SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3DS-IC Committee3DS-IC Committee
Show details for Assembly & Packaging CommitteeAssembly & Packaging Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for MEMS / NEMS CommitteeMEMS / NEMS Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Photovoltaic (PV) - Materials CommitteePhotovoltaic (PV) - Materials Committee
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
SNARF Doc 5915 - Line Item Revision to SEMI M1-1016, Addition to Related Information: Illustration of Flatness Metrics for Silicon Wafers
SNARF Doc 6168 - Line Item revision to add new Related Information about area (sector) exclusions for the ERO-related standards M67-1015: Test Method For Determining Wafer Near-Edge Geometry From A Measured Thickness Data Array Using The ESFQR, ESFQD AND ESBIR Metrics and M68-1015 Test Method For Determining Wafer Near-Edge Geometry From A Measured Height Data Array Using A Curvature Metric, ZDD
SNARF Doc 6169 - Line Item Revision to MF1390-1014: Test Method For Measuring Bow And Warp On Silicon Wafer By Automated Noncontact Scanning to add Bow Bestfit metric
SNARF Doc 6170 - Line item Revision to SEMI M49 “Guide For Specifying Geometry Measurement Systems For Silicon Wafers For The 130 nm TO 16 nm Technology Generations


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.