical Review and Returned to TF 02/27/2009 | Region of Action- NA |
| 4584A | Revision to P40-1103, Specification For Mounting Requirements For Extreme Ultraviolet Lithography Masks | Published 09/21/2009 | Region of Action- NA |
| 4585 | Revision to P37-1102, Specification for Extreme Ultraviolet Lithography Mask Substrates With Title Change To: Specification For Extreme Ultraviolet Lithography Substrates And Blanks | Published 10/01/2009 | Region of Action- NA |
| 4587 | Revision to SEMI P10, Specification of Data Structures for Photomask Orders | Published 05/29/2009 | Region of Action- NA |
| 4781 | Withdrawal of P38-1103, Specification For Absorbing Film Stacks And Multilayers On Extreme Ultraviolet Lithography Mask Blanks | Published 05/14/2010 | Region of Action- NA |
| 4840Info | Revision to SEMI P45-0708, Specification for Job Deck Data Format for Mask Tools | Drafting 03/19/2010 | Region of Action- Japan |
| 4840 | Revision to SEMI P45-0708, Specification for Job Deck Data Format for Mask Tools | Published 02/03/2011 | Region of Action- Japan |
| 4841Info | Revision to SEMI P44-0709, Specification for Open Artwork System Intercharge Standard (OASIS) Specific to Mask Tools | Drafting 03/19/2010 | Region of Action- Japan |
| 4841 | Revision to SEMI P44-0709, Specification for Open Artwork System Intercharge Standard (OASIS) Specific to Mask Tools | Published 02/28/2011 | Region of Action- Japan |
| 5047 | Revision to SEMI P10-0709, Specification of Data Structures for Photomask Orders | Published 11/28/2012 | Region of Action- NA |
| 5048 | Line-Item Revisions to SEMI P37-1109, Specification for Extreme Ultraviolet Lithography Substrates and Blanks | See Line Items Below | Region of Action- NA |
5048
LI - 1 | Addition of Paragraph 7.2.3 | Published 06/12/2013 | Region of Action- NA |
5048
LI - 2 | Removal of Related Information 1 | Published 06/12/2013 | Region of Action- NA |
| 5119 | Revision to SEMI P9-0298, Guideline for Functional Testing of Microelectronic Resists
with title change to: Guide for Functional Testing of Microelectronic Resists | Published 12/02/2011 | Region of Action- NA |
| 5120 | Revision to SEMI P12-0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP)
with title change to: Test Method for the Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP) | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5121 | Revision to SEMI P13-91 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy
with title change to: Test Method for the Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5122 | Revision to SEMI P14-0997, Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy
with title change to: Test Method for the Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5123 | Revision to SEMI P15-92 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy
with title change to: Test Method for the Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5124 | Revision to SEMI P16-92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy
with title change to: Test Method for the Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5125 | Revision to SEMI P17-92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP)
with title change to: Test Method for the Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP) | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5126 | Revision to SEMI P18-92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer Steppers
with title change to: Terminology for Overlay Capabilities of Wafer Steppers | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5127 | Revision to SEMI P24-94 (Reapproved 1104), CD Metrology Procedures
with title change to: Test Method and Procedures for CD Metrology | Failed Technical Review and Returned to TF 07/12/2011 | Region of Action- NA |
| 5128 | Reapproval of SEMI P25-94 (Reapproved 1104), Specification for Measuring Depth of Focus and Best Focus | Failed Technical Review and Returned to TF 03/03/2011 | Region of Action- NA |
| 5129 | Reapproval of SEMI P31-0304, Practice for Catalog Publication for Chemical Amplified (CA) Photoresist Parameter | Published 06/10/2011 | Region of Action- NA |
| 5132 | Reapproval of SEMI P43-0304, Photomask Qualification Terminology | Published 06/17/2011 | Region of Action- NA |
| 5143 | Revision to SEMI P7-0997 (Reapproved 1103), Method of Viscosity Determination, Method A – Kinematic Viscosity
with title change to Test Method for Viscosity Determination, Method A – Kinematic Viscosity | Published 12/02/2011 | Region of Action- NA |
| 5144 | Revision to SEMI P8-0997, Method for the Determination of Water in Photoresist with title change to: Test Method for the Determination of Water in Photoresist | Published 12/02/2011 | Region of Action- NA |
| 5146 | Revision to SEMI P46-0706, Specification for Critical Dimension (CD) Measurement Information Data on Photomask by XML | Published 12/02/2011 | Region of Action- NA |
| 5147 | Revision to SEMI P29-1105, Guideline for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and Mask Blanks
with title change to: Specification for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and Mask Blanks | Published 12/02/2011 | Region of Action- NA |
| 5229 Info | Revision to SEMI P44, Specification for Open Artwork System Interchange Standard (OASIS) Specific to Mask Tools | Drafting 11/21/2011 | Region of Action- Japan |
| 5483 | Reapproval of SEMI P47-0307, Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness | Published 05/17/2013 | Region of Action- Japan |
| 5535 | Reapproval of SEMI P35-1106, Terminology for Microlithography Metrology | Passed Technical Review - Awaiting Procedural Review 04/09/2013 | Region of Action- Japan |
| 5536 | Reapproval of SEMI P36-1108, Guide for Magnification Reference for Critical Dimension Measurement for Scanning Electron Microscopes (CD-SEMS) | Passed Technical Review - Awaiting Procedural Review 04/09/2013 | Region of Action- Japan |