SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3D Packaging and Integration Committee3D Packaging and Integration Committee
SNARF Doc 6223 - Revision to SEMI G4-0302 (Reapproved 0811): Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SNARF Doc 6224 - Revision to SEMI G11-88 (Reapproved 0811): “Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds” with non-conforming title change to “Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds”
SNARF Doc 6225 - Revision to SEMI G13-88 (Reapproved 0811): “Standard Test Method for Expansion Characteristics of Molding Compounds” with non-conforming title change to “Test Method for Expansion Characteristics of Molding Compounds”
SNARF Doc 6226 - Revision to SEMI G15-93 (Reapproved 0811): “Standard Test Method for Differential Scanning Calorimetry of Molding Compounds” with non-conforming title change to “Test Method for Differential Scanning Calorimetry of Molding Compounds”
SNARF Doc 6227 - Revision to SEMI G24-89 (Reapproved 0811): Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
SNARF Doc 6228 - Revision to SEMI G25-89 (Reapproved 0811): Test Method for Measuring the Resistance of Package Leads
SNARF Doc 6229 - Revision to SEMI G28-0997 (Reapproved 0811): Specification for Leadframes for Plastic Molded S.O. Packages
SNARF Doc 6230 - Revision to SEMI G43-87 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
SNARF Doc 6231 - Revision to SEMI G51-90 (Reapproved 0811): Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SNARF Doc 6232 - Revision to SEMI G55-93 (Reapproved 0811): Test Method for Measurement of Silver Plating Brightness
SNARF Doc 6233 - Line Item Revision to SEMI G29-1296E (Reapproved 0811): Test Method for Trace Contaminants in Molding Compounds
Show details for Automation Technology CommitteeAutomation Technology Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Facilities CommitteeFacilities Committee
Show details for Flat Panel Display (FPD) - Metrology CommitteeFlat Panel Display (FPD) - Metrology Committee
Show details for Gases CommitteeGases Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Micropatterning CommitteeMicropatterning Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.