SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3DS-IC Committee3DS-IC Committee
Show details for Assembly & Packaging CommitteeAssembly & Packaging Committee
Show details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for MEMS / NEMS CommitteeMEMS / NEMS Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Photovoltaic (PV) - Materials CommitteePhotovoltaic (PV) - Materials Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
SNARF Doc 5540 - Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers (Addition to Appendices 1 and 3: Illustration of Flatness and Shape Metrics for Silicon Wafers)
SNARF Doc 5705 - Revision of SEMI M67-1109 Practice for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics with Title Change to Test Method
SNARF Doc 5706 - Revision of SEMI M70-1109 Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness with Title Change to Test Method
SNARF Doc 5769 - New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption
SNARF Doc 5770 - New Standard: Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers
SNARF Doc 5771 - Revision to SEMI M80-0514, Mechanical Specification for Front-Opening Shipping Box used to Transport and Ship 450 mm Wafers with Title Change to Specification for Front-Opening Shipping Box used to Transport and Ship 450mm Wafers
SNARF Doc 5772 - Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
SNARF Doc 5774 - New Standard: Sample Preparation Method for Minority Carrier Diffusion Length Measurement in Silicon Wafers by Surface Photovoltage Method
SNARF Doc 5794 - New Standard: Specification Of Developmental 450mm Diameter Polished Single Crystal Notchless Silicon Wafers With Back Surface Fiducial Marks
SNARF Doc 5804 - Line Item Revision of SEMI M53-0310, Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodisperse Reference Spheres on Unpatterned Semiconductor Wafer Surfaces
SNARF Doc 5805 - Line Item Revision of SEMI M50-0310, Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
SNARF Doc 5806 - Revision of SEMI M68-1214, Practice for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using using a curvature metric, ZDD with Title Change to Test Method
SNARF Doc 5807 - Revision for M77 -1110 Practice For Determining Wafer Near-Edge Geometry Using Roll-Off Amount ROA with change of title from PRACTICE to TEST METHOD.


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.