SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3D Packaging and Integration Committee3D Packaging and Integration Committee
Show details for Automation Technology CommitteeAutomation Technology Committee
Show details for Compound Semiconductor Materials CommitteeCompound Semiconductor Materials Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Facilities CommitteeFacilities Committee
Show details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
Show details for Flat Panel Display (FPD) - Metrology CommitteeFlat Panel Display (FPD) - Metrology Committee
Show details for Flexible Hybrid Electronics (FHE) CommitteeFlexible Hybrid Electronics (FHE) Committee
Show details for FPD - Metrology CommitteeFPD - Metrology Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Hide details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
SNARF Doc 7170 - Line-Item Revision to SEMI E184 -1221E Specification for 300 mm Tape Frame FOUP Load Port
SNARF Doc 7171 - Line-Item Revision to SEMI E185 -1222 Specification for 300 mm Tape Frame FOUP
SNARF Doc 7172 - New Standard: Specification for Next Gen Assembly / Test Carrier
TFOF Next Gen Assembly / Test Material Handling Task Force
Show details for Silicon Wafer CommitteeSilicon Wafer Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.