 | | | | | | | |
 | 3DS-IC Committee |
| |
| TFOF | | | | | 3DS IC Testing Task Force |  |
 | Compound Semiconductor Materials Committee |
| |
| SNARF | | | | | Doc 5370 - Specification for 150mm Silicon Carbide single-crystalline substrates |  |
 | EH&S Committee |
| |
| SNARF | | | | | Doc 5357 - Line Item Revisions to SEMI S2-0310, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. Delayed Revisions Related to Non-Ionizing Radiation |  |
| SNARF | | | | | Doc 5374 - Reapproval of SEMI S16-0307, Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life |  |
| TFOF | | | | | LED Safety Task Force |  |
| TFOF | | | | | PV Safety Task Force |  |
 | Facilities Committee |
| |
| SNARF | | | | | Doc 5026 - Revision to SEMI F1-96, Specification for Leak Integrity of High-Purity Gas Piping Systems and Components |  |
| SNARF | | | | | Doc 5373 - Reapproval of SEMI F45-0307, Specification for Machined Stainless Steel Reducing Weld Fittings |  |
 | Flat Panel Display (FPD) - Metrology Committee |
| |
| SNARF | | | | | Doc 5336 - New Standard: Test Method for Optical Characteristics of LCD Panel |  |
| SNARF | | | | | Doc 5337 - New Standard: Test Method for Optical Characteristics of Transparent Display |  |
| SNARF | | | | | Doc 5379 - Revision to SEMI D36, Terminology for LCD Backlight Unit |  |
| TFOF | | | | | Optical Characteristic Measurement Task Force |  |
 | Gases Committee |
| |
| SNARF | | | | | Doc 5345 - Reapproval of SEMI C3-0699, Specifications for Gases |  |
| SNARF | | | | | Doc 5346 - Reapproval of SEMI F23-0697 (Reapproved 0303), Particle Specification for Grade 10/0.2 Flammable Specialty Gases |  |
| SNARF | | | | | Doc 5347 - Reapproval of SEMI F24-0697 (Reapproved 0303), Particle Specification for Grade 10/0.2 Inert Specialty Gases |  |
| SNARF | | | | | Doc 5348 - Reapproval of SEMI F25-0697 (Reapproved 0303), Particle Specification for Grade 10/0.2 Oxidant Specialty Gases |  |
| SNARF | | | | | Doc 5349 - Reapproval of SEMI F26-0697 (Reapproved 0303), Particle Specification for Grade 10/0.2 Toxic Specialty Gases |  |
 | HB-LED Committee |
| |
| TFOF | | | | | Impurities and Defects in HB-LED Sapphire Wafers |  |
 | Information & Control Committee |
| |
| SNARF | | | | | Doc 5101 - Revisions to SEMI E5, SEMI Equipment Communications Standard 2 Message Content (SECS-II) and SEMI E30, Generic Model for Communications and Control of Manufacturing Equipment (GEM). Correcting maximum length of a data item in E5 and E30 |  |
| SNARF | | | | | Doc 5103 - New E54.x Standard: Specification for Sensor/Actuator Network Specific Device Model for Pressure Control Valves |  |
| SNARF | | | | | Doc 5367 - Line item revision to E87, SPECIFICATION FOR CARRIER MANAGEMENT (CMS). Load Port Transfer Error Indication. |  |
| SNARF | | | | | Doc 5368 - Reapproval of SEMI E118-1104E SPECIFICATION FOR WAFER ID READER
COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E118.1-1104 SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS |  |
| SNARF | | | | | Doc 5369 - Revision to SEMI E54.17-0706 (Reapproved 1211): SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK |  |
| TFOF | | | | | Energy Saving Equipment Communication Task Force |  |
| TFOF | | | | | Equipment Information System Security (EISS) Task Force |  |
| TFOF | | | | | Sensor Bus Task Force |  |
 | Liquid Chemicals Committee |
| |
| SNARF | | | | | Doc 5324 - New Standard: Guide for Cyclopentanone |  |
| SNARF | | | | | Doc 5325 - New Standard: Guide For Dimethyl Dimethoxy Silane (DMDMOS) |  |
| SNARF | | | | | Doc 5326 - New Standard: Guide for Methyl Isobutyl Carbinol (MIBC) or 4-Methyl 2-Pentanol |  |
| SNARF | | | | | Doc 5327 - New Standard: Guide for Monomethyl Silane |  |
| SNARF | | | | | Doc 5328 - New Standard: Guide for Tetrakis(Dimethylamino) Silane (TDMAS) |  |
| SNARF | | | | | Doc 5329 - New Standard: Guide for Tris(Dimethylamino) Silane (3DMAS) |  |
| SNARF | | | | | Doc 5354 - Revision to SEMI C47-0706, Guideline for Trans 1, 2 Dichloroethylene |  |
| SNARF | | | | | Doc 5355 - Revision to SEMI C48-0706, Specification and Guideline for 1,1,1-Trichloroethane, Furnace Grade |  |
| SNARF | | | | | Doc 5356 - Revision to SEMI C51-0706, Specifications and Guidelines for Xylenes |  |
| SNARF | | | | | Doc 5371 - New Standard: Test Method for Tensile Strength Applied to Welded Connections Made by PFA Weld Fitting |  |
| TFOF | | | | | SEMI F39 & F41 Re-Write Task Force |  |
 | MEMS Committee |
| |
| SNARF | | | | | Doc 5352 - Reapproval of SEMI MS1-0307, Guide to Specifying Wafer-Wafer Bonding Alignment Targets |  |
 | MEMS / NEMS Committee |
| |
| TFOF | | | | | NA MEMS / NEMS Committee for 5-Year Review |  |
 | Metrics Committee |
| |
| SNARF | | | | | Doc 5340 - Revision to SEMI E10 to add Multi-Path Cluster Tool calculation examples |  |
| SNARF | | | | | Doc 5341 - SEMI E79 (Productivity and OEE) Revision and Reconciliation with SEMI E10 |  |
| TFOF | | | | | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |  |
 | Micropatterning Committee |
| |
| SNARF | | | | | Doc 5366 - Revision to SEMI P45-0211, SPECIFICATION FOR JOB DECK DATA FORMAT FOR MASK TOOLS |  |
 | Photovoltaic Committee |
| |
| SNARF | | | | | Doc 5073 - Revision of SEMI PV9-1110 - Test Method for Excess Charge Carrier Decay in PV Silicon Materials by Non-Contact Measurements of Microwave Reflectance After a Short Illumination Pulse |  |
 | Photovoltaic (PV) - Automation Committee |
| |
| SNARF | | | | | Doc 5222 - New Subordinate Standard: Data Definition Specifications for a Horizontal Communication between Equipment for Larger Sized Substrate Oriented Photovoltaic Fabrication System to Doc.4804 "Specification for a Horizontal Communication between Equipment for Photovoltaic Fabrication System" |  |
| SNARF | | | | | Doc 5223 - New Subordinate Standard: Media Interface Specifications for a Horizontal Communication between Equipment for Larger Sized Substrate Oriented Photovoltaic Fabrication System to Doc.4804 "Specification for a Horizontal Communication between Equipment for Photovoltaic Fabrication System" |  |
| SNARF | | | | | Doc 5338 - Practice for Assigning Identification Numbers to PV Silicon Wafer and Solar Cell Manufacturers |  |
 | Photovoltaic (PV) - Materials Committee |
| |
| SNARF | | | | | Doc 5330 - New Standard: Test Method for In-Line Measurement of Micro Cracks of PV Silicon Wafers by Infrared Imaging |  |
| SNARF | | | | | Doc 5331 - New Standard: Test Method for In-Line Measurement of Saw Marks on Pv Silicon Wafers by a Light Sectioning Technique |  |
| SNARF | | | | | Doc 5332 - New Standard: Test Method for In-Line Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications |  |
| SNARF | | | | | Doc 5333 - New Standard: Test Method for In-Line Measurement of Waviness on PV Silicon Wafers by a Light Sectioning Technique |  |
| SNARF | | | | | Doc 5334 - Revision of SEMI PV18-0811, Guide for Specifying a Photovoltaic Connector Ribbon |  |
| SNARF | | | | | Doc 5335 - Revision of SEMI PV19-0811, Guide for Testing Photovoltaic Connector Ribbon Characteristics |  |
| SNARF | | | | | Doc 5381 - Auxiliary Information: Photovoltaic And Semiconductor Shared Gases And Liquid Chemical Standards |  |
 | Physical Interfaces & Carriers Committee |
| |
| SNARF | | | | | Doc 5363 - Removal of SEMI E31-0093: Specification for Electrical Interface, Japan Only |  |
| SNARF | | | | | Doc 5364 - Revision to SEMI E162-1111: Mechanical Interface specification for 450mm Front-Opening Shipping Box Load Port |  |
 | Silicon Wafer Committee |
| |
| SNARF | | | | | Doc 5083 - Reapproval of SEMI MF81-1105 - Test Method for Measuring Radial Resistivity Variation on Silicon Wafers |  |
| SNARF | | | | | Doc 5342 - Revision to M62-1011 Specifications for Silicon Epitaxial Wafers (Addition of 450 mm wafer to Table R2-8 Epi wafer guide for 22nm technology Generation) |  |
| SNARF | | | | | Doc 5343 - Revision to M49, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations (to include Edge Profile Metrics) |  |
| SNARF | | | | | Doc 5344 - New Standard: Test Method for Non-Contact Wafer Diameter Measurement |  |
| SNARF | | | | | Doc 5375 - Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers |  |
| SNARF | | | | | Doc 5376 - Revision Of SEMI M1-1111 Specifications For Polished Single Crystal Silicon Wafers |  |
| SNARF | | | | | Doc 5377 - Revision of SEMI MF397-1106-1111R Test Method For Resistivity Of Silicon Bars Using A Two-Point Probe |  |
| SNARF | | | | | Doc 5378 - Revision of SEMI MF576-0706 Test Method For Measurement Of Insulator Thickness And Refractive Index On Silicon Substrates By Ellipsometry |  |
| SNARF | | | | | Doc 5380 - Withdrawal of SEMI M6-1108 Specification for Silicon Wafers for Use as Photovoltaic Solar Cells |  |
 | Traceability Committee |
| |
| SNARF | | | | | Doc 5350 - Withdrawal of SEMI T4-0301 (Reapproved 0307), Specification for 150 mm and 200 mm Pod Identification Dimensions |  |
| SNARF | | | | | Doc 5351 - Reapproval of SEMI T10-0701 (Reapproved 0307) Test Method for the Assessment of 2D Data Matrix Direct Mark Quality |  |
| SNARF | | | | | Doc 5361 - Reapproval of SEMI T17-0706, Specification of Substrate Traceability |  |
| SNARF | | | | | Doc 5362 - Reapproval of SEMI T18-1106, Specification of Parts and Components Traceability |  |
| SNARF | | | | | Doc 5365 - Line Item Revision to T15-0705, General Specification of Jig ID: Concept |  |