SEMI International Standards
New Task Forces and Activities


Below you will find a list of recently created Standards task forces and new activities. Please click on a particular task force or document, for more information.

Show details for 3DS-IC Committee3DS-IC Committee
Hide details for Assembly & Packaging CommitteeAssembly & Packaging Committee
SNARF Doc 5753 - Reapproval of SEMI G74-0699 (Reapproved 0706) - Specification for Tape Frame for 300 mm Wafers
SNARF Doc 5754 - Reapproval of SEMI G77-0699 (Reapproved 0706) - Specification for Frame Cassette for 300 mm Wafers
SNARF Doc 5755 - Reapproval of SEMI G81-0307 Specification for Map Data Items
SNARF Doc 5756 - Reapproval of SEMI G81.1-0307 - Specification of Grand Concept of Map Data for Characteristics of Dice on Substrate
SNARF Doc 5757 - Reapproval of SEMI G87-1108 Specification for Plastic Tape Frame for 300 mm Wafer
SNARF Doc 5780 - Reapproval of G75-0698 (Reapproved 0706) Standard Test Method of the Properties of Leadframe Tape
SNARF Doc 5781 - Reapproval of G75.01-0698 (Reapproved 0706)Test Method for Measurement of Ionic Impurities in Leadframe Tape
SNARF Doc 5782 - Reapproval of G75.02-0698 (Reapproved 0706)Test Method for Measurment of Adhesive Strength of Leadframe Tape
SNARF Doc 5783 - Reapproval of G75.03-0698 (Reapproved 0706) Test Method for Measurment of The Peel Strength of Protective Film on Leadframe Tape
SNARF Doc 5784 - Reapproval of G75.04-0698 (Reapproved 0706) Test Method for Measurment of Water Absorption of Leadframe Tape
SNARF Doc 5785 - Reapproval of G75.05-0698 (Reapproved 0706) Test Method for Measurment of Weight Loss of Leadframe Tape
SNARF Doc 5786 - Reapproval of G75.06-0698 (Reapproved 0706) Test Method for Measurment of the Shrinkage Factor of Leadframe Tape
SNARF Doc 5787 - Reapproval of G75.07-0698 (Reapproved 0706) Test Method for Measurment of Thermal Decomposition Temperature of Leadframe Tape and Aehesive
SNARF Doc 5788 - Reapproval of G75.08-0698 (Reapproved 0706) Test Method for Measurment of the Coefficient of Thermal Expansion and Glass Transition Temperature of Leadframe Tape
SNARF Doc 5789 - Reapproval of G75.09-0698 (Reapproved 0706) Test Method for Measurment of Tensile Strength
SNARF Doc 5790 - Reapproval of G75.10-0698 (Reapproved 0706) Test Method for Measurment of Volume and Surface Resistivity of the Leadframe Tape
SNARF Doc 5791 - Reapproval of G75.11-0698 (Reapproved 0706) Test Method for Measurment of the Dielectric Constant and Dissipation Factor of the Leadframe Tape
SNARF Doc 5792 - Reapproval of G75.12-0698 (Reapproved 0706) Test Method for Measurment of Breakdown Strength of Leadframe Tape
SNARF Doc 5793 - Reapproval of G75.13-0698 (Reapproved 0706) Test Method for Measurment of the Leakage Current in Leadframe Tape
Show details for Compound Semiconductor Materials CommitteeCompound Semiconductor Materials Committee
Show details for EH&S CommitteeEH&S Committee
Show details for Flat Panel Display (FPD) - Materials & Components CommitteeFlat Panel Display (FPD) - Materials & Components Committee
Show details for HB-LED CommitteeHB-LED Committee
Show details for Information & Control CommitteeInformation & Control Committee
Show details for Liquid Chemicals CommitteeLiquid Chemicals Committee
Show details for Metrics CommitteeMetrics Committee
Show details for Photovoltaic CommitteePhotovoltaic Committee
Show details for Physical Interfaces & Carriers CommitteePhysical Interfaces & Carriers Committee
Show details for Silicon Wafer CommitteeSilicon Wafer Committee
Show details for Traceability CommitteeTraceability Committee


If you have any questions concerning a specifc task force or document, please contact a SEMI Standards staff nearest you.