SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3DS-IC Committee3DS-IC Committee
SNARF Doc 6075 - New Standard: Guide for Describing Glass-Based Material for Use in 3DS-IC Process
SNARF Doc 6076 - New Standard: Specification for Identification and Marking for Bonded Wafer Stacks
Show details for Assembly & Packaging CommitteeAssembly & Packaging Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Facilities CommitteeFacilities Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Micropatterning CommitteeMicropatterning Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.