SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms
TFOF (DOC 115K) (Feb 2020)
SNARF (DOC 133K) (Feb 2020)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Hide details for 3D Packaging and Integration3D Packaging and Integration
Hide details for JapanJapan
Hide details for 3D Packaging & Integration 5 Year Review Task Force3D Packaging & Integration 5 Year Review Task Force
6496 Line Item Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength”
6703 Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength”
6858 Revision to SEMI G13-88 (Reapproved 0811) with Title Change from “Standard Test Method for Expansion Characteristics of Molding Compounds” to: “Test Method For Thermal Expansion Characteristics Of Molding Compounds”
TFOF 3D Packaging & Integration 5 Year Review Task Force
Hide details for 3DS IC Bonded Layer Inspection Metrology TF3DS IC Bonded Layer Inspection Metrology TF
TFOF 3DS IC Bonded Layer Inspection Metrology TF
Hide details for Encapsulation Characteristics for Wafer Level Package and Panel Level PackagingEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging
6706 New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials
6707 New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials
6708 New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials
6709 New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials
6710 New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials
6711 New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials
6712 New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials
TFOF Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging
Hide details for JA 450mm Assembly and Test Die Preparation Task ForceJA 450mm Assembly and Test Die Preparation Task Force
6497 Line Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process"
TFOF JA 450mm Assembly and Test Die Preparation Task Force
Hide details for Panel Level Packaging (PLP) Glass Carrier Task ForcePanel Level Packaging (PLP) Glass Carrier Task Force
TFOF Panel Level Packaging (PLP) Glass Carrier Task Force
Hide details for Thin Chip Handling Task ForceThin Chip Handling Task Force
TFOF Thin Chip Handling Task Force
Hide details for North AmericaNorth America
Hide details for  NA 3D Packaging and Integration Committee NA 3D Packaging and Integration Committee
6810 Reapproval of SEMI 3D13-0715, Guide for Measuring Voids in Bonded Wafer Stacks
6811 Reapproval of SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC Applications
6812 Reapproval of SEMI 3D4-0915, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
6829 Line Item Revision to SEMI 3D16-1116, Specification for Glass Base Material for Semiconductor Packaging
Hide details for 3DP&I Bonded Wafer Stacks Task Force3DP&I Bonded Wafer Stacks Task Force
6641 Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process
TFOF 3DP&I Bonded Wafer Stacks Task Force
Hide details for 3DP&I Inspection and Metrology Task Force3DP&I Inspection and Metrology Task Force
TFOF 3DP&I Inspection and Metrology Task Force
Hide details for Panel Level Packaging (PLP) Panel Task ForcePanel Level Packaging (PLP) Panel Task Force
6591 Revision to SEMI 3D20-0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications
TFOF Panel Level Packaging (PLP) Panel Task Force
Hide details for TaiwanTaiwan
Hide details for 3DP&I Middle-End Process Task Force3DP&I Middle-End Process Task Force
5800 New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process
6405 Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS
6411 Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro-bump Processes for Frontside Through Silicon Via (TSV) Integration
6865 Reapproval of SEMI 3D15-0316 Guide for Overlay Performance Assessment for 3DS-IC Process
TFOF 3DP&I Middle-End Process Task Force
Hide details for 3DP&I Testing Task Force3DP&I Testing Task Force
6866 Line Item Revision to SEMI 3D14-0615 Guide for Incoming/Outgoing Quality control and Testing Flow for 3DSIC Products.
TFOF 3DP&I Testing Task Force
Hide details for Automated Test EquipmentAutomated Test Equipment
Hide details for North AmericaNorth America
Hide details for NA ATE 5-Year ReviewNA ATE 5-Year Review
TFOF NA ATE 5-Year Review
Hide details for Rich Interactive Test Database (RITdb)Rich Interactive Test Database (RITdb)
6518 New Standard: Specification for Rich Interactive Test Database (RITdb)
TFOF Rich Interactive Test Database (RITdb)
Hide details for Standard Test Data Format (STDF) Task ForceStandard Test Data Format (STDF) Task Force
TFOF Standard Test Data Format (STDF) Task Force
Hide details for Test Cell CommunicationsTest Cell Communications
TFOF Test Cell Communications
Hide details for Tester Event Messaging for Semiconductors (TEMS)Tester Event Messaging for Semiconductors (TEMS)
6580 New Standard: Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
6581 New Subordinate Standard: Specification for HTTP JSON Protocol Implementation for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS)
TFOF Tester Event Messaging for Semiconductors (TEMS)
Hide details for Automation TechnologyAutomation Technology
Hide details for EuropeEurope
Hide details for Equipment Interface Specification (EIS) Equipment Interface Specification (EIS)
5151 New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES)
5154 New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: 4804 "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM")
5339 Specification for Single Material Tracking and Tracing For Crystalline Silicon PV
5566 Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation.
TFOF Equipment Interface Specification (EIS)
Hide details for PV Wafer Traceability Task Force PV Wafer Traceability Task Force
TFOF PV Wafer Traceability Task Force
Hide details for GlobalGlobal
Hide details for Equipment Interface Specification (EIS)Equipment Interface Specification (EIS)
TFOF Equipment Interface Specification (EIS)
Hide details for JapanJapan
Hide details for A1 TFA1 TF
6825 Line Item Revision to SEMI A1-0521 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI)
TFOF A1 TF
Hide details for F-GEM TFF-GEM TF
6749 Line Item Revision to SEMI Ax-mmyy (Doc. #6673) Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX)
TFOF F-GEM TF
Hide details for SMT TFSMT TF
6826 Line Item Revision to SEMI A2-0521 Specification for Surface Mount Assembler Smart Hookup (SMASH)
6827 Line Item Revision to SEMI A2-0521 Specification for Surface Mount Assembler Smart Hookup (SMASH)
TFOF SMT TF
Hide details for TaiwanTaiwan
Hide details for Printed Circuit Board Equipment Communication Interface (PCBECI) Task ForcePrinted Circuit Board Equipment Communication Interface (PCBECI) Task Force
6263 New Standard: SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI)
6704 Line Item Revisions to SEMI A3-0819 SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI)
TFOF Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force
Hide details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Hide details for ChinaChina
Hide details for SiC Epitaxial Wafer Task ForceSiC Epitaxial Wafer Task Force
6693 New Standard: Specification for 4H-SiC Homo-Epitaxial Wafer
TFOF SiC Epitaxial Wafer Task Force
Hide details for Silicon Carbide Substrate Task ForceSilicon Carbide Substrate Task Force
6767 New Standard: Test Method for Flatness of Silicon Carbide Wafers by Optical Interference
6768 New Standard: Test Method for Micropipe Density of Silicon Carbide Wafer by Laser Reflection
6769 New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic
TFOF Silicon Carbide Substrate Task Force
Hide details for EuropeEurope
Hide details for 5 Year Review Task Force5 Year Review Task Force
6779 Reapproval of SEMI M64 - Test Method for the EL2 Deep Donor Concentration in Semi-Insulating (SI) Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy
6780 Line Item Revision of SEMI M87 - Test Method for Contactless Resistivity Measurement of Semi-Insulating Semiconductors
TFOF 5 Year Review Task Force
Hide details for EU Compound Semiconductor Materials CommitteeEU Compound Semiconductor Materials Committee
TFOF EU Compound Semiconductor Materials Committee
Hide details for Full-Wafer TSD Density Mapping of 4H-SiC Task ForceFull-Wafer TSD Density Mapping of 4H-SiC Task Force
6717 New Standard: Test Method for quantifying TSDs in 4H-SiC Crystals
TFOF Full-Wafer TSD Density Mapping of 4H-SiC Task Force
Hide details for SiC Material and Wafer Specification TFSiC Material and Wafer Specification TF
TFOF SiC Material and Wafer Specification TF
Hide details for JapanJapan
Hide details for Silicon Carbide Substrate liaison TFSilicon Carbide Substrate liaison TF
TFOF Silicon Carbide Substrate liaison TF
Hide details for North AmericaNorth America
Hide details for M86 Revision Task ForceM86 Revision Task Force
6806 Revision of M86-0915 Specification for polished monocrystalline c-plane gallium nitride wafers
TFOF M86 Revision Task Force
Hide details for M9 Revision Task ForceM9 Revision Task Force
6805 Revision Of SEMI M9.5-0813, Specification For Round 100 mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications
6818 Withdrawal Of SEMI M9.1-0813 — Specification For Round 50.8 Mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications
6819 Withdrawal Of SEMI M9.6-0813 — Specification For Round 125 Mm Diameter Polished Monocrystalline Gallium Arsenide Wafers
TFOF M9 Revision Task Force
Hide details for EH&SEH&S
Hide details for JapanJapan
Hide details for GHG Emission Characterization Task ForceGHG Emission Characterization Task Force
TFOF GHG Emission Characterization Task Force
Hide details for Japan Environmental Health and Safety CommitteeJapan Environmental Health and Safety Committee
6776 Reapproval of SEMI S19-0311 (Reapproved 0816): Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service Personnel
6777 Reapproval of SEMI S26-0516: Environmental, Health, and Safety Guideline for FPD Manufacturing System
TFOF Japan Environmental Health and Safety Committee
Hide details for S13 Revision Task ForceS13 Revision Task Force
TFOF S13 Revision Task Force
Hide details for S17 Revision Task ForceS17 Revision Task Force
TFOF S17 Revision Task Force
Hide details for S18 Revision Task ForceS18 Revision Task Force
TFOF S18 Revision Task Force
Hide details for S19 Revision TFS19 Revision TF
TFOF S19 Revision TF
Hide details for SDRCM(S Documents REG-PG-SM Conformance Maintenance) TFSDRCM(S Documents REG-PG-SM Conformance Maintenance) TF
TFOF SDRCM(S Documents REG-PG-SM Conformance Maintenance) TF
Hide details for Seismic Protection Task ForceSeismic Protection Task Force
TFOF Seismic Protection Task Force
Hide details for Japan and North AmericaJapan and North America
Hide details for Global Seismic Protection TFGlobal Seismic Protection TF
TFOF Global Seismic Protection TF
Hide details for S23 Revision Global Task ForceS23 Revision Global Task Force
TFOF S23 Revision Global Task Force
Hide details for North AmericaNorth America
Hide details for Control of Hazardous Energy (CoHE) Task ForceControl of Hazardous Energy (CoHE) Task Force
TFOF Control of Hazardous Energy (CoHE) Task Force
Hide details for Energetic Materials EHS Task ForceEnergetic Materials EHS Task Force
TFOF Energetic Materials EHS Task Force
Hide details for Ergonomics Task ForceErgonomics Task Force
5996 Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
6309 Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
TFOF Ergonomics Task Force
Hide details for Fire Protection Task ForceFire Protection Task Force
6595 Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
6784 Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
TFOF Fire Protection Task Force
Hide details for Manufacturing Equipment Safety SubcommitteeManufacturing Equipment Safety Subcommittee
TFOF Manufacturing Equipment Safety Subcommittee
Hide details for NA Environmental Health and Safety CommitteeNA Environmental Health and Safety Committee
TFOF NA Environmental Health and Safety Committee
Hide details for S1 Revision Task ForceS1 Revision Task Force
6783 Line Item Revisions to SEMI S1-1015 Safety Guideline for Equipment Safety Labels
6831 Revision to SEMI S1-1015 Safety Guideline for Equipment Safety Labels
TFOF S1 Revision Task Force
Hide details for S10 Task ForceS10 Task Force
6049 Line-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation Process
TFOF S10 Task Force
Hide details for S12 (Equipment Decon) Review Task ForceS12 (Equipment Decon) Review Task Force
6782 Line Item Revision of SEMI S12 - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
6822 Reapproval of SEMI S12-0211E - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
TFOF S12 (Equipment Decon) Review Task Force
Hide details for S2 Chemical Exposure Task ForceS2 Chemical Exposure Task Force
TFOF S2 Chemical Exposure Task Force
Hide details for S2 Interlocks Design Task ForceS2 Interlocks Design Task Force
TFOF S2 Interlocks Design Task Force
Hide details for S2 Mechanical Design Task ForceS2 Mechanical Design Task Force
TFOF S2 Mechanical Design Task Force
Hide details for S2 Pressure Guidelines Task ForceS2 Pressure Guidelines Task Force
6651 Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Addition of Pressure section)
TFOF S2 Pressure Guidelines Task Force
Hide details for S22 Task ForceS22 Task Force
TFOF S22 Task Force
Hide details for S3 Revision Task ForceS3 Revision Task Force
6830 Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS
TFOF S3 Revision Task Force
Hide details for S5 (FLD) Review Task ForceS5 (FLD) Review Task Force
6781 Line Item Revision of SEMI S5 - Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gases
TFOF S5 (FLD) Review Task Force
Hide details for S6 Revision Task ForceS6 Revision Task Force
TFOF S6 Revision Task Force
Hide details for S7 Task ForceS7 Task Force
6823 Reapproval of SEMI S7 - Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications
TFOF S7 Task Force
Hide details for Seismic Liaison Task ForceSeismic Liaison Task Force
TFOF Seismic Liaison Task Force
Hide details for TaiwanTaiwan
Hide details for Equipment Safety Task ForceEquipment Safety Task Force
TFOF Equipment Safety Task Force
Hide details for Seismic Task ForceSeismic Task Force
TFOF Seismic Task Force
Hide details for FacilitiesFacilities
Hide details for JapanJapan
Hide details for 5-year-review TF5-year-review TF
TFOF 5-year-review TF
Hide details for F1 Revision TFF1 Revision TF
TFOF F1 Revision TF
Hide details for Gas Box Components Joint Task ForceGas Box Components Joint Task Force
TFOF Gas Box Components Joint Task Force
Hide details for Japan Gases and Facilities CommitteeJapan Gases and Facilities Committee
TFOF Japan Gases and Facilities Committee
Hide details for KoreaKorea
Hide details for Equipment Cleanness Task Force Equipment Cleanness Task Force
TFOF Equipment Cleanness Task Force
Hide details for North AmericaNorth America
Hide details for Building Information Modeling (BIM) for Semiconductor Capital Equipment Task ForceBuilding Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
6628 New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling
TFOF Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Hide details for NA Facilities CommitteeNA Facilities Committee
6771 Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation
6772 Reapproval of SEMI E70-1213, Guide for Tool Accommodation Process
6773 Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services
6774 Reapproval of SEMI F49-0200 (Reapproved 1213), Guide for Semiconductor Factory Systems Voltage Sag Immunity
6775 Reapproval of SEMI F50-0200 (Reapproved 1213), Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories
TFOF NA Facilities Committee
Hide details for Power Grid Harmonics Task ForcePower Grid Harmonics Task Force
TFOF Power Grid Harmonics Task Force
Hide details for SEMI F51 Revision Task ForceSEMI F51 Revision Task Force
TFOF SEMI F51 Revision Task Force
Hide details for Voltage Sag Immunity Task ForceVoltage Sag Immunity Task Force
TFOF Voltage Sag Immunity Task Force
Hide details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Hide details for JapanJapan
Hide details for Flexible Display Task ForceFlexible Display Task Force
6694 Line Item Revision to SEMI D74-0116 “Guide for Measuring Dimensions of Plastic Films/Substrates”
TFOF Flexible Display Task Force
Hide details for FPD Color Filter Task ForceFPD Color Filter Task Force
TFOF FPD Color Filter Task Force
Hide details for FPD Mask Task ForceFPD Mask Task Force
TFOF FPD Mask Task Force
Hide details for FPD Materials & Components Maintenance Task ForceFPD Materials & Components Maintenance Task Force
6745 Line Item Revision to SEMI D50-0316: “TEST METHOD FOR SURFACE HARDNESS OF FLAT PANEL DISPLAY (FPD) COMPONENTS”
TFOF FPD Materials & Components Maintenance Task Force
Hide details for Japan FPD Materials and Components CommitteeJapan FPD Materials and Components Committee
TFOF Japan FPD Materials and Components Committee
Hide details for Polarizing Film TFPolarizing Film TF
TFOF Polarizing Film TF
Hide details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Hide details for JapanJapan
Hide details for D31 Revision Task ForceD31 Revision Task Force
TFOF D31 Revision Task Force
Hide details for KoreaKorea
Hide details for Perceptual Image QualityPerceptual Image Quality
6659 Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays
TFOF Perceptual Image Quality
Hide details for Perceptual Viewing AnglePerceptual Viewing Angle
5633 New Standard, Test Method for Viewing Angle Characteristic using Mixed Color on Visual Displays
6644 New Standard, Test Method for Viewing Angle of Flat Panel Displays
TFOF Perceptual Viewing Angle
Hide details for Picture Quality Evaluation Task ForcePicture Quality Evaluation Task Force
6701 New Standard: Test Method for Warm-up Properties of Display Picture Quality
6863 Line-item Revision to SEMI D64-0811, Test Method for Measuring the Spatial Contrast Ratio of Flat Panel Display
TFOF Picture Quality Evaluation Task Force
Hide details for Transparent DisplayTransparent Display
TFOF Transparent Display
Hide details for TaiwanTaiwan
Hide details for Flexible Displays Task ForceFlexible Displays Task Force
5948 New Standard: Guide for Mechanical Stress Test Methods in the Measurement of Gas Barrier Performance for Flexible Display Components and Devices under a Normal Usage Condition
5949 New Standard: TEST METHOD FOR LOCAL AND OVERALL FLICKER OF FLEXIBLE DISPLAYS
6632 New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays
TFOF Flexible Displays Task Force
Hide details for Maintenance Task ForceMaintenance Task Force
6864 Line item Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection
TFOF Maintenance Task Force
Hide details for Transparent Display Task ForceTransparent Display Task Force
6201 New Standard: Guide for Tone Reproduction Curves for Transparent Displays
6303 Reapproval of SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection
6737 New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays
TFOF Transparent Display Task Force
Hide details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Hide details for JapanJapan
Hide details for FHE TerminologyFHE Terminology
TFOF FHE Terminology
Hide details for TaiwanTaiwan
Hide details for FHE System for Wearable Task ForceFHE System for Wearable Task Force
6690 New Standard: Test Method of Line Impedance for Flexible Hybrid Electronics
6691 New Standard: Test Method of Sheet Resistance for Flexible Hybrid Electronics
TFOF FHE System for Wearable Task Force
Hide details for GasesGases
Hide details for EuropeEurope
Hide details for Cleaning GasesCleaning Gases
6148 Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing
TFOF Cleaning Gases
Hide details for Permeation Tubes for Trace Moisture CalibrationPermeation Tubes for Trace Moisture Calibration
TFOF Permeation Tubes for Trace Moisture Calibration
Hide details for North AmericaNorth America
Hide details for Filters and Purifiers Task ForceFilters and Purifiers Task Force
TFOF Filters and Purifiers Task Force
Hide details for Gases Specification Task ForceGases Specification Task Force
TFOF Gases Specification Task Force
Hide details for Heater Jacket Task ForceHeater Jacket Task Force
TFOF Heater Jacket Task Force
Hide details for Mass Flow Controller Task ForceMass Flow Controller Task Force
6643 New Standard: Specification for Location and Dimensions for Power Connectors and EtherCAT ports in Mass Flow Controllers and Mass Flow Meters
TFOF Mass Flow Controller Task Force
Hide details for Materials of Construction of Gas Delivery Systems Task ForceMaterials of Construction of Gas Delivery Systems Task Force
6394 Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems
6510 Line Item Revision to SEMI F32-0211, Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves
6582 New Standard: Test Method for the Electrochemical Critical Pitting Voltage Testing of Stainless Steel Used in Corrosive Gas Systems
6612 New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves
TFOF Materials of Construction of Gas Delivery Systems Task Force
Hide details for NA Gases CommitteeNA Gases Committee
6747 Line Item to Replace Designation Letter from C to F for SEMI C88-0815, Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems, SEMI C91-115, Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components, and SEMI C92-0216, Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution
6813 Reapproval of SEMI F28-1103 (Reapproved 0815), Test Method for Measuring Particle Generation from Process Panels
6814 Reapproval of SEMI F43-0308 (Reapproved 0613), Test Method for Determination of Particle Contribution by Point-of-Use Gas Purifiers and Gas Filters
6815 Reapproval of SEMI F59-0302 (Reapproved 0613), Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves
6816 Reapproval of SEMI F67-1101 (Reapproved 0713), Test Method for Determining Inert Gas Purifier Capacity
6817 Reapproval of SEMI F68-1101 (Reapproved 0713), Test Method for Determining Purifier Efficiency
Hide details for Pressure Measurement Task ForcePressure Measurement Task Force
TFOF Pressure Measurement Task Force
Hide details for Surface Mount Sandwich Component Dimensions Task ForceSurface Mount Sandwich Component Dimensions Task Force
TFOF Surface Mount Sandwich Component Dimensions Task Force
Hide details for HB-LEDHB-LED
Hide details for ChinaChina
Hide details for GaN based LED Epitaxial Wafer Task ForceGaN based LED Epitaxial Wafer Task Force
TFOF GaN based LED Epitaxial Wafer Task Force
Hide details for HB-LED Equipment Communication InterfaceHB-LED Equipment Communication Interface
6589 Revision to SEMI HB4-0913 (Reapproved 0419), Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI)
TFOF HB-LED Equipment Communication Interface
Hide details for Patterned Sapphire Substrate Task ForcePatterned Sapphire Substrate Task Force
6371 New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
TFOF Patterned Sapphire Substrate Task Force
Hide details for Sapphire Single Crystal Ingot Task ForceSapphire Single Crystal Ingot Task Force
TFOF Sapphire Single Crystal Ingot Task Force
Hide details for Sapphire Single Crystal Orientation Task Force Sapphire Single Crystal Orientation Task Force
TFOF Sapphire Single Crystal Orientation Task Force
Hide details for Single Crystal Sapphire Task ForceSingle Crystal Sapphire Task Force
TFOF Single Crystal Sapphire Task Force
Hide details for North AmericaNorth America
Hide details for HB-LED AssemblyHB-LED Assembly
TFOF HB-LED Assembly
Hide details for HB-LED Equipment Automation InterfacesHB-LED Equipment Automation Interfaces
TFOF HB-LED Equipment Automation Interfaces
Hide details for HB-LED Equipment Communication Interfaces TFHB-LED Equipment Communication Interfaces TF
TFOF HB-LED Equipment Communication Interfaces TF
Hide details for HB-LED Source Materials TFHB-LED Source Materials TF
5984 New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing
5985 New Standard: Guide for Triethylgallium for HB-LED Manufacturing
5986 New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing
5987 New Standard: Guide for Trimethylgallium for HB-LED Manufacturing
5988 New Standard: Guide for Trimethylindium for HB-LED Manufacturing
TFOF HB-LED Source Materials TF
Hide details for HB-LED Wafer TFHB-LED Wafer TF
TFOF HB-LED Wafer TF
Hide details for Impurities and Defects in HB-LED Sapphire WafersImpurities and Defects in HB-LED Sapphire Wafers
TFOF Impurities and Defects in HB-LED Sapphire Wafers
Hide details for NA HB-LED CommitteeNA HB-LED Committee
TFOF NA HB-LED Committee
Hide details for Patterned Sapphire Substrate (PSS) TFPatterned Sapphire Substrate (PSS) TF
TFOF Patterned Sapphire Substrate (PSS) TF
Hide details for Test Methods TFTest Methods TF
TFOF Test Methods TF
Hide details for Information & ControlInformation & Control
Hide details for EuropeEurope
Hide details for Process Control Solutions (PCS) Process Control Solutions (PCS)
TFOF Process Control Solutions (PCS)
Hide details for JapanJapan
Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
TFOF Backend Factory Integration Task Force
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOF Diagnostic Data Acquisition Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
TFOF Fab & Equipment Information Security Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
TFOF GEM 300 Task Force
Hide details for JA I&C Maintenance Task ForceJA I&C Maintenance Task Force
6770 Line-Item revision to E169-0615 Guide for Equipment Information System Security
6861 Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer
6862 Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer
TFOF JA I&C Maintenance Task Force
Hide details for Sensor Bus Task ForceSensor Bus Task Force
TFOF Sensor Bus Task Force
Hide details for KoreaKorea
Hide details for Advanced Back-end Factory Integration TFAdvanced Back-end Factory Integration TF
TFOF Advanced Back-end Factory Integration TF
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOF Diagnostic Data Acquisition Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
5832 New Standard, Specification for Equipment Generic Counter Model (EGCM)
6695 Line Item Revision to E87-0619, Specification for Carrier Management (CMS) and E87.1-0619, Specification for SECS-II Protocol for Carrier Management (CMS)
TFOF GEM 300 Task Force
Hide details for North AmericaNorth America
Hide details for Advanced Backend Factory IntegrationAdvanced Backend Factory Integration
6682 Line Item Revision to E142-XXXX: Specification for Substrate Mapping, E142.1-1016 XML Schema for Substrate Mapping and E142.2-1016 SECS II Protocol for Substrate Mapping
6802 Line Item Revision to SEMI E5-0220: SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II)
6804 Revision to Add a New Subordinate Standard: SPECIFICATION FOR SECS II PROTOCOL FOR SUBSTRATE MAPPING WITH ITEM TRANSFER to E142-0820: SPECIFICATION FOR SUBSTRATE MAPPING
6840 New Standard: Specification for Equipment Adoption Criteria for GEM And GEM-Based Standards
6852 Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping
TFOF Advanced Backend Factory Integration
Hide details for Diagnostic Data Acquisition Task Force NADiagnostic Data Acquisition Task Force NA
6343 Line-Item Revision to SEMI E138: Specification for XML Semiconductor Common Components
6345 Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for
Equipment Self Description (EqSD) to SEMI E125-0414, Specification for Equipment Self Description
(EqSD)
6346 Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) to SEMI E132-1015, Specification for Equipment Client Authentication and Authorization
6347 Revision to Add a New Subordinate Standard: Specification for Protocol Buffers of Data
Collection Management to SEMI E134-0414, Specification for Data Collection Management
6718 Revision to E125 SPECIFICATION FOR EQUIPMENT SELF DESCRIPTION (EqSD)
6719 Revision to SEMI E132-0419: Specification for Equipment Client Authentication and Authorization
6720 Revision to SEMI E134-0414: Specification for Data Collection Management
6721 Reapproval of SEMI E164 - Specification for EDA Common Metadata
6803 LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS
6837 LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS
TFOF Diagnostic Data Acquisition Task Force NA
Hide details for Energy Saving Equipment Communication Task ForceEnergy Saving Equipment Communication Task Force
TFOF Energy Saving Equipment Communication Task Force
Hide details for Fab & Equipment Computer and Device Security (CDS) Task ForceFab & Equipment Computer and Device Security (CDS) Task Force
6565 New Standard: Specification for Application Whitelisting
6566 New Standard: Specification for Malware Free Equipment Integration
TFOF Fab & Equipment Computer and Device Security (CDS) Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
6348 Revision to E30-0418: Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
6552 Line Item Revision to SEMI E5-0219: Specification For SEMI Equipment Communications Standard 2 Message Content (SECS-II)
6572 Revision to SEMI E30-0418: Specification for The Generic Model for Communications and Control of Manufacturing Equipment (GEM)
6597 Line Item Revision to SEMI E173-0415E: Specification for XML SECS-II Message Notation (SMN)
6598 Line Item Revision to SEMI E37-0819: Specification For High Speed Secs Message Services (HSMS) Generic Services and E37.1-XXYY: Specification For High-Speed Secs Message Service Single Selected-Session Mode (HSMS-SS)
6647 Line Item Revision to Standard E116-0518 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING (EPT) and E116.1-0707 (Reapproved 0518) SPECIFICATION FOR SECS-II PROTOCOL FOR EQUIPMENT PERFORMANCE TRACKING (EPT)
6683 Line Item Revision to Standard SEMI E148-1109 (Reapproved 0614)
SPECIFICATION FOR TIME SYNCHRONIZATION AND DEFINITION OF
THE TS-CLOCK OBJECT
6723 Reapproval of SEMI E90.1-0312 - Specification for SECS-II Protocol Substrate Tracking
6835 LINE ITEM REVISION TO SEMI E87-XXXX SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-XXXX SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT (CMS)
6836 LINE ITEM REVISION TO SEMI E87-0619 SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-0619 SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT(CMS) and SEMI E90-1218
SPECIFICATION FOR SUBSTRATE TRACKING and SEMI E90.1-0312
SPECIFICATION FOR SECS-II PROTOCOL FOR SUBSTRATE TRACKING
6850 Reapproval of SEMI E109.1-1110, Specification for SECS-II Protocol for Reticle and Pod Management (RPMS)
6851 Reapproval of SEMI E123.1-0703 (Reapproved 1109), Specification for SECS-II Protocol for Handler Specific Equipment Model (HSEM)
6859 Revision to SEMI E116-0518 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING (EPT) and E116.1-0707 (Reapproved 0518) SPECIFICATION FOR SECS-II PROTOCOL FOR EQUIPMENT PERFORMANCE TRACKING (EPT)
TFOF GEM 300 Task Force
Hide details for Graphical User Interfaces (GUI) Task ForceGraphical User Interfaces (GUI) Task Force
6743 Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment
TFOF Graphical User Interfaces (GUI) Task Force
Hide details for NA Information and Control CommitteeNA Information and Control Committee
TFOF NA Information and Control Committee
Hide details for Process Control System NAProcess Control System NA
TFOF Process Control System NA
Hide details for Process Control System NA Task ForceProcess Control System NA Task Force
6649 Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS)
6722 Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices
6724 Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device
TFOF Process Control System NA Task Force
Hide details for Sensor Bus Task ForceSensor Bus Task Force
6174 Line Item Revision to SEMI E54.9, Specification for Sensor/Actuator Network Communication Specification for Modbus/TCP over TCP/IP
6562 Line-item Revision to SEMI E54.23: Specification for Sensor/Actuator Network Communications for CC-Link IE Field Network
6563 Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device
6564 Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges
6744 Line Item Revision to SEMI E54.4-0316, Specification for Sensor/Actuator Network Communications for DeviceNet
6845 Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network
6846 Reapproval of SEMI E54.1-0316, Specification for Sensor/Actuator Network Common Device Mode
6847 Reapproval of SEMI E54.2-0316, Guide for Writing Sensor/Actuator Network (SAN) Letter Ballots
6848 Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT
6849 Reapproval of SEMI E54.24-1116, Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENsen)
TFOF Sensor Bus Task Force
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Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
6147 New Standard: Specification of Backend Die Traceability
TFOF Backend Factory Integration Task Force
Hide details for Equipment Edge Data Governance (EEDG) Task ForceEquipment Edge Data Governance (EEDG) Task Force
TFOF Equipment Edge Data Governance (EEDG) Task Force
Hide details for Equipment Information Integration Task ForceEquipment Information Integration Task Force
TFOF Equipment Information Integration Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
6506 New Standard: Specification for Cybersecurity of Fab Equipment
TFOF Fab & Equipment Information Security Task Force
Hide details for GEM300 Task Force GEM300 Task Force
TFOF GEM300 Task Force
Hide details for Liquid ChemicalsLiquid Chemicals
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Hide details for EU Gases and Liquid Chemicals CommitteeEU Gases and Liquid Chemicals Committee
TFOF EU Gases and Liquid Chemicals Committee
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TFOF Precursor Specifications Task Force
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TFOF Solvents in Advanced Processes
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Hide details for Diaphragm Valves Task ForceDiaphragm Valves Task Force
TFOF Diaphragm Valves Task Force
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TFOF Liquid-Borne Particle Counter Task Force
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TFOF Liquid Filter Task Force
Hide details for Trace Metal Analysis for High Pure IPA Task ForceTrace Metal Analysis for High Pure IPA Task Force
6820 New Standard: Guide for Trace Iron Analysis in High Purity IPA
TFOF Trace Metal Analysis for High Pure IPA Task Force
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TFOF Welding Fitting Task Force
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Hide details for Chemical Analytical Methods Task ForceChemical Analytical Methods Task Force
6315 Line Item Revision to SEMI C30-0218, Specification for Hydrogen Peroxide
6388 Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid
6451 Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals
6509 Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change
TFOF Chemical Analytical Methods Task Force
Hide details for Chemical Mechanical Planarization Consumables (CMP-C) Task ForceChemical Mechanical Planarization Consumables (CMP-C) Task Force
6677 New Standard: Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks used in Semiconductor Manufacturing
6748 New Standard: Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing
TFOF Chemical Mechanical Planarization Consumables (CMP-C) Task Force
Hide details for High Purity Liquid Assemblies & Systems Task ForceHigh Purity Liquid Assemblies & Systems Task Force
6828 Line Item Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems
TFOF High Purity Liquid Assemblies & Systems Task Force
Hide details for High Purity Polymer Materials and Components Task ForceHigh Purity Polymer Materials and Components Task Force
6601 New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems
6713 Line Item Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems
6729 Line Item Revision to SEMI F57-0120, Specification for Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems
TFOF High Purity Polymer Materials and Components Task Force
Hide details for Ultra Pure Water Task ForceUltra Pure Water Task Force
6714 Line Item Revision to SEMI C93-0620, Guide for Determining the Quality of Ion Exchange Resin Used in Polish Applications of Ultrapure Water System
TFOF Ultra Pure Water Task Force
Hide details for Water Management Task ForceWater Management Task Force
6715 New Standard: Guide for Measuring Particle Precursors in Ultrapure Water
6716 Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems
TFOF Water Management Task Force
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Hide details for TerminologyTerminology
TFOF Terminology
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Hide details for MEMS and Miniaturized Gas Sensing Task ForceMEMS and Miniaturized Gas Sensing Task Force
6746 New Standard: Guide for Critical Parameters of Gas Sensors
TFOF MEMS and Miniaturized Gas Sensing Task Force
Hide details for MEMS Material Characterization Task ForceMEMS Material Characterization Task Force
TFOF MEMS Material Characterization Task Force
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TFOF MEMS Packaging Task Force
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TFOF MEMS Reliability Task Force
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TFOF MEMS Substrate Task Force
Hide details for NA MEMS/NEMS CommitteeNA MEMS/NEMS Committee
6843 Reapproval of SEMI MS4-0416, Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance
6844 Reapproval of SEMI MS8-0309 (Reapproved 0915), Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages
TFOF NA MEMS/NEMS Committee
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TFOF Wafer Bond Task Force
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Hide details for Cycle Time Metrics Task ForceCycle Time Metrics Task Force
TFOF Cycle Time Metrics Task Force
Hide details for Japan RF Measurement liaison Task ForceJapan RF Measurement liaison Task Force
6550 Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems
TFOF Japan RF Measurement liaison Task Force
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Hide details for Critical Chamber Components (CCC) Test Methods Task Force Critical Chamber Components (CCC) Test Methods Task Force
6473 New Subordinate Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Showerheads Used in Semiconductor Wafer Processing
6599 Line Item Revision to SEMI E180-1219, Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing.
TFOF Critical Chamber Components (CCC) Test Methods Task Force
Hide details for EMC Task ForceEMC Task Force
TFOF EMC Task Force
Hide details for Equipment Cost of Ownership Task ForceEquipment Cost of Ownership Task Force
6841 Line-item Revisions to SEMI E35-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment
6842 Line-item Revisions to SEMI E140-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
TFOF Equipment Cost of Ownership Task Force
Hide details for Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task ForceEquipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
6578 Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
6579 Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
6678 Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
6679 Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
6785 LINE ITEM REVISIONS TO SEMI E10-0221: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
6786 LINE ITEM REVISIONS TO SEMI E79-0221: Specification for Definition and Measurement of Equipment Productivity
TFOF Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
Hide details for Equipment Training and Documentation Task ForceEquipment Training and Documentation Task Force
TFOF Equipment Training and Documentation Task Force
Hide details for ESD/ESC Task Force- N.AESD/ESC Task Force- N.A
6467 Line-Item Revision to SEMI E129-0912, Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility
6468 Line-Item Revision to SEMI E78-0912, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
TFOF ESD/ESC Task Force- N.A
Hide details for North America Metrics Technical CommitteeNorth America Metrics Technical Committee
TFOF North America Metrics Technical Committee
Hide details for RF Measurements Task ForceRF Measurements Task Force
6676 Revision to SEMI E136-1104 (Reapproved 0512)
TEST METHOD FOR DETERMINING THE OUTPUT POWER OF RF
GENERATORS USED IN SEMICONDUCTOR PROCESSING
EQUIPMENT RF POWER DELIVERY SYSTEMS
6838 Reapproval of SEMI E114-0302E (Reapproved 0616), Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems
6839 Reapproval of SEMI E115-0302E (Reapproved 0816), Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems
TFOF RF Measurements Task Force
Hide details for MicropatterningMicropatterning
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Hide details for Curvilinear Format Task ForceCurvilinear Format Task Force
6821 New Standard: Specification for Improved Curvilinear Layout Representation
TFOF Curvilinear Format Task Force
Hide details for Mask Orders Task ForceMask Orders Task Force
TFOF Mask Orders Task Force
Hide details for Micropatterning CommitteeMicropatterning Committee
6807 Reapproval of SEMI P5-0416 Specification for Pellicles
6808 Reapproval of SEMI P40-1109 (Reapproved 0416) Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks
6809 Reapproval of SEMI P48-1110 (Reapproved 0416) Specification of Fiducial Marks for EUV Mask Blank
Hide details for NA Microlithography Committee for 5-Year ReviewNA Microlithography Committee for 5-Year Review
TFOF NA Microlithography Committee for 5-Year Review
Hide details for P47 Revision Task ForceP47 Revision Task Force
6516
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
TFOF P47 Revision Task Force
Hide details for Patterning Metrology Task ForcePatterning Metrology Task Force
6220 Line Item revision to SEMI P19-92 (Reapproved 0707)
SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE
6221 Revision to SEMI P18-92 (Reapproved 1104)
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS
TFOF Patterning Metrology Task Force
Hide details for PhotovoltaicPhotovoltaic
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Hide details for Building Integrated Photovoltaic (BIPV) Task ForceBuilding Integrated Photovoltaic (BIPV) Task Force
6542 New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building
6700 New Standard: Test Method of Wind Uplift Resistance for Roof-Top Building Integrated Photovoltaics (BIPV)
TFOF Building Integrated Photovoltaic (BIPV) Task Force
Hide details for Crystalline Silicon Solar Cell Task ForceCrystalline Silicon Solar Cell Task Force
6670 Revision to SEMI PV58-0115, Specification for Aluminum Paste, Used in Back Surface Field of Crystalline Silicon Solar Cells
TFOF Crystalline Silicon Solar Cell Task Force
Hide details for PV Equipment Task ForcePV Equipment Task Force
5983 New Standard: Test method for In-Line Sheet Resistance Inspection Using the Junction Photo-Voltage Method
6667 Reapproval of SEMI PV68-0815, Test Method for the Wire Tension of Multi-Wire Saws
TFOF PV Equipment Task Force
Hide details for PV Module Task ForcePV Module Task Force
6113 New Standard: Test Method for Abrasion Resistance of the Polymer Backsheet of Crystalline Silicon Solar Modules
6610 Revision to SEMI PV86-1018, Specification for Crystalline Silicon Photovoltaic Module Dimensions
TFOF PV Module Task Force
Hide details for Thin Film PV Module Task ForceThin Film PV Module Task Force
6401 New Standard: Test Method for Indentation Force of Flexible Thin Film PV Modules
6402 New Standard: Test Method for Vibration Durability of Flexible Thin Film PV Module
6697
Withdrawal of SEMI PV73-0216, Test Method for Thin-Film Silicon Photovoltaic (PV) Modules Light Soaking
6778 Reapproval to SEMI PV78-0817, Test Method for Bending Property of Flexible Thin Film Photovoltaic (PV) Modules
TFOF Thin Film PV Module Task Force
Hide details for TaiwanTaiwan
Hide details for  Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
6297 New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC)
6539 New Standard :Specification of reference device for indoor lighting simulator
6540 New Standard :Test Method for Durability of Flexible emerging PV
6730 Revision of SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC)
6731 Revision of SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC)and Perovskite Solar Cell(PSC)
6732 Revision of SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC)
6733 Revision of SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic With Title Change To SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic and Perovskite Solar Cell(PSC)
6734 Revision of SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic With Title Change To SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic and Perovskite Solar Cell(PSC)
TFOF Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
Hide details for PV Reliability Test Method Task Force PV Reliability Test Method Task Force
6705 Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation
TFOF PV Reliability Test Method Task Force
Hide details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
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Hide details for PV Silicon Raw Materials Task ForcePV Silicon Raw Materials Task Force
TFOF PV Silicon Raw Materials Task Force
Hide details for PV Silicon Wafer Task ForcePV Silicon Wafer Task Force
TFOF PV Silicon Wafer Task Force
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Hide details for PV Material Degradation Task ForcePV Material Degradation Task Force
TFOF PV Material Degradation Task Force
Hide details for PV Silicon Materials Task ForcePV Silicon Materials Task Force
TFOF PV Silicon Materials Task Force
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Hide details for Japan PV Materials Task ForceJapan PV Materials Task Force
TFOF Japan PV Materials Task Force
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Hide details for International PV Analytical Test Methods, Metrology, and Inspection Task ForceInternational PV Analytical Test Methods, Metrology, and Inspection Task Force
TFOF International PV Analytical Test Methods, Metrology, and Inspection Task Force
Hide details for Physical Interfaces & CarriersPhysical Interfaces & Carriers
Hide details for EuropeEurope
Hide details for EU Equipment Automation Committee (Physical Interfaces & Carriers)EU Equipment Automation Committee (Physical Interfaces & Carriers)
TFOF EU Equipment Automation Committee (Physical Interfaces & Carriers)
Hide details for InternationalInternational
Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6833 Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
6834 Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
TFOF Global PIC Maintenance Task Force
Hide details for International 450 mm Physical Interfaces & CarriersInternational 450 mm Physical Interfaces & Carriers
TFOF International 450 mm Physical Interfaces & Carriers
Hide details for International Reticle SMIF Pod and Load Port Interoperability Task ForceInternational Reticle SMIF Pod and Load Port Interoperability Task Force
TFOF International Reticle SMIF Pod and Load Port Interoperability Task Force
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Hide details for 300mm Tape Frame PI&C Task Force300mm Tape Frame PI&C Task Force
6688 New Standard - SPECIFICATION FOR 300mm TAPE FRAME FOUP LOAD PORT
6689 New Standard – SPECIFICATION FOR 300mm TAPE FRAME FOUP
TFOF 300mm Tape Frame PI&C Task Force
Hide details for Japan Electron Microscopy Workflow liaison Task ForceJapan Electron Microscopy Workflow liaison Task Force
TFOF Japan Electron Microscopy Workflow liaison Task Force
Hide details for Panel Level Packaging Panel FOUP Task ForcePanel Level Packaging Panel FOUP Task Force
6618 New Standard - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING
6619 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 12 SLOTS
6620 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 6 SLOTS
6621 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 12 SLOTS
6622 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 6 SLOTS
6684 New Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING
6685 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 510MM-515MM PANEL SIZE
6686 New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 600MM-600MM PANEL SIZE
6750 Line Item Revision to SEMI E181-0321 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING, SEMI E181.1-0321 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS, SEMI E181.2-0321 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS, SEMI E181.3-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and SEMI E181.4-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
6751 Line Item Revision to SEMI E181.3-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS
6752 Line Item Revision to SEMI E181.4-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
TFOF Panel Level Packaging Panel FOUP Task Force
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Hide details for Electron Microscopy Workflow Task ForceElectron Microscopy Workflow Task Force
6592 New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows
6832 New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user
TFOF Electron Microscopy Workflow Task Force
Hide details for NA 450mm Assembly Test Die Prep Task ForceNA 450mm Assembly Test Die Prep Task Force
TFOF NA 450mm Assembly Test Die Prep Task Force
Hide details for NA 450mm Shipping Box Task ForceNA 450mm Shipping Box Task Force
TFOF NA 450mm Shipping Box Task Force
Hide details for Silicon WaferSilicon Wafer
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Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
6462 Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
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Hide details for International 450 mm Shipping BoxInternational 450 mm Shipping Box
TFOF International 450 mm Shipping Box
Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
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TFOF International Terminology Task Force
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TFOF International Test Methods Task Force
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Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6570 New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique
6681 Reapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning
6687 Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
Hide details for JA Shipping Box Task ForceJA Shipping Box Task Force
TFOF JA Shipping Box Task Force
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TFOF Japan AWG Task Force
Hide details for Japan TC Chapter of Global Technical TommitteeJapan TC Chapter of Global Technical Tommittee
TFOF Japan TC Chapter of Global Technical Tommittee
Hide details for Japan Test Method Task ForceJapan Test Method Task Force
5772 Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
6702 Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION
TFOF Japan Test Method Task Force
Hide details for Test Method Task ForceTest Method Task Force
TFOF Test Method Task Force
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Hide details for International Annealed Si Wafer Task ForceInternational Annealed Si Wafer Task Force
6766 Reapproval of SEMI M57-0316 Specification for Silicon Annealed Wafers
Hide details for International Automated Advanced Surface Inspection Task ForceInternational Automated Advanced Surface Inspection Task Force
6824 Line Item Revision of SEMI MF1048 - Test Method for Measuring the Reflective Total Integrated Scatter
Hide details for International SOI Wafers Task ForceInternational SOI Wafers Task Force
6583 New Standard: Specification for SOI Wafers for RF Device Applications
6860 Revision of SEMI M41- 0615, Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6753 Reapproval of SEMI MF723-0307E (Reapproved 0412)E Practice for Conversion Between Resistivity and Dopant or Carrier Density for Boron-Doped, Phosphorous-Doped, and Arsenic-Doped Silicon
6754 Reapproval of SEMI MF674-0316 Practice for Preparing Silicon for Spreading Resistance Measurements
6755 Reapproval of SEMI MF533-0310 (Reapproved 0416) Test Method for Thickness and Thickness Variation of Silicon Wafers
6756 Reapproval of SEMI MF43-0316 Test Method for Resistivity of Semiconductor Materials
6757 Reapproval of SEMI MF42-0316 Test Method for Conductivity Type of Extrinsic Semiconducting Materials
6758 Reapproval of SEMI MF2139-1103 (Reapproved 0416) Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry
6759 Reapproval of SEMI MF1811-1116 Guide for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data
6760 Reapproval of SEMI MF1771-0416 Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique
6761 Reapproval of SEMI MF1535-1015 Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
6762 Reapproval of SEMI MF1529-1110 (Reapproved 1115) Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure
6763 Reapproval of SEMI MF1239-0305 (Reapproved 0416) Test Method for Oxygen Precipitation Characteristics of Silicon Wafers by Measurement of Interstitial Oxygen Reduction
6764 Reapproval of SEMI MF1153-1110 (Reapproved 1015) Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements
6765 Reapproval of SEMI MF1152-0316 Test Method for Dimensions of Notches on Silicon Wafers
6787 Reapproval of SEMI MF951 - Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers
6788 Reapproval of SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques
6789 Reapproval of SEMI MF81 - Test Method for Measuring Radial Resistivity Variation on Silicon Wafers
6790 Reapproval of SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
6791 Reapproval of SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers
6792 Reapproval of SEMI MF1725 - Practice for Analysis of Crystallographic Perfection of Silicon Ingots
6793 Reapproval of SEMI MF1726 - Practice for Analysis of Crystallographic Perfection of Silicon Wafers
6794 Reapproval of SEMI MF1727 - Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers
6795 Reapproval of SEMI MF1617 - Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry
6796 Reapproval of SEMI MF1618 - Practice for Determination of Uniformity of Thin Films on Silicon Wafers
6797 Reapproval of SEMI MF154 - Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces
6798 Reapproval of SEMI MF1389 - Test Method for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities
6799 Reapproval of SEMI M66 - Test Method to Extract Effective Work Function in Oxide and High-K Gate Stacks Using the MIS Flat Band Voltage-Insulator Thickness Technique
6800 Reapproval of SEMI M16 - Specification for Polycrystalline Silicon
6801 Reapproval of SEMI M17 - Guide for a Universal Wafer Grid
6853 Reapproval of SEMI MF978-1106 (Reapproved 0317) Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques
6854 Reapproval of SEMI MF928-0317, Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
6855 Reapproval of SEMI MF728-1106 (Reapproved 0317)Practice for Preparing an Optical Microscope for Dimensional Measurements
6856 Reapproval of SEMI MF673-0317, Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
6857 Reapproval of SEMI MF28-0317Test Method for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
TFOF Silicon Wafer Committee
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Hide details for JapanJapan
Hide details for 5 Year Review TF5 Year Review TF
TFOF 5 Year Review TF
Hide details for Blockchain Task ForceBlockchain Task Force
TFOF Blockchain Task Force
Hide details for Japan Equipment & Materials Traceability liaison Task ForceJapan Equipment & Materials Traceability liaison Task Force
TFOF Japan Equipment & Materials Traceability liaison Task Force
Hide details for Japan Single Device Traceability liaison Task ForceJapan Single Device Traceability liaison Task Force
TFOF Japan Single Device Traceability liaison Task Force
Hide details for Panel Level Packaging (PLP) Glass Carrier ID Marking Task ForcePanel Level Packaging (PLP) Glass Carrier ID Marking Task Force
6674 New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications
TFOF Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force
Hide details for North AmericaNorth America
Hide details for 5 Year Review Task Force5 Year Review Task Force
6604 Line Item Revision to SEMI T5-1214: Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers
6605 Reapproval to SEMI T11-0703 (Reapproved 1014): Specification for Marking of Hard Surface Reticle Substrates
6669 Revision of SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers
6698 Revision of SEMI M12-0706 (reapproved 0318), Specification for Serial Alphanumeric Marking of the Front Surface of Wafers, with title change to: Specification for Alphanumeric Marking of Wafers
6699 Revision of SEMI M13-0706 (reapproved 0318), Specification for Alphanumeric Marking of Silicon Wafers (Subject: adding alphanumeric marking at back surface in addition to front surface.)
6738 Reapproval of SEMI T16-0310 (Reapproved 0216) - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks
6739 Reapproval of SEMI T20-0710 (Reapproved 0416) - Specification for Authentication of Semiconductors and Related Products
6740 Reapproval of SEMI T8-1110 (Reapproved 0216) - Specification for Marking of Glass Flat Panel Display Substrates with a Two-Dimensional Matrix Code Symbol
6741 Reapproval of SEMI T9-1110 (Reapproved 0216) - Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol
6742 Reapproval of SEMI T7-0516 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
TFOF 5 Year Review Task Force
Hide details for Equipment and Materials Traceability Task ForceEquipment and Materials Traceability Task Force
6448 New Standard: Specification for Equipment and Materials Labels
6449 New Standard: Specification for Equipment and Materials Part Traceability
TFOF Equipment and Materials Traceability Task Force
Hide details for Single Device Traceability Task Force Single Device Traceability Task Force
6504 New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain
TFOF Single Device Traceability Task Force

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