SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3D Packaging and Integration Committee3D Packaging and Integration Committee
SNARF Doc 6332 - New Standard, Specification for Panel Substrate Characteristics for Fan-Out Panel Level Packaging (FO-PLP) Applications
SNARF Doc 6352 - Line Item Revision to SEMI G64-96 (Reapproved 0811) "Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)"
SNARF Doc 6353 - Reapproval of SEMI G94-0113: Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
Show details for EH&S CommitteeEH&S Committee
Show details for Flat Panel Display (FPD) - Metrology CommitteeFlat Panel Display (FPD) - Metrology Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.