SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for Automation Technology CommitteeAutomation Technology Committee
SNARF Doc 6672 - Line Item Revision to SEMI A2-mmyy (Doc. #6630) Specification for Surface Mount Assembler Smart Hookup (SMASH)
SNARF Doc 6673 - New Standard: SPECIFICATION FOR FACTORY OPERATION EXTENSION FOR SEMI A2 SMASH (SMASH-FOX)
Hide details for Compound Semiconductor Materials CommitteeCompound Semiconductor Materials Committee
TFOF SiC Epitaxial Wafer Task Force
TFOF Silicon Carbide Substrate Task Force
Hide details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
SNARF Doc 6675 - Reapproval of SEMI D9-0303 (Reapproved 0515) “Terminology for FPD Substrates”
Hide details for FPD - Metrology CommitteeFPD - Metrology Committee
TFOF Picture Quality Evaluation Task Force
Hide details for Information & Control CommitteeInformation & Control Committee
SNARF Doc 6682 - Line Item Revision to E142-XXXX: Specification for Substrate Mapping, E142.1-1016 XML Schema for Substrate Mapping and E142.2-1016 SECS II Protocol for Substrate Mapping
SNARF Doc 6683 - Line Item Revision to Standard SEMI E148-1109 (Reapproved 0614)
SPECIFICATION FOR TIME SYNCHRONIZATION AND DEFINITION OF
THE TS-CLOCK OBJECT
Hide details for Liquid Chemicals CommitteeLiquid Chemicals Committee
SNARF Doc 6602 - New Standard: Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals
SNARF Doc 6646 - New Standard: Guide for Reporting Density and Porosity of the Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing
SNARF Doc 6677 - New Standard: Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks used in Semiconductor Manufacturing
Hide details for Metrics CommitteeMetrics Committee
SNARF Doc 6676 - Revision to SEMI E136-1104 (Reapproved 0512)
TEST METHOD FOR DETERMINING THE OUTPUT POWER OF RF
GENERATORS USED IN SEMICONDUCTOR PROCESSING
EQUIPMENT RF POWER DELIVERY SYSTEMS
SNARF Doc 6678 - Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
SNARF Doc 6679 - Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
Hide details for Photovoltaic CommitteePhotovoltaic Committee
SNARF Doc 6660 - Reapproval of SEMI PV61-0115, Specification for Framing Tape for Photovoltaic(PV)Modules
SNARF Doc 6661 - Reapproval of SEMI PV62-0215, Terminology for Back Contact Photovoltaic (PV) Cells and Modules
SNARF Doc 6664 - Reapproval of SEMI PV65-0715, Test Method Based on RGB for C-Si Solar Cell Color
SNARF Doc 6665 - Reapproval of SEMI PV66-0715, Test Method for Determining the Aspect Ratio of Solar Cell Metal Fingers by Confocal Laser Scanning Microscope
SNARF Doc 6666 - Reapproval of SEMI PV67-0815, Test Method for the Etch Rate of a Crystalline Silicon Wafer by Determining the Weight Loss
SNARF Doc 6667 - Reapproval of SEMI PV68-0815, Test Method for the Wire Tension of Multi-Wire Saws
SNARF Doc 6670 - Revision to SEMI PV58-0115, Specification for Aluminum Paste, Used in Back Surface Field of Crystalline Silicon Solar Cells
SNARF Doc 6671 - Revision to SEMI PV63-0215,Specification for UL TRA-THIN Glasses Used for Photovoltaic Modules
Hide details for Photovoltaic (PV) - Materials CommitteePhotovoltaic (PV) - Materials Committee
SNARF Doc 6662 - Reapproval of SEMI PV59-0115, Test Method for Determination of Total Carbon Content in Silicon Powder by Infrared Absorption after Combustion in an Induction Furnace.
SNARF Doc 6663 - Reapproval of SEMI PV64-0715, Test Method for Determining B, P, Fe, Al, Ca Contents in Silicon Powder for PV Applications by Inductively Coupled Plasma Optical Emission Spectrometry
SNARF Doc 6668 - Reapproval of SEMI PV74-0216, Test Method for the Measurement of Chlorine in Silicon by Ion Chromatography
Hide details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
SNARF Doc 6684 - New Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING
SNARF Doc 6685 - New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 510MM-515MM PANEL SIZE
SNARF Doc 6686 - New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 600MM-600MM PANEL SIZE
SNARF Doc 6688 - New Standard - SPECIFICATION FOR 300mm TAPE FRAME FOUP LOAD PORT
SNARF Doc 6689 - New Standard – SPECIFICATION FOR 300mm TAPE FRAME FOUP
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
SNARF Doc 6680 - Reapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA
SNARF Doc 6681 - Reapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
Hide details for Traceability CommitteeTraceability Committee
SNARF Doc 6669 - Revision of SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers
SNARF Doc 6674 - New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications
TFOF Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.