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 | 3D Packaging and Integration |
| |
|
|
| Japan |
| |
|
|
| 3D Packaging & Integration 5 Year Review Task Force |
| |
| | | 6703 | | Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” | |
| | | 6858 | | Revision to SEMI G13-88 (Reapproved 0811) with Title Change from “Standard Test Method for Expansion Characteristics of Molding Compounds” to: “Test Method For Thermal Expansion Characteristics Of Molding Compounds” | |
| | | 6867 | | Reapproval of SEMI G86-0217, Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending | |
| | | TFOF | | 3D Packaging & Integration 5 Year Review Task Force | |
|
|
| 3DS IC Bonded Layer Inspection Metrology TF |
| |
| | | TFOF | | 3DS IC Bonded Layer Inspection Metrology TF | |
|
|
| Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging |
| |
| | | 6706 | | New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials | |
| | | 6707 | | New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6708 | | New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6709 | | New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6710 | | New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials | |
| | | 6711 | | New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6712 | | New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | TFOF | | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging | |
|
|
| JA 450mm Assembly and Test Die Preparation Task Force |
| |
| | | TFOF | | JA 450mm Assembly and Test Die Preparation Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier Task Force |
| |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier Task Force | |
|
|
| Thin Chip Handling Task Force |
| |
| | | TFOF | | Thin Chip Handling Task Force | |
|
|
| North America |
| |
|
|
| NA 3D Packaging and Integration Committee |
| |
| | | 6810 | | Reapproval of SEMI 3D13-0715, Guide for Measuring Voids in Bonded Wafer Stacks | |
| | | 6811 | | Reapproval of SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC Applications | |
| | | 6812 | | Reapproval of SEMI 3D4-0915, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | |
| | | 6829 | | Line Item Revision to SEMI 3D16-1116, Specification for Glass Base Material for Semiconductor Packaging | |
|
|
| 3DP&I Bonded Wafer Stacks Task Force |
| |
| | | 6641 | | Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process | |
| | | TFOF | | 3DP&I Bonded Wafer Stacks Task Force | |
|
|
| 3DP&I Inspection and Metrology Task Force |
| |
| | | TFOF | | 3DP&I Inspection and Metrology Task Force | |
|
|
| Panel Level Packaging (PLP) Panel Task Force |
| |
| | | TFOF | | Panel Level Packaging (PLP) Panel Task Force | |
|
|
| Taiwan |
| |
|
|
| 3DP&I Middle-End Process Task Force |
| |
| | | 6865 | | Reapproval of SEMI 3D15-0316 Guide for Overlay Performance Assessment for 3DS-IC Process | |
| | | TFOF | | 3DP&I Middle-End Process Task Force | |
|
|
| 3DP&I Testing Task Force |
| |
| | | 6866 | | Line Item Revision to SEMI 3D14-0615 Guide for Incoming/Outgoing Quality control and Testing Flow for 3DSIC Products. | |
| | | 6921 | | New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe | |
| | | TFOF | | 3DP&I Testing Task Force | |
| Automated Test Equipment |
| |
|
|
| North America |
| |
|
|
| NA ATE 5-Year Review |
| |
| | | TFOF | | NA ATE 5-Year Review | |
|
|
| Rich Interactive Test Database (RITdb) |
| |
| | | 6905 | | Line Item Revision to SEMI E183-1121: Specification for Rich Interactive Test Database (RITdb) | |
| | | TFOF | | Rich Interactive Test Database (RITdb) | |
|
|
| Standard Test Data Format (STDF) Task Force |
| |
| | | TFOF | | Standard Test Data Format (STDF) Task Force | |
|
|
| Test Cell Communications |
| |
| | | TFOF | | Test Cell Communications | |
|
|
| Tester Event Messaging for Semiconductors (TEMS) |
| |
| | | TFOF | | Tester Event Messaging for Semiconductors (TEMS) | |
| Automation Technology |
| |
|
|
| Japan |
| |
|
|
| A1 TF |
| |
| | | 6825 | | Line Item Revision to SEMI A1-0521 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | TFOF | | A1 TF | |
|
|
| F-GEM TF |
| |
| | | TFOF | | F-GEM TF | |
|
|
| SMT TF |
| |
| | | 6827 | | Line Item Revision to SEMI A2-0521 Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | TFOF | | SMT TF | |
|
|
| Taiwan |
| |
|
|
| Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force |
| |
| | | 6704 | | Line Item Revisions to SEMI A3-0819 SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI) | |
| | | TFOF | | Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force | |
| Compound Semiconductor Materials |
| |
|
|
| China |
| |
|
|
| SiC Epitaxial Wafer Task Force |
| |
| | | 6693 | | New Standard: Specification for 4H-SiC Homoepitaxial Wafer | |
| | | TFOF | | SiC Epitaxial Wafer Task Force | |
|
|
| Silicon Carbide Substrate Task Force |
| |
| | | 6767 | | New Standard: Test Method for Flatness of Silicon Carbide Wafers by Optical Interference | |
| | | 6768 | | New Standard: Test Method for Micropipe Density of Silicon Carbide Wafer by Laser Reflection | |
| | | 6769 | | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic | |
| | | TFOF | | Silicon Carbide Substrate Task Force | |
|
|
| Europe |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 6779 | | Reapproval of SEMI M64 - Test Method for the EL2 Deep Donor Concentration in Semi-Insulating (SI) Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy | |
| | | 6780 | | Line Item Revision of SEMI M87 - Test Method for Contactless Resistivity Measurement of Semi-Insulating Semiconductors | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| EU Compound Semiconductor Materials Committee |
| |
| | | TFOF | | EU Compound Semiconductor Materials Committee | |
|
|
| SiC Material and Wafer Specification TF |
| |
| | | TFOF | | SiC Material and Wafer Specification TF | |
|
|
| Test Methods Task Force |
| |
| | | 6870 | | New Standard: Test Method for Quantifying Basal Plane Dislocations in 4H-SiC by X-ray Topography | |
| | | TFOF | | Test Methods Task Force | |
|
|
| Japan |
| |
|
|
| SiC Epitaxial Wafer liaison TF |
| |
| | | TFOF | | SiC Epitaxial Wafer liaison TF | |
|
|
| Silicon Carbide Substrate liaison TF |
| |
| | | TFOF | | Silicon Carbide Substrate liaison TF | |
|
|
| North America |
| |
|
|
| Compound Semiconductor Materials Committee |
| |
| | | 6915 | | Withdrawal of SEMI M65 - Specification for Sapphire Substrates to use for Compound Semiconductor Epitaxial Wafers | |
| | | 6952 | | Reapproval of SEMI M10-0218 Terminology For Identification Of Structures And Features Seen On Gallium Arsenide Wafers | |
| | | 6953 | | Line Item Revision ofSEMI M79-0218
Specification For Round 100 mm Polished Monocrystalline Germanium Wafers For Solar Cell Applications | |
| | | 6954 | | Line Item Revision Of SEMI M23-0811 (Reapproved 0218) Specification For Polished Monocrystalline Indium Phosphide Wafers | |
|
|
| M86 Revision Task Force |
| |
| | | 6806 | | Revision of M86-0915 Specification for polished monocrystalline c-plane gallium nitride wafers | |
| | | TFOF | | M86 Revision Task Force | |
|
|
| M9 Revision Task Force |
| |
| | | 6805 | | Revision Of SEMI M9.5-0813, Specification For Round 100 mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications | |
| | | 6818 | | Withdrawal Of SEMI M9.1-0813 — Specification For Round 50.8 Mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications | |
| | | 6819 | | Withdrawal Of SEMI M9.6-0813 — Specification For Round 125 Mm Diameter Polished Monocrystalline Gallium Arsenide Wafers | |
| | | TFOF | | M9 Revision Task Force | |
| EH&S |
| |
|
|
| Japan |
| |
|
|
| Japan Environmental Health and Safety Committee |
| |
| | | 6909 | | Withdrawal of SEMI S26 Environmental, Health, and Safety Guideline for FPD Manufacturing System | |
| | | TFOF | | Japan Environmental Health and Safety Committee | |
|
|
| S18 Revision Task Force |
| |
| | | 6289 | | Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS | |
| | | TFOF | | S18 Revision Task Force | |
|
|
| S19 Revision TF |
| |
| | | 6910 | | Revision of SEMI S19, Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service Personnel | |
| | | TFOF | | S19 Revision TF | |
|
|
| Japan and North America |
| |
|
|
| Global Seismic Protection TF |
| |
| | | TFOF | | Global Seismic Protection TF | |
|
|
| S23 Revision Global Task Force |
| |
| | | TFOF | | S23 Revision Global Task Force | |
|
|
| North America |
| |
|
|
| Control of Hazardous Energy (CoHE) Task Force |
| |
| | | 6942 | | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Related to CoHE/LOTO section of S2) | |
| | | TFOF | | Control of Hazardous Energy (CoHE) Task Force | |
|
|
| Energetic Materials EHS Task Force |
| |
| | | 6940 | | Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Regarding S30 and S18) | |
| | | 6941 | | Line Item Revision to SEMI S30, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes (Regarding heating of piping)
| |
| | | TFOF | | Energetic Materials EHS Task Force | |
|
|
| Environmental Performance Rating (EPR) Task Force |
| |
| | | TFOF | | Environmental Performance Rating (EPR) Task Force | |
|
|
| Ergonomics Task Force |
| |
| | | 6309 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | 6943 | | Line Item Revisions to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment | |
| | | TFOF | | Ergonomics Task Force | |
|
|
| Fire Protection Task Force |
| |
| | | 6595 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
| |
| | | 6784 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
| |
| | | 6944 | | Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Regarding Fire Protection) | |
| | | TFOF | | Fire Protection Task Force | |
|
|
| Hydrogen Safety Task Force |
| |
| | | TFOF | | Hydrogen Safety Task Force | |
|
|
| Manufacturing Equipment Safety Subcommittee |
| |
| | | TFOF | | Manufacturing Equipment Safety Subcommittee | |
|
|
| NA Environmental Health and Safety Committee |
| |
| | | TFOF | | NA Environmental Health and Safety Committee | |
|
|
| S1 Revision Task Force |
| |
| | | 6831 | | Revision to SEMI S1-1015 Safety Guideline for Equipment Safety Labels | |
| | | TFOF | | S1 Revision Task Force | |
|
|
| S10 Task Force |
| |
| | | 6887 | | Revision to SEMI S10-1119, Safety Guideline for Risk Assessment and Risk Evaluation Process | |
| | | TFOF | | S10 Task Force | |
|
|
| S12 (Equipment Decon) Review Task Force |
| |
| | | 6782 | | Line Item Revision of SEMI S12 - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | 6885 | | Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (invocation of S12) | |
| | | 6888 | | Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | TFOF | | S12 (Equipment Decon) Review Task Force | |
|
|
| S2 Chemical Exposure Task Force |
| |
| | | 6886 | | Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Chemical Exposure) | |
| | | TFOF | | S2 Chemical Exposure Task Force | |
|
|
| S2 Interlocks Design Task Force |
| |
| | | TFOF | | S2 Interlocks Design Task Force | |
|
|
| S2 Mechanical Design Task Force |
| |
| | | 6884 | | Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment | |
| | | TFOF | | S2 Mechanical Design Task Force | |
|
|
| S22 Task Force |
| |
| | | TFOF | | S22 Task Force | |
|
|
| S3 Revision Task Force |
| |
| | | 6830 | | Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS | |
| | | TFOF | | S3 Revision Task Force | |
|
|
| S6 Revision Task Force |
| |
| | | TFOF | | S6 Revision Task Force | |
|
|
| S7 Task Force |
| |
| | | 6907 | | Revision to SEMI S7-0515 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications | |
| | | TFOF | | S7 Task Force | |
|
|
| Taiwan |
| |
|
|
| Equipment Safety Task Force |
| |
| | | TFOF | | Equipment Safety Task Force | |
| Facilities |
| |
|
|
| Japan |
| |
|
|
| 5-year-review TF |
| |
| | | 6890 | | Reapproval of SEMI F80-0309(Reapproved 0914), Test Method for Determination of Gas Change/Purge efficiency of Gas Delivery System. | |
| | | TFOF | | 5-year-review TF | |
|
|
| F1 Revision TF |
| |
| | | TFOF | | F1 Revision TF | |
|
|
| Gas Box Components Joint Task Force |
| |
| | | TFOF | | Gas Box Components Joint Task Force | |
|
|
| Japan Gases and Facilities Committee |
| |
| | | TFOF | | Japan Gases and Facilities Committee | |
|
|
| Korea |
| |
|
|
| Equipment Cleanness Task Force |
| |
| | | TFOF | | Equipment Cleanness Task Force | |
|
|
| North America |
| |
|
|
| Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force |
| |
| | | 6628 | | New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling | |
| | | TFOF | | Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force | |
|
|
| NA Facilities Committee |
| |
| | | 6771 | | Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation | |
| | | 6772 | | Reapproval of SEMI E70-1213, Guide for Tool Accommodation Process | |
| | | 6773 | | Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services | |
| | | 6774 | | Reapproval of SEMI F49-0200 (Reapproved 1213), Guide for Semiconductor Factory Systems Voltage Sag Immunity | |
| | | 6775 | | Reapproval of SEMI F50-0200 (Reapproved 1213), Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories | |
| | | TFOF | | NA Facilities Committee | |
|
|
| Power Grid Harmonics Task Force |
| |
| | | TFOF | | Power Grid Harmonics Task Force | |
|
|
| SEMI F51 Revision Task Force |
| |
| | | TFOF | | SEMI F51 Revision Task Force | |
|
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | | Voltage Sag Immunity Task Force | |
| Flat Panel Display (FPD) - Materials & Components |
| |
|
|
| Japan |
| |
|
|
| Flexible Display Task Force |
| |
| | | TFOF | | Flexible Display Task Force | |
|
|
| FPD Color Filter Task Force |
| |
| | | TFOF | | FPD Color Filter Task Force | |
|
|
| FPD Mask Task Force |
| |
| | | 6868 | | Revision to SEMI D6-0211 (Reapproved 0117) “Specification For Liquid Crystal Display (LCD) Mask Substrates” with title change to “Specification For Flat Panel Display (FPD) Mask Substrates” | |
| | | 6869 | | Revision to SEMI D38-0211 (Reapproved 0117) “Guide For Quality Area Of LCD Masks” with title change to “Guide For Quality Area Of Flat Panel Display (FPD) Masks” | |
| | | 6937 | | New Standard: TERMINOLOGY FOR FPD PHASE SHIFT MASK AND MASK BLANKS | |
| | | TFOF | | FPD Mask Task Force | |
|
|
| FPD Materials & Components Maintenance Task Force |
| |
| | | 6912 | | Line Item Revision to SEMI D39-0704 (Reapproved 0117): “SPECIFICATION FOR MARKERS ON FPD POLARIZING FILMS” | |
| | | TFOF | | FPD Materials & Components Maintenance Task Force | |
|
|
| Japan FPD Materials and Components Committee |
| |
| | | TFOF | | Japan FPD Materials and Components Committee | |
|
|
| Polarizing Film TF |
| |
| | | TFOF | | Polarizing Film TF | |
| Flat Panel Display (FPD) - Metrology |
| |
|
|
| Japan |
| |
|
|
| D31 Revision Task Force |
| |
| | | TFOF | | D31 Revision Task Force | |
|
|
| Korea |
| |
|
|
| Perceptual Image Quality |
| |
| | | 6659 | | Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays | |
| | | 6913 | | Line Item Revision to SEMI D61-1110, Test Method of Perceptual Angle for OLED Displays | |
| | | TFOF | | Perceptual Image Quality | |
|
|
| Perceptual Viewing Angle |
| |
| | | TFOF | | Perceptual Viewing Angle | |
|
|
| Picture Quality Evaluation Task Force |
| |
| | | 6701 | | New Standard: Test Method for Warm-up Properties of Display Picture Quality | |
| | | 6863 | | Line-item Revision to SEMI D64-0811, Test Method for Measuring the Spatial Contrast Ratio of Flat Panel Display | |
| | | TFOF | | Picture Quality Evaluation Task Force | |
|
|
| Transparent Display |
| |
| | | TFOF | | Transparent Display | |
|
|
| Taiwan |
| |
|
|
| Flexible Displays Task Force |
| |
| | | 6632 | | New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays | |
| | | TFOF | | Flexible Displays Task Force | |
|
|
| Maintenance Task Force |
| |
| | | 6960 | | Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection | |
| | | 6961 | | Line Item Revision to SEMI D58 Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display | |
| | | TFOF | | Maintenance Task Force | |
|
|
| Transparent Display Task Force |
| |
| | | 6201 | | New Standard: Guide for Tone Reproduction Curves for Transparent Displays | |
| | | 6737 | | New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays | |
| | | TFOF | | Transparent Display Task Force | |
| Flexible Hybrid Electronics (FHE) |
| |
|
|
| Japan |
| |
|
|
| FHE Terminology |
| |
| | | 6906 | | New Standard:Terminology for Flexible Hybrid Electronics (FHE) | |
| | | TFOF | | FHE Terminology | |
|
|
| Tactile texture characteristics for FHE |
| |
| | | 6939 | | New Standard: Test method for the tactile texture characteristics of Flexible Hybrid Electronics materials and products | |
| | | TFOF | | Tactile texture characteristics for FHE | |
|
|
| Taiwan |
| |
|
|
| FHE System for Wearable Task Force |
| |
| | | 6690 | | New Standard: Test Method of Line Impedance for Electronic Textiles | |
| | | 6691 | | New Standard: Test Method of Sheet Resistance for Woven Electronics Textiles | |
| | | 6873 | | New Standard: Guide for Salt Mist and Washability Test Flow for Control Module Connector of Electronic textiles | |
| | | TFOF | | FHE System for Wearable Task Force | |
| Gases |
| |
|
|
| Europe |
| |
|
|
| Cleaning Gases |
| |
| | | 6148 | | Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing | |
| | | TFOF | | Cleaning Gases | |
|
|
| Permeation Tubes for Trace Moisture Calibration |
| |
| | | TFOF | | Permeation Tubes for Trace Moisture Calibration | |
|
|
| North America |
| |
|
|
| Filters and Purifiers Task Force |
| |
| | | TFOF | | Filters and Purifiers Task Force | |
|
|
| Gases Specification Task Force |
| |
| | | TFOF | | Gases Specification Task Force | |
|
|
| Heater Jacket Task Force |
| |
| | | 6916 | | Replacement of SEMI F109-0212, Guide for Heater Systems Requirements,
as a New Standard: Guide for Material Selection for Heater Systems | |
| | | TFOF | | Heater Jacket Task Force | |
|
|
| Mass Flow Controller Task Force |
| |
| | | 6933 | | Line-Item Revisions to SEMI E77-1104 (Reapproved 0815), Test Method for Calculation of Conversion Factors for a Mass Flow Controller Using Surrogate Gases | |
| | | 6934 | | Line-Item Revisions to SEMI E80-0299 (Reapproved 0915), Test Method for Determining Attitude Sensitivity of Mass Flow Controllers (Mounting Position) | |
| | | TFOF | | Mass Flow Controller Task Force | |
|
|
| Materials of Construction of Gas Delivery Systems Task Force |
| |
| | | 6394 | | Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems | |
| | | 6510 | | Line Item Revision to SEMI F32-0211, Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves | |
| | | 6582 | | New Standard: Test Method for the Electrochemical Critical Pitting Voltage Testing of Stainless Steel Used in Corrosive Gas Systems | |
| | | 6612 | | New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves | |
| | | TFOF | | Materials of Construction of Gas Delivery Systems Task Force | |
|
|
| NA Gases Committee |
| |
| | | 6747 | | Line Item to Replace Designation Letter from C to F for SEMI C88-0815, Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems, SEMI C91-115, Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components, and SEMI C92-0216, Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution | |
| | | 6813 | | Reapproval of SEMI F28-1103 (Reapproved 0815), Test Method for Measuring Particle Generation from Process Panels | |
| | | 6814 | | Reapproval of SEMI F43-0308 (Reapproved 0613), Test Method for Determination of Particle Contribution by Point-of-Use Gas Purifiers and Gas Filters | |
| | | 6815 | | Reapproval of SEMI F59-0302 (Reapproved 0613), Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves | |
| | | 6816 | | Reapproval of SEMI F67-1101 (Reapproved 0713), Test Method for Determining Inert Gas Purifier Capacity | |
| | | 6817 | | Reapproval of SEMI F68-1101 (Reapproved 0713), Test Method for Determining Purifier Efficiency | |
| | | 6874 | | Reapproval of SEMI F79-0914, Guide for Gas Compatibility with Silicon Used in Gas Distribution Components | |
| | | 6875 | | Reapproval of SEMI F105-0914, Guide for Metallic Material Compatibility in Gas Distribution Systems | |
| | | 6876 | | Reapproval of SEMI F60-1214, Test Method for ESCA Evaluation of Surface Composition of Wetted Surfaces of Passivated 316L Stainless Steel Components | |
| | | 6877 | | Reapproval of SEMI F73-1214, Test Method for Scanning Electron Microscopy (SEM) Evaluation of Wetted Surface Condition of Stainless Steel Components | |
| | | 6878 | | Reapproval of SEMI E77-1104 (Reapproved 0815), Test Method for Calculation of Conversion Factors for a Mass Flow Controller Using Surrogate Gases | |
| | | 6879 | | Reapproval of SEMI F77-0915, Test Method for Electrochemical Critical Pitting Temperature Testing of Stainless Steel Surfaces Used in Corrosive Gas Systems | |
| | | 6880 | | Reapproval of SEMI E80-0299 (Reapproved 0915), Test Method for Determining Attitude Sensitivity of Mass Flow Controllers (Mounting Position) | |
| | | 6881 | | Reapproval of SEMI C3.34-0116, Specification for Disilane (Si2H6) in Cylinders, 97% Quality | |
| | | 6882 | | Reapproval of SEMI C3.12-0116, Specification for Ammonia (NH3) in Cylinders, 99.998% Quality | |
|
|
| Pressure Measurement Task Force |
| |
| | | TFOF | | Pressure Measurement Task Force | |
|
|
| Surface Mount Sandwich Component Dimensions Task Force |
| |
| | | TFOF | | Surface Mount Sandwich Component Dimensions Task Force | |
| HB-LED |
| |
|
|
| China |
| |
|
|
| GaN based LED Epitaxial Wafer Task Force |
| |
| | | TFOF | | GaN based LED Epitaxial Wafer Task Force | |
|
|
| HB-LED Equipment Communication Interface |
| |
| | | TFOF | | HB-LED Equipment Communication Interface | |
|
|
| Patterned Sapphire Substrate Task Force |
| |
| | | 6371 | | New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate | |
| | | TFOF | | Patterned Sapphire Substrate Task Force | |
|
|
| Sapphire Single Crystal Ingot Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Ingot Task Force | |
|
|
| Sapphire Single Crystal Orientation Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Orientation Task Force | |
|
|
| Single Crystal Sapphire Task Force |
| |
| | | TFOF | | Single Crystal Sapphire Task Force | |
|
|
| North America |
| |
|
|
| HB-LED Assembly |
| |
| | | TFOF | | HB-LED Assembly | |
|
|
| HB-LED Equipment Automation Interfaces |
| |
| | | TFOF | | HB-LED Equipment Automation Interfaces | |
|
|
| HB-LED Equipment Communication Interfaces TF |
| |
| | | TFOF | | HB-LED Equipment Communication Interfaces TF | |
|
|
| HB-LED Source Materials TF |
| |
| | | 5984 | | New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing | |
| | | 5985 | | New Standard: Guide for Triethylgallium for HB-LED Manufacturing | |
| | | 5986 | | New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing | |
| | | 5987 | | New Standard: Guide for Trimethylgallium for HB-LED Manufacturing | |
| | | 5988 | | New Standard: Guide for Trimethylindium for HB-LED Manufacturing | |
| | | TFOF | | HB-LED Source Materials TF | |
|
|
| HB-LED Wafer TF |
| |
| | | TFOF | | HB-LED Wafer TF | |
|
|
| Impurities and Defects in HB-LED Sapphire Wafers |
| |
| | | TFOF | | Impurities and Defects in HB-LED Sapphire Wafers | |
|
|
| NA HB-LED Committee |
| |
| | | TFOF | | NA HB-LED Committee | |
|
|
| Patterned Sapphire Substrate (PSS) TF |
| |
| | | TFOF | | Patterned Sapphire Substrate (PSS) TF | |
|
|
| Test Methods TF |
| |
| | | TFOF | | Test Methods TF | |
| Information & Control |
| |
|
|
| China |
| |
|
|
| Advanced Backend Factory Integration Task Force |
| |
| | | 6914 | | Line Item Revision to SEMI E87-0921, Specification For Carrier Management (CMS) and E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS), and SEMI E5-0821 Specification for SEMI Equipment Communications STANDARD 2 Message Content (SECS-II) | |
| | | TFOF | | Advanced Backend Factory Integration Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
|
|
| Japan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6920 | | Line Item Revision to SEMI E171-0916: SPECIFICATION FOR PREDICTIVE CARRIER LOGISTICS(PCL) and SEMI E171.1-0216: SPECIFICATION FOR SECS-II PROTOCOL FOR PREDICTIVE CARRIER LOGISTICS
| |
| | | TFOF | | GEM 300 Task Force | |
|
|
| JA I&C Maintenance Task Force |
| |
| | | 6770 | | Line-Item revision to E169-0615 Guide for Equipment Information System Security | |
| | | 6861 | | Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer | |
| | | 6862 | | Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer | |
| | | TFOF | | JA I&C Maintenance Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Korea |
| |
|
|
| Advanced Back-end Factory Integration TF |
| |
| | | TFOF | | Advanced Back-end Factory Integration TF | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 5832 | | New Standard, Specification for Equipment Generic Counter Model (EGCM) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| North America |
| |
|
|
| Advanced Backend Factory Integration |
| |
| | | 6840 | | New Standard: Specification for Equipment Adoption Criteria for GEM And GEM-Based Standards | |
| | | 6852 | | Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping | |
| | | 6924 | | New Standard: Specification for Equipment Management of Consumables and Durables | |
| | | 6925 | | New Subordinate Standard: Specification for SECS-II Protocol for Equipment Management of Consumables and Durables | |
| | | 6948 | | Line Item Revisions to SEMI E142-0921 - Specification for Substrate Mapping, SEMI E142.1-0921 - Specification for XML Schema for Substrate Mapping, Line Item Revision to SEMI E142.2-0921 - Specification for SECS II Protocol For Substrate Mapping, Line Item Revision to SEMI E142.3-0921 - Specification for Web Services Protocol for Substrate Mapping, Line Item Revision to SEMI E142.4-0921 - Specification for Secs II Protocol For Substrate Mapping Using Item Transfer | |
| | | TFOF | | Advanced Backend Factory Integration | |
|
|
| Diagnostic Data Acquisition Task Force NA |
| |
| | | 6837 | | LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS | |
| | | 6929 | | LINE ITEM REVISION TO SEMI E134-XXYY Specification for Data Collection Management and SEMI E134.2-WWZZ Specification for Protocol Buffers of Data Collection Management | |
| | | 6930 | | Revision to SEMI E164-0414 (Reapproved 0721): Specification for EDA Common Metadata | |
| | | 6932 | | Reapproval for SEMI E121-1017, Guide for Style and Usage of XML for Semiconductor Manufacturing Applications | |
| | | 6945 | | Line Item Revision to SEMI E125, Specification for Equipment Self Description (EqSD) and
SEMI E125.2, Specification for Protocol Buffers for Equipment Self Description (EqSD) | |
| | | 6946 | | Line Item Revision to SEMI E132, Specification For Equipment Client Authentication and Authorization and SEMI E132.2, Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) | |
| | | 6947 | | Line Item Revision to SEMI E179-0320, Specification for Protocol Buffers Common Components | |
| | | 6950 | | Reapproval of SEMI E121-1017, Guide for Style and Usage of XML for Semiconductor Manufacturing Applications | |
| | | TFOF | | Diagnostic Data Acquisition Task Force NA | |
|
|
| Energy Saving Equipment Communication Task Force |
| |
| | | 6923 | | Line Item Revisions to SEMI E167-1213: Specification for Equipment Energy Saving Mode Communications (EESM), SEMI E167.1-1213: Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications, and SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC) | |
| | | TFOF | | Energy Saving Equipment Communication Task Force | |
|
|
| Fab & Equipment Computer and Device Security (CDS) Task Force |
| |
| | | 6565 | | New Standard: Specification for Application Accesslisting | |
| | | 6926 | | New Standard: Specification for Equipment Operator Access Management and Monitoring | |
| | | TFOF | | Fab & Equipment Computer and Device Security (CDS) Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6572 | | Revision to SEMI E30-0418: Specification for The Generic Model for Communications and Control of Manufacturing Equipment (GEM) | |
| | | 6723 | | Reapproval of SEMI E90.1-0312 - Specification for SECS-II Protocol Substrate Tracking | |
| | | 6835 | | LINE ITEM REVISION TO SEMI E87-XXXX SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-XXXX SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT (CMS) | |
| | | 6836 | | LINE ITEM REVISION TO SEMI E87-0619 SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-0619 SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT(CMS) and SEMI E90-1218
SPECIFICATION FOR SUBSTRATE TRACKING and SEMI E90.1-0312
SPECIFICATION FOR SECS-II PROTOCOL FOR SUBSTRATE TRACKING | |
| | | 6850 | | Reapproval of SEMI E109.1-1110, Specification for SECS-II Protocol for Reticle and Pod Management (RPMS) | |
| | | 6851 | | Reapproval of SEMI E123.1-0703 (Reapproved 1109), Specification for SECS-II Protocol for Handler Specific Equipment Model (HSEM) | |
| | | 6859 | | Revision to SEMI E116-0518 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING (EPT) and E116.1-0707 (Reapproved 0518) SPECIFICATION FOR SECS-II PROTOCOL FOR EQUIPMENT PERFORMANCE TRACKING (EPT) | |
| | | 6916 | | Line Item Revision to SEMI E5-0821: SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II) | |
| | | 6962 | | Reapproval of SEMI E30.1-0217, Specification for Inspection and Review Specific Equipment Model (ISEM) | |
| | | 6963 | | Reapproval of SEMI E30.5-0217, Specification for Metrology Specific Equipment Model (MSEM) | |
| | | 6964 | | Reapproval of SEMI E82-0318, Specification for Interbay/Intrabay AMHS SEM (IBSEM) | |
| | | 6965 | | Reapproval of SEMI E88-0318, Specification for AMHS Storage SEM (Stocker SEM) | |
| | | 6966 | | Reapproval of SEMI E109-1017, Specification for Reticle and Pod Management (RPMS) | |
| | | 6967 | | Reapproval of SEMI E122-0217, Specification for Tester Equipment Specific Equipment Model (TSEM) | |
| | | 6968 | | Reapproval of SEMI E122.1-0703 (Reapproved 1109), Specification for SECS-II Protocol for Tester Specific Equipment Model (TSEM) | |
| | | 6969 | | Reapproval of SEMI E123-0217, Specification for Handler Equipment Specific Equipment Model (HSEM) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| Graphical User Interfaces (GUI) Task Force |
| |
| | | 6743 | | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment | |
| | | TFOF | | Graphical User Interfaces (GUI) Task Force | |
|
|
| NA Information and Control Committee |
| |
| | | TFOF | | NA Information and Control Committee | |
|
|
| Process Control System NA |
| |
| | | 6951 | | Reapproval of SEMI E126-0708 - Specification for Equipment Quality Information Parameters (EQIP) | |
| | | TFOF | | Process Control System NA | |
|
|
| Process Control System NA Task Force |
| |
| | | 6649 | | Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS) | |
| | | 6722 | | Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices | |
| | | 6724 | | Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device | |
| | | TFOF | | Process Control System NA Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | 6174 | | Line Item Revision to SEMI E54.9, Specification for Sensor/Actuator Network Communication Specification for Modbus/TCP over TCP/IP
| |
| | | 6562 | | Line-item Revision to SEMI E54.23: Specification for Sensor/Actuator Network Communications for CC-Link IE Field Network | |
| | | 6563 | | Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device | |
| | | 6564 | | Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges | |
| | | 6845 | | Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network | |
| | | 6846 | | Reapproval of SEMI E54.1-0316, Specification for Sensor/Actuator Network Common Device Mode | |
| | | 6847 | | Reapproval of SEMI E54.2-0316, Guide for Writing Sensor/Actuator Network (SAN) Letter Ballots | |
| | | 6848 | | Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT | |
| | | 6849 | | Reapproval of SEMI E54.24-1116, Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENsen) | |
| | | 6949 | | Line Item Revisions to E54, SEMI E54.1, SEMI E54.10, SEMI E54.11, SEMI E54.12, SEMI E54.13, SEMI E54.14, SEMI E54.15, SEMI E54.16, SEMI E54.17, SEMI E54.18, SEMI E54.19, SEMI E54.2, SEMI E54.20, SEMI E54.21, SEMI E54.22, SEMI E54.23, SEMI E54.24, SEMI E54.3, SEMI E54.4, SEMI E54.7, SEMI E54.8, SEMI E54.9 | |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Taiwan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Equipment Edge Data Governance (EEDG) Task Force |
| |
| | | 6938 | | New Standard: Guide for Equipment Edge Data Governance (EEDG) | |
| | | TFOF | | Equipment Edge Data Governance (EEDG) Task Force | |
|
|
| Equipment Information Integration Task Force |
| |
| | | TFOF | | Equipment Information Integration Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
| Liquid Chemicals |
| |
|
|
| Europe |
| |
|
|
| EU Gases and Liquid Chemicals Committee |
| |
| | | TFOF | | EU Gases and Liquid Chemicals Committee | |
|
|
| Precursor Specifications Task Force |
| |
| | | TFOF | | Precursor Specifications Task Force | |
|
|
| Solvents in Advanced Processes |
| |
| | | TFOF | | Solvents in Advanced Processes | |
|
|
| Japan |
| |
|
|
| Diaphragm Valves Task Force |
| |
| | | TFOF | | Diaphragm Valves Task Force | |
|
|
| Liquid-Borne Particle Counter Task Force |
| |
| | | TFOF | | Liquid-Borne Particle Counter Task Force | |
|
|
| Liquid Filter Task Force |
| |
| | | 6883 | | Reapproval of SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS) | |
| | | 6911 | | New Standard, Test Method For Metal Removal Performance Of Liquid Filter | |
| | | TFOF | | Liquid Filter Task Force | |
|
|
| Trace Metal Analysis for High Pure IPA Task Force |
| |
| | | 6820 | | New Standard: Guide for Trace Iron Analysis in High Purity IPA | |
| | | TFOF | | Trace Metal Analysis for High Pure IPA Task Force | |
|
|
| Welding Fitting Task Force |
| |
| | | TFOF | | Welding Fitting Task Force | |
|
|
| North America |
| |
|
|
| Chemical Analytical Methods Task Force |
| |
| | | 6315 | | Revision to SEMI C30-0218, Specification for Hydrogen Peroxide, with title change to: Specification and Guide for Hydrogen Peroxide | |
| | | 6388 | | Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid | |
| | | 6451 | | Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals | |
| | | 6509 | | Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change | |
| | | TFOF | | Chemical Analytical Methods Task Force | |
|
|
| Chemical Mechanical Planarization Consumables (CMP-C) Task Force |
| |
| | | 6748 | | New Standard: Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing | |
| | | 6903 | | Line Item Revision to SEMI C102-0621, Guide for Reporting Density of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing, with title change to: Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing | |
| | | 6904 | | New Standard: Guide for Reporting Performance Parameters of the Retaining Rings for Chemical Mechanical Planarization (CMP) used in Semiconductor Manufacturing | |
| | | TFOF | | Chemical Mechanical Planarization Consumables (CMP-C) Task Force | |
|
|
| High Purity Liquid Assemblies & Systems Task Force |
| |
| | | 6828 | | Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems | |
| | | 6917 | | Revision to SEMI F39-0621, Guide for Chemical Blending Systems | |
| | | TFOF | | High Purity Liquid Assemblies & Systems Task Force | |
|
|
| High Purity Polymer Materials and Components Task Force |
| |
| | | 6601 | | New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water | |
| | | 6713 | | Line Item Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems | |
| | | 6729 | | Line Item Revision to SEMI F57-0120, Specification for Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems | |
| | | TFOF | | High Purity Polymer Materials and Components Task Force | |
|
|
| Statistical Methods Task Force |
| |
| | | 6935 | | Revision to SEMI C10-1109 (Reapproved 1114), Guide for Determination of Method Detection Limits | |
| | | TFOF | | Statistical Methods Task Force | |
|
|
| Ultra Pure Water Task Force |
| |
| | | 6714 | | Line Item Revision to SEMI C93-0620, Guide for Determining the Quality of Ion Exchange Resin Used in Polish Applications of Ultrapure Water System | |
| | | TFOF | | Ultra Pure Water Task Force | |
|
|
| Water Management Task Force |
| |
| | | 6715 | | New Standard: Guide for Measuring Particle Precursors in Ultrapure Water | |
| | | 6716 | | Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems | |
| | | TFOF | | Water Management Task Force | |
| MEMS / NEMS |
| |
|
|
| International |
| |
|
|
| Terminology |
| |
| | | TFOF | | Terminology | |
|
|
| North America |
| |
|
|
| MEMS and Miniaturized Gas Sensing Task Force |
| |
| | | TFOF | | MEMS and Miniaturized Gas Sensing Task Force | |
|
|
| MEMS Material Characterization Task Force |
| |
| | | TFOF | | MEMS Material Characterization Task Force | |
|
|
| MEMS Microfluidics Task Force |
| |
| | | TFOF | | MEMS Microfluidics Task Force | |
|
|
| MEMS Packaging Task Force |
| |
| | | TFOF | | MEMS Packaging Task Force | |
|
|
| MEMS Reliability Task Force |
| |
| | | TFOF | | MEMS Reliability Task Force | |
|
|
| MEMS Substrate Task Force |
| |
| | | TFOF | | MEMS Substrate Task Force | |
|
|
| NA MEMS/NEMS Committee |
| |
| | | 6844 | | Reapproval of SEMI MS8-0309 (Reapproved 0915), Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages | |
| | | TFOF | | NA MEMS/NEMS Committee | |
|
|
| Wafer Bond Task Force |
| |
| | | TFOF | | Wafer Bond Task Force | |
| Metrics |
| |
|
|
| Japan |
| |
|
|
| Cycle Time Metrics Task Force |
| |
| | | TFOF | | Cycle Time Metrics Task Force | |
|
|
| Japan RF Measurement liaison Task Force |
| |
| | | 6550 | | Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | Japan RF Measurement liaison Task Force | |
|
|
| North America |
| |
|
|
| Critical Chamber Components (CCC) Test Methods Task Force |
| |
| | | 6599 | | Line Item Revision to SEMI E180-1219, Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing. | |
| | | 6931 | | NEW STANDARD: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection | |
| | | TFOF | | Critical Chamber Components (CCC) Test Methods Task Force | |
|
|
| EMC Task Force |
| |
| | | 6894 | | Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment | |
| | | TFOF | | EMC Task Force | |
|
|
| Equipment Cost of Ownership Task Force |
| |
| | | 6841 | | Line-item Revisions to SEMI E35-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment | |
| | | 6842 | | Line-item Revisions to SEMI E140-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems | |
| | | TFOF | | Equipment Cost of Ownership Task Force | |
|
|
| Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |
| |
| | | 6578 | | Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6579 | | Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity | |
| | | TFOF | | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force | |
|
|
| Equipment Training and Documentation Task Force |
| |
| | | TFOF | | Equipment Training and Documentation Task Force | |
|
|
| ESD/ESC Task Force- N.A |
| |
| | | TFOF | | ESD/ESC Task Force- N.A | |
|
|
| North America Metrics Technical Committee |
| |
| | | TFOF | | North America Metrics Technical Committee | |
|
|
| RF Measurements Task Force |
| |
| | | 6838 | | Reapproval of SEMI E114-0302E (Reapproved 0616), Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | 6839 | | Reapproval of SEMI E115-0302E (Reapproved 0816), Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | RF Measurements Task Force | |
| Micropatterning |
| |
|
|
| North America |
| |
|
|
| Curvilinear Format Task Force |
| |
| | | 6821 | | New Standard: Specification for Improved Curvilinear Layout Representation | |
| | | TFOF | | Curvilinear Format Task Force | |
|
|
| Mask Orders Task Force |
| |
| | | TFOF | | Mask Orders Task Force | |
|
|
| Micropatterning Committee |
| |
| | | 6807 | | Reapproval of SEMI P5-0416 Specification for Pellicles | |
| | | 6808 | | Reapproval of SEMI P40-1109 (Reapproved 0416) Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks | |
| | | 6809 | | Reapproval of SEMI P48-1110 (Reapproved 0416) Specification of Fiducial Marks for EUV Mask Blank | |
|
|
| NA Microlithography Committee for 5-Year Review |
| |
| | | TFOF | | NA Microlithography Committee for 5-Year Review | |
|
|
| P47 Revision Task Force |
| |
| | | 6516 | |
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
| |
| | | TFOF | | P47 Revision Task Force | |
|
|
| Patterning Metrology Task Force |
| |
| | | 6220 | | Line Item revision to SEMI P19-92 (Reapproved 0707)
SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE | |
| | | 6221 | | Revision to SEMI P18-92 (Reapproved 1104)
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS | |
| | | TFOF | | Patterning Metrology Task Force | |
| Photovoltaic |
| |
|
|
| China |
| |
|
|
| Building Integrated Photovoltaic (BIPV) Task Force |
| |
| | | 6542 | | New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building | |
| | | 6700 | | New Standard: Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV) | |
| | | TFOF | | Building Integrated Photovoltaic (BIPV) Task Force | |
|
|
| Crystalline Silicon Solar Cell Task Force |
| |
| | | 6872 | | Revision to SEMI PV75-1016, Test Method on Cell Level for Potential-induced-degradation Susceptibility of Solar Cells and Module Encapsulation Materials | |
| | | TFOF | | Crystalline Silicon Solar Cell Task Force | |
|
|
| PV Equipment Task Force |
| |
| | | 6667 | | Reapproval of SEMI PV68-0815, Test Method for the Wire Tension of Multi-Wire Saws | |
| | | TFOF | | PV Equipment Task Force | |
|
|
| PV Module Task Force |
| |
| | | 6113 | | New Standard: Test Method for Abrasion Resistance of the Polymer Backsheet of Crystalline Silicon Solar Modules | |
| | | 6610 | | Revision to SEMI PV86-1018, Specification for Crystalline Silicon Photovoltaic Module Dimensions | |
| | | 6671 | | Revision to SEMI PV63-0215，Specification for UL TRA-THIN Glasses Used for Photovoltaic Modules | |
| | | 6871 | | Reapproval of SEMI PV77-0817, Guide for Calibration of PV Module UV Test Chambers | |
| | | TFOF | | PV Module Task Force | |
|
|
| Thin Film PV Module Task Force |
| |
| | | 6697 | |
Withdrawal of SEMI PV73-0216, Test Method for Thin-Film Silicon Photovoltaic (PV) Modules Light Soaking
| |
| | | 6778 | | Reapproval to SEMI PV78-0817, Test Method for Bending Property of Flexible Thin Film Photovoltaic (PV) Modules | |
| | | TFOF | | Thin Film PV Module Task Force | |
|
|
| Taiwan |
| |
|
|
| Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force |
| |
| | | 6297 | | New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC) | |
| | | 6539 | | New Standard :Specification of reference device for indoor lighting simulator | |
| | | 6540 | | New Standard :Test Method for Durability of Flexible emerging PV | |
| | | 6730 | | Revision of SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC) | |
| | | 6731 | | Revision of SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC)and Perovskite Solar Cell(PSC) | |
| | | 6732 | | Revision of SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC) | |
| | | 6733 | | Revision of SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic With Title Change To SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic and Perovskite Solar Cell(PSC) | |
| | | 6734 | | Revision of SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic With Title Change To SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic and Perovskite Solar Cell(PSC) | |
| | | TFOF | | Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force | |
|
|
| PV Reliability Test Method Task Force |
| |
| | | 6705 | | Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation | |
| | | TFOF | | PV Reliability Test Method Task Force | |
| Photovoltaic (PV) - Materials |
| |
|
|
| China |
| |
|
|
| PV Silicon Raw Materials Task Force |
| |
| | | TFOF | | PV Silicon Raw Materials Task Force | |
|
|
| PV Silicon Wafer Task Force |
| |
| | | 6922 | | New Standard: Classification of Reusable Silicon Material | |
| | | TFOF | | PV Silicon Wafer Task Force | |
|
|
| Europe |
| |
|
|
| PV Material Degradation Task Force |
| |
| | | TFOF | | PV Material Degradation Task Force | |
|
|
| PV Silicon Materials Task Force |
| |
| | | TFOF | | PV Silicon Materials Task Force | |
|
|
| Japan |
| |
|
|
| Japan PV Materials Task Force |
| |
| | | TFOF | | Japan PV Materials Task Force | |
|
|
| North America |
| |
|
|
| International PV Analytical Test Methods, Metrology, and Inspection Task Force |
| |
| | | TFOF | | International PV Analytical Test Methods, Metrology, and Inspection Task Force | |
| Physical Interfaces & Carriers |
| |
|
|
| International |
| |
|
|
| Global PIC Maintenance Task Force |
| |
| | | 6833 | | Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
| | | 6834 | | Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | TFOF | | Global PIC Maintenance Task Force | |
|
|
| Japan |
| |
|
|
| 300mm Tape Frame PI&C Task Force |
| |
| | | 6895 | | Line Item Revision to SEMI E185-1221-SPECIFICATION FOR 300 mm TAPE FRAME FOUP | |
| | | TFOF | | 300mm Tape Frame PI&C Task Force | |
|
|
| Global PIC Maintenance Task Force |
| |
| | | 6897 | | Revision of E92, Specification For 300 mm Light Weight and Compact Box Opener/Loader To Tool-Interoperability Standard (Bolts/Light) | |
|
|
| Japan Electron Microscopy Workflow liaison Task Force |
| |
| | | TFOF | | Japan Electron Microscopy Workflow liaison Task Force | |
|
|
| Panel Level Packaging Panel FOUP Task Force |
| |
| | | 6898 | | Revision to SEMI E181, - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING | |
| | | 6899 | | Revision to SEMI E181.1, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 12 Slots | |
| | | 6900 | | Revision to SEMI E181.2, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 6 Slots | |
| | | 6901 | | Revision to SEMI E181.3, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 12 Slots | |
| | | 6902 | | Revision to SEMI E181.4, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 6 Slots | |
| | | 6936 | | Line Item Revision of SEMI E182-0621 - Specification for Panel FOUP Loadport for Panel Level Packaging | |
| | | TFOF | | Panel Level Packaging Panel FOUP Task Force | |
|
|
| North America |
| |
|
|
| Electron Microscopy Workflow Task Force |
| |
| | | 6592 | | New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows | |
| | | 6832 | | New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user | |
| | | TFOF | | Electron Microscopy Workflow Task Force | |
|
|
| Global PIC Maintenance Task Force |
| |
| | | 6918 | | Line-Item Revision to SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
|
|
| Packaging Tape Frame Handling Task Force |
| |
| | | 6896 | | New Standard: Specification for 300 mm Frame Carrier FOUP | |
| | | TFOF | | Packaging Tape Frame Handling Task Force | |
|
|
| SEMI E72 Revision Task Force |
| |
| | | 6919 | | Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | TFOF | | SEMI E72 Revision Task Force | |
| Silicon Wafer |
| |
|
|
| Europe |
| |
|
|
| International Polished Wafers Task Force |
| |
| | | 6462 | | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
| |
|
|
| International |
| |
|
|
| International 450 mm Shipping Box |
| |
| | | TFOF | | International 450 mm Shipping Box | |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | TFOF | | International Advanced Wafer Geometry Task Force | |
|
|
| International Annealed Si Wafer Task Force |
| |
| | | TFOF | | International Annealed Si Wafer Task Force | |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | TFOF | | International Automated Advanced Surface Inspection Task Force | |
|
|
| International Epitaxial Wafers Task Force |
| |
| | | TFOF | | International Epitaxial Wafers Task Force | |
|
|
| International Polished Wafers Task Force |
| |
| | | TFOF | | International Polished Wafers Task Force | |
|
|
| International SOI Wafers Task Force |
| |
| | | TFOF | | International SOI Wafers Task Force | |
|
|
| International Terminology Task Force |
| |
| | | TFOF | | International Terminology Task Force | |
|
|
| International Test Methods Task Force |
| |
| | | TFOF | | International Test Methods Task Force | |
|
|
| Japan |
| |
|
|
| International Test Methods Task Force |
| |
| | | 6570 | | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique | |
| | | 6687 | | Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity | |
|
|
| JA Shipping Box Task Force |
| |
| | | TFOF | | JA Shipping Box Task Force | |
|
|
| Japan AWG Task Force |
| |
| | | TFOF | | Japan AWG Task Force | |
|
|
| Japan TC Chapter of Global Technical Tommittee |
| |
| | | TFOF | | Japan TC Chapter of Global Technical Tommittee | |
|
|
| Japan Test Method Task Force |
| |
| | | 5772 | | Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | |
| | | 6702 | | Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION | |
| | | TFOF | | Japan Test Method Task Force | |
|
|
| Test Method Task Force |
| |
| | | TFOF | | Test Method Task Force | |
|
|
| North America |
| |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | 6824 | | Line Item Revision of SEMI MF1048 - Test Method for Measuring the Reflective Total Integrated Scatter | |
| | | 6955 | | Line Item Revision of SEMI M40 - Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers | |
| | | 6956 | | Line Item Revision of SEMI ME1392 - Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces | |
| | | 6957 | | Line Item Revision of SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations | |
|
|
| International SOI Wafers Task Force |
| |
| | | 6583 | | New Standard: Specification for SOI Wafers for RF Device Applications | |
| | | 6860 | | Revision of SEMI M41- 0615, Specification of Silicon-on-Insulator (SOI) for Power Device/ICs | |
|
|
| International Test Methods Task Force |
| |
| | | 6755 | | Reapproval of SEMI MF533-0310 (Reapproved 0416) Test Method for Thickness and Thickness Variation of Silicon Wafers | |
| | | 6762 | | Reapproval of SEMI MF1529-1110 (Reapproved 1115) Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure | |
| | | 6763 | | Reapproval of SEMI MF1239-0305 (Reapproved 0416) Test Method for Oxygen Precipitation Characteristics of Silicon Wafers by Measurement of Interstitial Oxygen Reduction | |
| | | 6764 | | Reapproval of SEMI MF1153-1110 (Reapproved 1015) Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements | |
| | | 6765 | | Reapproval of SEMI MF1152-0316 Test Method for Dimensions of Notches on Silicon Wafers | |
| | | 6787 | | Reapproval of SEMI MF951 - Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers | |
| | | 6788 | | Reapproval of SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques | |
| | | 6790 | | Reapproval of SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon | |
| | | 6791 | | Reapproval of SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers | |
| | | 6792 | | Reapproval of SEMI MF1725 - Practice for Analysis of Crystallographic Perfection of Silicon Ingots | |
| | | 6793 | | Reapproval of SEMI MF1726 - Practice for Analysis of Crystallographic Perfection of Silicon Wafers | |
| | | 6794 | | Reapproval of SEMI MF1727 - Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers | |
| | | 6795 | | Reapproval of SEMI MF1617 - Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry | |
| | | 6796 | | Reapproval of SEMI MF1618 - Practice for Determination of Uniformity of Thin Films on Silicon Wafers | |
| | | 6798 | | Reapproval of SEMI MF1389 - Test Method for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities | |
| | | 6853 | | Reapproval of SEMI MF978-1106 (Reapproved 0317) Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques | |
| | | 6854 | | Reapproval of SEMI MF928-0317, Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates | |
| | | 6855 | | Reapproval of SEMI MF728-1106 (Reapproved 0317)Practice for Preparing an Optical Microscope for Dimensional Measurements | |
| | | 6856 | | Reapproval of SEMI MF673-0317, Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge | |
| | | 6857 | | Reapproval of SEMI MF28-0317Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay | |
| | | 6958 | | Reapproval of SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array | |
| | | 6959 | | Reapproval of SEMI MF1763 - Test Method for Measuring Contrast of a Linear Polarizer | |
|
|
| Silicon Wafer Committee |
| |
| | | TFOF | | Silicon Wafer Committee | |
| Traceability |
| |
|
|
| Japan |
| |
|
|
| 5 Year Review TF |
| |
| | | 6935 | | Reapproval of SEMI T19 - Specification for Device Marking | |
| | | TFOF | | 5 Year Review TF | |
|
|
| Blockchain Task Force |
| |
| | | 6910 | | New Standard: Specification of Blockchain for Semiconductor supply chain Traceability | |
| | | TFOF | | Blockchain Task Force | |
|
|
| Japan Equipment & Materials Traceability liaison Task Force |
| |
| | | TFOF | | Japan Equipment & Materials Traceability liaison Task Force | |
|
|
| Japan Single Device Traceability liaison Task Force |
| |
| | | TFOF | | Japan Single Device Traceability liaison Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force |
| |
| | | 6674 | | New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force | |
|
|
| North America |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 6698 | | Revision of SEMI M12-0706 (reapproved 0318), Specification for Serial Alphanumeric Marking of the Front Surface of Wafers, with title change to: Specification for Alphanumeric Marking of Wafers | |
| | | 6699 | | Revision of SEMI M13-0706 (reapproved 0318), Specification for Alphanumeric Marking of Silicon Wafers (Subject: adding alphanumeric marking at back surface in addition to front surface.) | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| Equipment and Materials Traceability Task Force |
| |
| | | 6448 | | New Standard: Specification for Material and Part Labels | |
| | | 6449 | | New Standard: Specification for Equipment and Materials Part Traceability | |
| | | TFOF | | Equipment and Materials Traceability Task Force | |
|
|
| Single Device Traceability Task Force |
| |
| | | 6504 | | New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain | |
| | | TFOF | | Single Device Traceability Task Force | |