SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3D Packaging and Integration Committee3D Packaging and Integration Committee
SNARF Doc 6829 - Line Item Revision to SEMI 3D16-1116, Specification for Glass Base Material for Semiconductor Packaging
SNARF Doc 6858 - Revision to SEMI G13-88 (Reapproved 0811) with Title Change from “Standard Test Method for Expansion Characteristics of Molding Compounds” to: “Test Method For Thermal Expansion Characteristics Of Molding Compounds”
Show details for Automation Technology CommitteeAutomation Technology Committee
Show details for Compound Semiconductor Materials CommitteeCompound Semiconductor Materials Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for MEMS / NEMS CommitteeMEMS / NEMS Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Micropatterning CommitteeMicropatterning Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.