SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms
TFOF (DOC 115K) (June 2018)
SNARF (DOC 133K) (Feb 2019)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Show details for 3D Packaging and Integration3D Packaging and Integration
Show details for Automated Test EquipmentAutomated Test Equipment
Show details for Automation TechnologyAutomation Technology
Show details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Hide details for EH&SEH&S
Show details for JapanJapan
Show details for Japan and North AmericaJapan and North America
Hide details for North AmericaNorth America
Show details for Control of Hazardous Energy (CoHE) Task ForceControl of Hazardous Energy (CoHE) Task Force
Show details for Energetic Materials EHS Task ForceEnergetic Materials EHS Task Force
Show details for Ergonomics Task ForceErgonomics Task Force
Show details for Fire Protection Task ForceFire Protection Task Force
Show details for Lifting Equipment Task ForceLifting Equipment Task Force
Show details for Manufacturing Equipment Safety SubcommitteeManufacturing Equipment Safety Subcommittee
Show details for NA Environmental Health and Safety CommitteeNA Environmental Health and Safety Committee
Show details for Restriction of Materials Task ForceRestriction of Materials Task Force
Show details for S10 Task ForceS10 Task Force
Show details for S2 Chemical Exposure Task ForceS2 Chemical Exposure Task Force
Show details for S2 Interlock and Safety Control Systems Reliability SelectionS2 Interlock and Safety Control Systems Reliability Selection
Show details for S2 Korean High Pressure Gas Safety Task ForceS2 Korean High Pressure Gas Safety Task Force
Show details for S2 Ladders & Steps Task ForceS2 Ladders & Steps Task Force
Show details for S2 Mechanical Design Task ForceS2 Mechanical Design Task Force
Show details for S2 Non-Ionizing Radiation Task ForceS2 Non-Ionizing Radiation Task Force
Show details for S2 Pressure Guidelines Task ForceS2 Pressure Guidelines Task Force
Show details for S22 Task ForceS22 Task Force
Show details for S23 Revision Global Task ForceS23 Revision Global Task Force
Show details for S3 Revision Task ForceS3 Revision Task Force
Show details for S6 Revision Task ForceS6 Revision Task Force
Show details for Seismic Liaison Task ForceSeismic Liaison Task Force
Show details for TaiwanTaiwan
Show details for FacilitiesFacilities
Show details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Show details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Show details for FPD - Materials & ComponentsFPD - Materials & Components
Show details for GasesGases
Show details for HB-LEDHB-LED
Show details for Information & ControlInformation & Control
Show details for Liquid ChemicalsLiquid Chemicals
Show details for MEMS / NEMSMEMS / NEMS
Show details for MetricsMetrics
Show details for MicropatterningMicropatterning
Show details for PhotovoltaicPhotovoltaic
Show details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
Show details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Show details for Silicon WaferSilicon Wafer
Show details for TraceabilityTraceability

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