SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3DS-IC Committee3DS-IC Committee
SNARF Doc 5692 - New Standard: Guide for Describing Glass Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
SNARF Doc 5693 - New Standard: Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
SNARF Doc 5694 - New Standard: Guide to Describing Materials Properties for 300 mm Wafer Stacks
SNARF Doc 5695 - New Standard: Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
SNARF Doc 5713 - New Standard: Specification of Glass Interposers
Show details for Assembly & Packaging CommitteeAssembly & Packaging Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
Show details for Gases CommitteeGases Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Photovoltaic (PV) - Automation CommitteePhotovoltaic (PV) - Automation Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.