SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

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Micropatterning

4580 blueNew Standard: EUV Reticle Reference Fiducial MarksDrafting 06/30/2014Region of Action- NA
4580New Standard: Specification Of Fiducial Marks For Euv Mask BlankPublished as SEMI P48-1110 09/16/2010Region of Action- NA
4584Revision to P40, Specification for Mounting Requirements and Alignment Reference Locations for Extreme Ultraviolet Lithography MasksFailed Technical Review and Returned to TF 02/27/2009Region of Action- NA
4584ARevision to P40-1103, Specification For Mounting Requirements For Extreme Ultraviolet Lithography MasksPublished 09/21/2009Region of Action- NA
4585Revision to P37-1102, Specification for Extreme Ultraviolet Lithography Mask Substrates With Title Change To: Specification For Extreme Ultraviolet Lithography Substrates And BlanksPublished 10/01/2009Region of Action- NA
4587Revision to SEMI P10, Specification of Data Structures for Photomask OrdersPublished 05/29/2009Region of Action- NA
4781Withdrawal of P38-1103, Specification For Absorbing Film Stacks And Multilayers On Extreme Ultraviolet Lithography Mask BlanksPublished 05/14/2010Region of Action- NA
4840InfoRevision to SEMI P45-0708, Specification for Job Deck Data Format for Mask ToolsDrafting 03/19/2010Region of Action- Japan
4840Revision to SEMI P45-0708, Specification for Job Deck Data Format for Mask ToolsPublished 02/03/2011Region of Action- Japan
4841InfoRevision to SEMI P44-0709, Specification for Open Artwork System Intercharge Standard (OASIS) Specific to Mask ToolsDrafting 03/19/2010Region of Action- Japan
4841Revision to SEMI P44-0709, Specification for Open Artwork System Intercharge Standard (OASIS) Specific to Mask ToolsPublished 02/28/2011Region of Action- Japan
5047Revision to SEMI P10-0709, Specification of Data Structures for Photomask OrdersPublished 11/28/2012Region of Action- NA
5048Line-Item Revisions to SEMI P37-1109, Specification for Extreme Ultraviolet Lithography Substrates and BlanksSee Line Items Below Region of Action- NA
5048
LI - 1
Addition of Paragraph 7.2.3Published 06/12/2013Region of Action- NA
5048
LI - 2
Removal of Related Information 1Published 06/12/2013Region of Action- NA
5119Revision to SEMI P9-0298, Guideline for Functional Testing of Microelectronic Resists with title change to: Guide for Functional Testing of Microelectronic ResistsPublished 12/02/2011Region of Action- NA
5120Revision to SEMI P12-0997, Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP) with title change to: Test Method for the Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresists by Inductively Coupled Plasma Emission Spectroscopy (ICP)Failed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5121Revision to SEMI P13-91 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption Spectroscopy with title change to: Test Method for the Determination of Sodium and Potassium in Positive Photoresists by Atomic Absorption SpectroscopyFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5122Revision to SEMI P14-0997, Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption Spectroscopy with title change to: Test Method for the Determination of Tin in Positive Photoresists by Graphite Furnace Atomic Absorption SpectroscopyFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5123Revision to SEMI P15-92 (Reapproved 1104), Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption Spectroscopy with title change to: Test Method for the Determination of Sodium and Potassium in Positive Photoresist Metal Ion Free (MIF) Developers by Atomic Absorption SpectroscopyFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5124Revision to SEMI P16-92 (Reapproved 1104), Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption Spectroscopy with title change to: Test Method for the Determination of Tin in Positive Photoresist Metal Ion Free (MIF) Developers by Graphite Furnace Atomic Absorption SpectroscopyFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5125Revision to SEMI P17-92 (Reapproved 0299), Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP) with title change to: Test Method for the Determination of Iron, Zinc, Calcium, Magnesium, Copper, Boron, Aluminum, Chromium, Manganese, and Nickel in Positive Photoresist Metal Ion Free (MIF) Developers by Inductively Coupled Plasma Emission Spectroscopy (ICP)Failed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5126Revision to SEMI P18-92 (Reapproved 1104), Specification for Overlay Capabilities of Wafer Steppers with title change to: Terminology for Overlay Capabilities of Wafer SteppersFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5127Revision to SEMI P24-94 (Reapproved 1104), CD Metrology Procedures with title change to: Test Method and Procedures for CD MetrologyFailed Technical Review and Returned to TF 07/12/2011Region of Action- NA
5128Reapproval of SEMI P25-94 (Reapproved 1104), Specification for Measuring Depth of Focus and Best FocusFailed Technical Review and Returned to TF 03/03/2011Region of Action- NA
5129Reapproval of SEMI P31-0304, Practice for Catalog Publication for Chemical Amplified (CA) Photoresist ParameterPublished 06/10/2011Region of Action- NA
5132Reapproval of SEMI P43-0304, Photomask Qualification TerminologyPublished 06/17/2011Region of Action- NA
5143Revision to SEMI P7-0997 (Reapproved 1103), Method of Viscosity Determination, Method A – Kinematic Viscosity with title change to Test Method for Viscosity Determination, Method A – Kinematic ViscosityPublished 12/02/2011Region of Action- NA
5144Revision to SEMI P8-0997, Method for the Determination of Water in Photoresist with title change to: Test Method for the Determination of Water in PhotoresistPublished 12/02/2011Region of Action- NA
5146Revision to SEMI P46-0706, Specification for Critical Dimension (CD) Measurement Information Data on Photomask by XMLPublished 12/02/2011Region of Action- NA
5147Revision to SEMI P29-1105, Guideline for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and Mask Blanks with title change to: Specification for Description of Characteristics Specific to Halftone/Attenuated Phase Shift Masks and Mask BlanksPublished 12/02/2011Region of Action- NA
5229 InfoRevision to SEMI P44, Specification for Open Artwork System Interchange Standard (OASIS) Specific to Mask ToolsDrafting 11/21/2011Region of Action- Japan
5229Revision to SEMI P44-0211, Specification for Open Artwork System Interchange Standard (OASIS) Specific to Mask ToolsDrafting 07/23/2014Region of Action- Japan
5483Reapproval of SEMI P47-0307, Test Method for Evaluation of Line-Edge Roughness and Linewidth RoughnessPublished 05/17/2013Region of Action- Japan
5535Reapproval of SEMI P35-1106, Terminology for Microlithography MetrologyPublished 09/27/2013Region of Action- Japan
5536Reapproval of SEMI P36-1108, Guide for Magnification Reference for Critical Dimension Measurement for Scanning Electron Microscopes (CD-SEMS)Published 09/27/2013Region of Action- Japan