SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for Assembly & Packaging CommitteeAssembly & Packaging Committee
SNARF Doc 6148 - Line Item Revision to SEMI G18-96 (Reapproved 0811) “Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes” with non-conforming title change to “Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes”
SNARF Doc 6149 - Line Item Revision to SEMI G38-0996 (Reapproved 0811) “Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages”
SNARF Doc 6150 - Line Item Revision to SEMI G56-93 (Reapproved 0811) “Test Method for Measurement of Silver Plating Thickness”
SNARF Doc 6151 - Line Item Revision to SEMI G65-96 (Reapproved 0811) “Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages”
SNARF Doc 6152 - Line Item Revision to SEMI G93-0412: “Measurement Method for Solder Sphere Size for Ball Grid Array Package” with non-conforming title change to “Test Method for Solder Sphere Size for Ball Grid Array Package”
SNARF Doc 6153 - Reapproval of SEMI G90-0811: Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
SNARF Doc 6154 - Line Item Revision to SEMI G10-96 (Reapproved 0811): “Standard Method for Mechanical Measurement of Plastic Package Leadframes” with non-conforming title change to “Test Method for Mechanical Measurement of Plastic Package Leadframes”
SNARF Doc 6155 - Line Item Revision to SEMI G62-95 (Reapproved 0811) “Test Method for Silver Plating Quality”
SNARF Doc 6156 - Line Item Revision to SEMI G70-0996 (Reapproved 0811) “Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes” with non-conforming title change to “Specification for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes”
SNARF Doc 6157 - Reapproval of SEMI G23-0996 (Reapproved 0811): Test Method of Inductance for Internal Traces of Semiconductor Packages
SNARF Doc 6158 - Reapproval of SEMI G42-0996 (Reapproved 0811): Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
SNARF Doc 6159 - Reapproval of SEMI G59-94 (Reapproved 0811): Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes
SNARF Doc 6160 - Reapproval of SEMI G60-94 (Reapproved 0811): Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials
SNARF Doc 6161 - Reapproval of SEMI G66-96 (Reapproved 0811): Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
SNARF Doc 6162 - Reapproval of SEMI G67-0996 (Reapproved 0811): Test Method for the Measurement of Particle Generation from Sheet Materials
SNARF Doc 6163 - Reapproval of SEMI G68-0996 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages
SNARF Doc 6164 - Reapproval of SEMI G69-0996 (Reapproved 0811): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
SNARF Doc 6165 - Reapproval of SEMI G71-0996 (Reapproved 0811): Specification for Barcode Marking of Intermediate Containers for Packaging Materials
SNARF Doc 6166 - Reapproval of SEMI G89-0211: Specification for Leadframe Strip Size
SNARF Doc 6167 - Line Item Revision to SEMI G73-0997 (Reapproved 0811) “Test Method for Pull Strength for Wire Bonding”
Hide details for Automation Technology CommitteeAutomation Technology Committee
SNARF Doc 6088 - Line Item Revision to SEMI PV35-0215: Specification for Horizontal Communication between Equipment for Photovoltaic Fabrication System, including its subordinate document PV35.1-0215 with designation letter change and non-conforming title change
Hide details for Gases CommitteeGases Committee
SNARF Doc 6056 - Revision to SEMI E28-1110, Guide for Pressure Specifications of the Mass Flow Controller
with Title Change to Guide for Pressure Parameters of the Mass Flow Controller
SNARF Doc 6119 - Revision to SEMI E17-1011, Guide for Mass Flow Controller Transient Characteristics Tests with Title Change to Test Method for Measurement of Mass Flow Controller Transient Characteristics
Hide details for Information & Control CommitteeInformation & Control Committee
SNARF Doc 6124 - Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor Manufacturing Equipment
SNARF Doc 6135 - To add R1-8 to Related Information 1 INCREMENTAL IMPLEMENTATION STEPS of
SEMI E170: SPECIFICATION FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM (SFORMS).
SNARF Doc 6147 - New Standard: Specification of Backend Die Traceability
Hide details for Liquid Chemicals CommitteeLiquid Chemicals Committee
SNARF Doc 6129 - Revision to SEMI F61-0301 (Reapproved 0309) Guide for Ultrapure Water System Used in Semiconductor Processing, with title change to: Guide to Design and Operation of a Semiconductor Ultrapure Water System
SNARF Doc 6136 - Revision to SEMI F98-0305 (Reapproved 1111), Guide for Treatment of Reuse Water in Semiconductor Processing
Hide details for Metrics CommitteeMetrics Committee
SNARF Doc 6144 - Line-item Revision to SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
SNARF Doc 6145 - Line-item Revision to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment
SNARF Doc 6146 - Line-item Revisions to SEMI E35-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment and SEMI E140-0312, Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
Hide details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
SNARF Doc 6130 - Reapproval of SEMI E84-1109: Specification for Enhanced Carrier Handoff Parallel I/O Interface
Hide details for Traceability CommitteeTraceability Committee
SNARF Doc 6117 - Line Item Revision to SEMI T5-1214, Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers
SNARF Doc 6131 - Reapproval of SEMI T22-0212: Specification for Traceability by Self Authentication Service Body and Authentication Service Body


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.