SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Hide details for 3D Packaging and Integration Committee3D Packaging and Integration Committee
SNARF Doc 6223 - Revision to SEMI G4-0302 (Reapproved 0811): Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SNARF Doc 6224 - Revision to SEMI G11-88 (Reapproved 0811): “Recommended Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds” with non-conforming title change to “Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds”
SNARF Doc 6225 - Revision to SEMI G13-88 (Reapproved 0811): “Standard Test Method for Expansion Characteristics of Molding Compounds” with non-conforming title change to “Test Method for Expansion Characteristics of Molding Compounds”
SNARF Doc 6226 - Revision to SEMI G15-93 (Reapproved 0811): “Standard Test Method for Differential Scanning Calorimetry of Molding Compounds” with non-conforming title change to “Test Method for Differential Scanning Calorimetry of Molding Compounds”
SNARF Doc 6227 - Revision to SEMI G24-89 (Reapproved 0811): Test Method for Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
SNARF Doc 6228 - Revision to SEMI G25-89 (Reapproved 0811): Test Method for Measuring the Resistance of Package Leads
SNARF Doc 6229 - Revision to SEMI G28-0997 (Reapproved 0811): Specification for Leadframes for Plastic Molded S.O. Packages
SNARF Doc 6230 - Revision to SEMI G43-87 (Reapproved 0811): Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages
SNARF Doc 6231 - Revision to SEMI G51-90 (Reapproved 0811): Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes
SNARF Doc 6232 - Revision to SEMI G55-93 (Reapproved 0811): Test Method for Measurement of Silver Plating Brightness
SNARF Doc 6233 - Line Item Revision to SEMI G29-1296E (Reapproved 0811): Test Method for Trace Contaminants in Molding Compounds
Show details for Automation Technology CommitteeAutomation Technology Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Facilities CommitteeFacilities Committee
Show details for Flat Panel Display (FPD) - Metrology CommitteeFlat Panel Display (FPD) - Metrology Committee
Show details for Gases CommitteeGases Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Micropatterning CommitteeMicropatterning Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Photovoltaic (PV) - Materials CommitteePhotovoltaic (PV) - Materials Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.