SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)
Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.
The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.
If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the
contact information page
(DOC 115K) (Feb 2020)
(DOC 133K) (Nov 2021)
The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.
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3D Packaging and Integration
Automated Test Equipment
Compound Semiconductor Materials
Flat Panel Display (FPD) - Materials & Components
Flat Panel Display (FPD) - Metrology
Flexible Hybrid Electronics (FHE)
Information & Control
MEMS / NEMS
Photovoltaic (PV) - Materials
Physical Interfaces & Carriers
International Automated Advanced Surface Inspection Task Force
Line Item Revision of SEMI MF1048 - Test Method for Measuring the Reflective Total Integrated Scatter
Line Item Revision of SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
Line Item Revision of SEMI ME1392 - Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces
Line Item Revision of SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations
International SOI Wafers Task Force
International Test Methods Task Force
Silicon Wafer Committee
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