SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)
Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.
The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.
If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the
contact information page
(DOC 115K) (Feb 2020)
(DOC 133K) (Nov 2021)
The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.
1. Click on the "twistie"
to view the items under each heading.
2. To use the display navigator bar, click on:
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3D Packaging and Integration
Automated Test Equipment
Compound Semiconductor Materials
Flat Panel Display (FPD) - Materials & Components
Flat Panel Display (FPD) - Metrology
Flexible Hybrid Electronics (FHE)
Information & Control
MEMS / NEMS
Photovoltaic (PV) - Materials
Physical Interfaces & Carriers
International Test Methods Task Force
New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique
Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
JA Shipping Box Task Force
Japan AWG Task Force
Japan TC Chapter of Global Technical Tommittee
Japan Test Method Task Force
Test Method Task Force
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