SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)
Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.
The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.
If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the
contact information page
(DOC 115K) (Feb 2020)
(DOC 133K) (Nov 2021)
The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.
1. Click on the "twistie"
to view the items under each heading.
2. To use the display navigator bar, click on:
EXPAND - to expand all sections
COLLAPSE - to collapse all sections.
3D Packaging and Integration
3D Packaging & Integration 5 Year Review Task Force
3DS IC Bonded Layer Inspection Metrology TF
Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging
JA 450mm Assembly and Test Die Preparation Task Force
Panel Level Packaging (PLP) Glass Carrier Task Force
Thin Chip Handling Task Force
Automated Test Equipment
Compound Semiconductor Materials
Flat Panel Display (FPD) - Materials & Components
Flat Panel Display (FPD) - Metrology
Flexible Hybrid Electronics (FHE)
Information & Control
MEMS / NEMS
Photovoltaic (PV) - Materials
Physical Interfaces & Carriers
Back to SEMI Standards Committee Info
Email this Page
Print this Page
Copyright ©2021 Semiconductor Equipment and Materials International (SEMI®). All rights reserved.