SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3DS-IC Committee3DS-IC Committee
Hide details for Assembly & Packaging CommitteeAssembly & Packaging Committee
SNARF Doc 6027 - Line Item Revision to SEMI G86-0303 (Reapproved 0811): Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending
SNARF Doc 6028 - Line Item Revision to SEMI G97-0116: SPECIFICATION FOR ADHESIVE TRAY USED FOR THIN CHIP HANDLING
SNARF Doc 6029 - Reapproval of SEMI G88-0211: Specification for Tape Frame for 450 mm Wafer
SNARF Doc 6030 - Revision to SEMI G20-96: SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)
SNARF Doc 6031 - Revision to SEMI G21-0094: SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SNARF Doc 6032 - Revision to SEMI G41-87: SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
SNARF Doc 6063 - Reapproval of SEMI G76-0299 (Reapproved 0706): Specification for Polyimide-Based Adhesive Tape Used in Tape Carrier Packages (TCP)
Show details for EH&S CommitteeEH&S Committee
Show details for Facilities CommitteeFacilities Committee
Show details for Gases CommitteeGases Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Micropatterning CommitteeMicropatterning Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.