SEMI International Standards
Document Status Report

This page provides a the status of documents being worked on by various Task Forces in the SEMI International Standards program.

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Traceability

4487 BlueObject Labeling for Preventing / Detecting Semiconductor Counterfeit Products Document is Being Redrafted 02/27/2009Region of Action- NA
4487New Standard (Sub-doc for T20):Specification For Object Labeling To Authenticate Semiconductors And Related Products In An Open MarketPublished as SEMI T20.1-1109 10/02/2009Region of Action- NA
4488New Standard: Authentication Service Communication for Preventing / Detecting Semiconductor Counterfeit ProductsPublished as SEMI T20.3-0710 06/03/2010Region of Action- NA
4489New Standard (Sub-doc for T20): Guide for Qualifications of Authentication Service Providers for Detecting and Preventing Counterfeiting of Semiconductors and Related Products Published as SEMI T20.2-1109 10/02/2009Region of Action- NA
4617New Standard: Adding Subdocument onto T17 for Traceability Information of Die/Device on a Tray/Packaging SubstrateDrafting 09/15/2009Region of Action- Japan
4643Withdrawal of T1, Specification for Back Surface Bar Code Marking of Silicon WafersDrafting 02/17/2009Region of Action- NA
4643Withdrawal of T1-93 (Reapproved 0303), Specification for Back Surface Bar Code Marking of Silicon WafersPublished 05/19/2009Region of Action- NA
4644Reapproval of T11-0703, Specification for Marking of Hard Surface Reticle SubstratesPublished 05/19/2009Region of Action- NA
4645Revision to T20-1108, Specification for Authentication of Semiconductors and Related ProductsPublished 10/02/2009Region of Action- NA
4694Reapproval of SEMI T7-0303, Specification For Back Surface Marking Of Double-Side Polished Wafers With A Two-Dimensional Matrix Code SymbolPublished 05/19/2009Region of Action- NA
4710Revision of T19 Specification for Device Marking: Adding Appendix 3 for Larger Marking on Packaged/Sealed DevicesFailed Technical Review and Returned to TF 03/27/2009Region of Action- Japan
4710ARevision of T19 Specification for Device Marking: Adding Appendix 3 for Larger Marking on Packaged/Sealed DevicesPublished 10/02/2009Region of Action- Japan
4811Revision to SEMI T16-1105, SPECIFICATION FOR USE OF DATA MATRIX SYMBOLOGY FOR AUTOMATED IDENTIFICATION OF EXTREME ULTRAVIOLET LITHOGRAPHY MASKSSee Line Items Below Region of Action- NA
4811
LI - 1
Section 7.3.1, fix inverted calculations to match figures 2 & 3Published 02/03/2010Region of Action- NA
4845InfoSpecification for Organization Identification by Digital Certificate Issued from CSB(Certificate Service Body ) for Anti-Counterfeiting Traceability in Components Supply ChainDrafting 08/24/2010Region of Action- Japan
4845New Standard: Specification for Organization Identification by Digital Certificate Issued from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply ChainFailed Technical Review and Returned to TF 04/22/2011Region of Action- Japan
4845ANew Standard: Specification for Organization Identification by Digital Certificate Issued from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply ChainPublished as SEMI T21-0212 02/24/2012Region of Action- Japan
4847InfoTraceability by Self Authentication Service Body and Authentication Service BodyDrafting 08/24/2010Region of Action- Japan
4847New Standard: Specification for Traceability by Self Authentication Service Body and Authentication Service BodyFailed Technical Review and Returned to TF 04/22/2011Region of Action- Japan
4847ANew Standard: Specification for Traceability by Self Authentication Service Body and Authentication Service BodyPublished as SEMI T22-0212 02/24/2012Region of Action- Japan
4854Reapproval of SEMI T13.1, Specification for SECS Protocol for Device TrackingPublished 05/27/2010Region of Action- Japan
4855Reapproval of SEMI T13.2, Specification for XML Protocol for Device TrackingPublished 05/27/2010Region of Action- Japan
4856Reapproval of SEMI T12.1 Specification for SECS Protocol for Tracking JIGS and ImplementsPublished 06/03/2010Region of Action- Japan
4857Reapproval of SEMI T13, Specification for Device Tracking: Concepts, Behavior, and ServicePublished 05/27/2010Region of Action- Japan
4923Withdrawal of SEMI T2-1104R, Specification For Marking Of Wafers With A Two-Dimensional Matrix Code SymbolPublished 10/07/2010Region of Action- NA
4924Withdrawal of SEMI T6-1104R, Procedure And Format For Reporting Of Test Results By Electronic Data Interchange (EDI)Published 10/07/2010Region of Action- NA
4925Revision to SEMI T8-1104R, Specification For Marking Of Glass Flat Panel Display Substrates With A Two-Dimensional Matrix Code SymbolPublished 09/30/2010Region of Action- NA
4926Revision to SEMI T9-1104R, Specification For Marking Of Metal Lead-Frame Strips With A Two-Dimensional Data Matrix Code SymbolPublished 09/30/2010Region of Action- NA
5065Revision of T19-1109, Specification for Device Marking (Re: Adding Appendix 4 - Requirements of Substrate for Dot Matrix Code)Published 03/30/2011Region of Action- Japan
5092Auxiliary information: List of Authentication Service Bodies (ASB) for Use with T20.2Auxiliary Information Published 03/17/2011Region of Action- NA
5159Reapproval of SEMI M12-0706, Specification for Serial Alphanumeric Marking of the Front Surface Of WafersPublished 10/24/2011Region of Action- NA
5160Reapproval of SEMI M13-0706, Specification for Alphanumeric Marking of Silicon WafersPublished 10/25/2011Region of Action- NA
5168Reapproval of SEMI T5-1106, Specification for Alphanumeric Marking of Round Compound Semiconductor WafersPublished 11/14/2011Region of Action- NA
5350Withdrawal of SEMI T4-0301 (Reapproved 0307) Specification for 150 mm and 200 mm Pod Identification DimensionsFailed Technical Review and Returned to TF 07/12/2012Region of Action- NA
5351Reapproval of SEMI T10-0701 (Reapproved 0307) Test Method for the Assessment of 2D Data Matrix Direct Mark QualityPublished 09/28/2012Region of Action- NA
5361Reapproval of SEMI T17-0706, Specification of Substrate TraceabilityPublished 08/16/2012Region of Action- Japan
5362Reapproval of SEMI T18-1106, Specification of Parts and Components TraceabilityPublished 08/16/2012Region of Action- Japan
5365Line Item Revision to SEMI T15-0705, General Specification of Jig ID: ConceptSee Line Items Below Region of Action- Japan
5365
LI - 1
Adding 7.1.2.5 in section 7Published 08/17/2012Region of Action- Japan
5383Revision to Add a New Subordinate Standard Specification for Reduce Space Marking of Product Packages to SEMI G83-0308, Specification for Bar Code Marking of Product PackagesPublished as SEMI G83.1-0912 09/19/2012Region of Action- Japan
5487New Standards: Specification for Basic Protocols to Support the Interoperation of Traceability Systems Necessary for Managing Product Identity throughout the Life Cycle of Objects Using Digital Signatures and Time Stamps Failed Technical Review and Returned to TF 04/23/2013Region of Action- Japan
5487ANew Standards: Specification for Basic Protocols to Support the Interoperation of Traceability Systems Necessary for Managing Product Identity throughout the Life Cycle of Objects Using Digital Signatures and Time Stamps Failed Technical Review and Returned to TF 07/11/2013Region of Action- Japan
5581Revision of SEMI T3-0302 (Reapproved 1108), Specification for Wafer Box LabelsPublished 12/13/2013Region of Action- NA
5582Reapproval of SEMI T4-0301 (Reapproved 0307), Specification for 150 mm and 200 mm Pod Identification DimensionsPublished 12/13/2013Region of Action- NA
5612Reapproval of SEMI T7-0303 (Reapproved 0709), Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code SymbolFailed Technical Review and Returned to TF 07/10/2014Region of Action- NA
5613Reapproval of SEMI T11-0703 (Reapproved 0709), Specification for Marking of Hard Surface Reticle SubstratesPublished 10/30/2014Region of Action- NA
5652Addition of New Related Information: Example of Track and Traceability Supply Chain System to SEMI T21 Specification for Authentication of Semiconductors and Related ProductsPublished 03/28/2014Region of Action- Japan
5689Line Item Revision of SEMI T5-1106 (Reapproved 1111), Specification for Alphanumeric Marking of Round Compound Semiconductor WafersSee Line Items Below Region of Action- NA
5689
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Update table 1 by adding Back Surface for 150 mm waferPublished 12/05/2014Region of Action- NA
5752Revision of SEMI T7-0303 (Reapproved 0709), Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code SymbolPassed Technical Review - Awaiting Procedural Review 12/05/2014Region of Action- NA