EVENTS & TRADE SHOWS
SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)
Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.
The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.
If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the
contact information page
The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.
1. Click on the "twistie"
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2. To use the display navigator bar, click on:
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Assembly & Packaging
Fiducial Mark Interoperability Task Force
Handling and Packing Materials for Assembling Advanced Electronic Device under Clean Environment
JA 450mm Assembly and Test Die Preparation Task Force
Leadframe strip size Task Force
Packages and Packaging Materials Eco-efficiency Task Force
Packaging 5 Year Review Task Force
Solder Sphere Size Measurement Taskforce
Thin Chip Die Bending Strength Measurement Method Task Force
Wafer Shipping Container for Assembly & Packaging Task Force (SCAP TF)
Automated Test Equipment
Compound Semiconductor Materials
Flat Panel Display (FPD) - Mask
Flat Panel Display (FPD) - Materials & Components
Flat Panel Display (FPD) - Metrology
Information & Control
MEMS / NEMS
Photovoltaic (PV) - Automation
Photovoltaic (PV) - Materials
Physical Interfaces & Carriers
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