SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3DS-IC Committee3DS-IC Committee
Hide details for Assembly & Packaging CommitteeAssembly & Packaging Committee
SNARF Doc 6027 - Line Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SNARF Doc 6028 - Line Item Revision to SEMI G97-0116: SPECIFICATION FOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING
SNARF Doc 6029 - Reapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer
SNARF Doc 6030 - Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)
SNARF Doc 6031 - Revision to SEMI G21-0094: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SNARF Doc 6032 - Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
Show details for Compound Semiconductor Materials CommitteeCompound Semiconductor Materials Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for MEMS / NEMS CommitteeMEMS / NEMS Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Photovoltaic (PV) - Materials CommitteePhotovoltaic (PV) - Materials Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.