SEMI International Standards
SEMI New Activity Report Forms (SNARFs)
& SEMI Task Force Organization Forms (TFOFs)

Below you will find the TFOFs of all the task forces actively working in each region. The TFOF contains the charter and purpose of each task force.

The SNARFs that are listed under each task force are the individual activities of the task force. While the majority of these activities lead to the creation or revision of a standard, there are some activities which are focused on exploring and expanding the program.

If you have any further questions on a specific activity, contact your local Standards staff. A listing of global SEMI Standards staff can be found on the contact information page.

Blank forms
TFOF (DOC 115K) (Feb 2020)
SNARF (DOC 133K) (Nov 2021)

The listing of SNARFs and TFOFs below are sorted by Global Technical Committee, and then by the region that approved the TFOF.

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Hide details for 3D Packaging and Integration3D Packaging and Integration
Hide details for JapanJapan
Hide details for 3D Packaging & Integration 5 Year Review Task Force3D Packaging & Integration 5 Year Review Task Force
6994 Reapproval of SEMI G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size
6995 Reapproval of SEMI G71-0996 (Reapproved 0318) Specification for Barcode Marking of Intermediate Containers for Packaging Materials
6996 Reapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds
6997 Reapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes
6998 Reapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic
6999 Reapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages
7019 Reapproval of SEMI G64-1118,Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)
7020 Reapproval of SEMI G94-0113 (Reapproved 1118) Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer
TFOF 3D Packaging & Integration 5 Year Review Task Force
Hide details for 3DS IC Bonded Layer Inspection Metrology TF3DS IC Bonded Layer Inspection Metrology TF
TFOF 3DS IC Bonded Layer Inspection Metrology TF
Hide details for JA 450mm Assembly and Test Die Preparation Task ForceJA 450mm Assembly and Test Die Preparation Task Force
TFOF JA 450mm Assembly and Test Die Preparation Task Force
Hide details for Panel Level Packaging (PLP) Glass Carrier Task ForcePanel Level Packaging (PLP) Glass Carrier Task Force
TFOF Panel Level Packaging (PLP) Glass Carrier Task Force
Hide details for North AmericaNorth America
Hide details for 3DP&I Bonded Wafer Stacks Task Force3DP&I Bonded Wafer Stacks Task Force
TFOF 3DP&I Bonded Wafer Stacks Task Force
Hide details for 3DP&I Inspection and Metrology Task Force3DP&I Inspection and Metrology Task Force
7099 Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
7100 Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
7101 Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
7102 Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology
TFOF 3DP&I Inspection and Metrology Task Force
Hide details for Panel Level Packaging (PLP) Panel Task ForcePanel Level Packaging (PLP) Panel Task Force
TFOF Panel Level Packaging (PLP) Panel Task Force
Hide details for TaiwanTaiwan
Hide details for 3DP&I Middle-End Process Task Force3DP&I Middle-End Process Task Force
TFOF 3DP&I Middle-End Process Task Force
Hide details for 3DP&I Testing Task Force3DP&I Testing Task Force
6921 New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe
TFOF 3DP&I Testing Task Force
Hide details for Automated Test EquipmentAutomated Test Equipment
Hide details for North AmericaNorth America
Hide details for NA ATE 5-Year ReviewNA ATE 5-Year Review
TFOF NA ATE 5-Year Review
Hide details for Rich Interactive Test Database (RITdb)Rich Interactive Test Database (RITdb)
6905 Line Item Revision to SEMI E183-1121: Specification for Rich Interactive Test Database (RITdb)
6973 New Standard: Guide for Generic Model on Manufacturing Flow Impacting Semiconductor Test
6974 New Standard: Specification for Rich Interactive Test Database Event Message Content
TFOF Rich Interactive Test Database (RITdb)
Hide details for Standard Test Data Format (STDF) Task ForceStandard Test Data Format (STDF) Task Force
TFOF Standard Test Data Format (STDF) Task Force
Hide details for Test Cell CommunicationsTest Cell Communications
TFOF Test Cell Communications
Hide details for Tester Event Messaging for Semiconductors (TEMS)Tester Event Messaging for Semiconductors (TEMS)
TFOF Tester Event Messaging for Semiconductors (TEMS)
Hide details for Automation TechnologyAutomation Technology
Hide details for JapanJapan
Hide details for A1 TFA1 TF
6825 Line Item Revision to SEMI A1-0521 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI)
TFOF A1 TF
Hide details for F-GEM TFF-GEM TF
TFOF F-GEM TF
Hide details for SMT TFSMT TF
6827 Line Item Revision to SEMI A2-0521 Specification for Surface Mount Assembler Smart Hookup (SMASH)
TFOF SMT TF
Hide details for TaiwanTaiwan
Hide details for Printed Circuit Board Equipment Communication Interface (PCBECI) Task ForcePrinted Circuit Board Equipment Communication Interface (PCBECI) Task Force
TFOF Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force
Hide details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Hide details for ChinaChina
Hide details for SiC Epitaxial Wafer Task ForceSiC Epitaxial Wafer Task Force
6693 New Standard: Specification for 4H-SiC Homoepitaxial Wafer
TFOF SiC Epitaxial Wafer Task Force
Hide details for Silicon Carbide Substrate Task ForceSilicon Carbide Substrate Task Force
6767 New Standard: Test Method for GBIR, SBIR, GF3R, SFQR and SORI of Silicon Carbide Wafers by Oblique Incident Interference Method
6768 New Standard: Test Method for Micropipe Density of Silicon Carbide Wafer by Laser Reflection
6769 New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic
TFOF Silicon Carbide Substrate Task Force
Hide details for EuropeEurope
Hide details for 5 Year Review Task Force5 Year Review Task Force
7053 Line Item Revision of SEMI M63, TEST METHOD FOR MEASURING THE Al FRACTION IN AlGaAs ON GaAs SUBSTRATES BY HIGH RESOLUTION X-RAY DIFFRACTION
TFOF 5 Year Review Task Force
Hide details for EU Compound Semiconductor Materials CommitteeEU Compound Semiconductor Materials Committee
TFOF EU Compound Semiconductor Materials Committee
Hide details for SiC Material and Wafer Specification TFSiC Material and Wafer Specification TF
TFOF SiC Material and Wafer Specification TF
Hide details for Test Methods Task ForceTest Methods Task Force
6870 New Standard: Test Method for Quantifying Basal Plane Dislocations in 4H-SiC by X-ray Topography
TFOF Test Methods Task Force
Hide details for JapanJapan
Hide details for SiC Epitaxial Wafer liaison TFSiC Epitaxial Wafer liaison TF
TFOF SiC Epitaxial Wafer liaison TF
Hide details for Silicon Carbide Substrate liaison TFSilicon Carbide Substrate liaison TF
TFOF Silicon Carbide Substrate liaison TF
Hide details for North AmericaNorth America
Hide details for M86 Revision Task ForceM86 Revision Task Force
TFOF M86 Revision Task Force
Hide details for M9 Revision Task ForceM9 Revision Task Force
TFOF M9 Revision Task Force
Hide details for EH&SEH&S
Hide details for JapanJapan
Hide details for Japan Environmental Health and Safety CommitteeJapan Environmental Health and Safety Committee
7028 Reapproval of SEMI S21-0818, Safety Guideline for Worker Protection
TFOF Japan Environmental Health and Safety Committee
Hide details for Japan S2 major revision liaison TF (JA-S2 revision LTF) Japan S2 major revision liaison TF (JA-S2 revision LTF)
TFOF Japan S2 major revision liaison TF (JA-S2 revision LTF)
Hide details for S18 Revision Task ForceS18 Revision Task Force
6289 Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS
TFOF S18 Revision Task Force
Hide details for Japan and North AmericaJapan and North America
Hide details for Global Seismic Protection TFGlobal Seismic Protection TF
TFOF Global Seismic Protection TF
Hide details for S23 Revision Global Task ForceS23 Revision Global Task Force
TFOF S23 Revision Global Task Force
Hide details for North AmericaNorth America
Hide details for Control of Hazardous Energy (CoHE) Task ForceControl of Hazardous Energy (CoHE) Task Force
6942 Line Item Revision to SEMI S2,  Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Related to CoHE/LOTO section of S2)
TFOF Control of Hazardous Energy (CoHE) Task Force
Hide details for Energetic Materials EHS Task ForceEnergetic Materials EHS Task Force
7022 Line Item Revision to SEMI S30, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes (energetic materials)
TFOF Energetic Materials EHS Task Force
Hide details for Environmental Performance Rating (EPR) Task ForceEnvironmental Performance Rating (EPR) Task Force
TFOF Environmental Performance Rating (EPR) Task Force
Hide details for Ergonomics Task ForceErgonomics Task Force
6309 Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
6943 Line Item Revisions to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
6981 Line Item Revision to S8-0218, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
TFOF Ergonomics Task Force
Hide details for Fire Protection Task ForceFire Protection Task Force
6595 Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
6784 Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
6944 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Regarding Fire Protection)
TFOF Fire Protection Task Force
Hide details for Flammable Gas Task ForceFlammable Gas Task Force
6980 Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re:Flammable gas)
TFOF Flammable Gas Task Force
Hide details for Manufacturing Equipment Safety SubcommitteeManufacturing Equipment Safety Subcommittee
TFOF Manufacturing Equipment Safety Subcommittee
Hide details for NA Environmental Health and Safety CommitteeNA Environmental Health and Safety Committee
TFOF NA Environmental Health and Safety Committee
Hide details for S1 Revision Task ForceS1 Revision Task Force
6831 Revision to SEMI S1-1015 Safety Guideline for Equipment Safety Labels
TFOF S1 Revision Task Force
Hide details for S10 Task ForceS10 Task Force
TFOF S10 Task Force
Hide details for S12 (Equipment Decon) Review Task ForceS12 (Equipment Decon) Review Task Force
6782 Line Item Revision of SEMI S12 - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
6888 Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
TFOF S12 (Equipment Decon) Review Task Force
Hide details for S2 Major Revision Task ForceS2 Major Revision Task Force
TFOF S2 Major Revision Task Force
Hide details for S2 Mechanical Design Task ForceS2 Mechanical Design Task Force
6884 Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
TFOF S2 Mechanical Design Task Force
Hide details for S2/S22 Task ForceS2/S22 Task Force
7021 Line Items Revisions of S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment
TFOF S2/S22 Task Force
Hide details for S3 Revision Task ForceS3 Revision Task Force
6830 Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS
TFOF S3 Revision Task Force
Hide details for S6 Revision Task ForceS6 Revision Task Force
7023 Reapproval of SEMI S6, Environmental, Health, And Safety Guideline For Exhaust Ventilation Of Semiconductor Manufacturing Equipment
TFOF S6 Revision Task Force
Hide details for S7 Task ForceS7 Task Force
6907 Revision to SEMI S7-0515 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications
TFOF S7 Task Force
Hide details for TaiwanTaiwan
Hide details for Equipment Safety Task ForceEquipment Safety Task Force
TFOF Equipment Safety Task Force
Hide details for FacilitiesFacilities
Hide details for JapanJapan
Hide details for 5-year-review TF5-year-review TF
7084 Reapproval of SEMI F44-0307 (Reapproved 0818), Specification for Machined Stainless Steel Weld Fittings
7085 Reapproval of SEMI F45-0307 (Reapproved 0818), Specification for Machined Stainless Steel Reducing Weld Fittings
TFOF 5-year-review TF
Hide details for F1 Revision TFF1 Revision TF
TFOF F1 Revision TF
Hide details for Gas Box Components Joint Task ForceGas Box Components Joint Task Force
TFOF Gas Box Components Joint Task Force
Hide details for Japan Gases and Facilities CommitteeJapan Gases and Facilities Committee
TFOF Japan Gases and Facilities Committee
Hide details for KoreaKorea
Hide details for Voltage Sag Immunity Task ForceVoltage Sag Immunity Task Force
TFOF Voltage Sag Immunity Task Force
Hide details for North AmericaNorth America
Hide details for Building Information Modeling (BIM) for Semiconductor Capital Equipment Task ForceBuilding Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
6628 New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling
TFOF Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Hide details for NA Facilities CommitteeNA Facilities Committee
6771 Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation
6773 Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services
TFOF NA Facilities Committee
Hide details for Power Grid Harmonics Task ForcePower Grid Harmonics Task Force
TFOF Power Grid Harmonics Task Force
Hide details for SEMI F51 Revision Task ForceSEMI F51 Revision Task Force
TFOF SEMI F51 Revision Task Force
Hide details for Voltage Sag Immunity Task ForceVoltage Sag Immunity Task Force
TFOF Voltage Sag Immunity Task Force
Hide details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Hide details for JapanJapan
Hide details for Flexible Display Task ForceFlexible Display Task Force
TFOF Flexible Display Task Force
Hide details for FPD Color Filter Task ForceFPD Color Filter Task Force
TFOF FPD Color Filter Task Force
Hide details for FPD Mask Task ForceFPD Mask Task Force
6868 Revision to SEMI D6-0211 (Reapproved 0117) “Specification For Liquid Crystal Display (LCD) Mask Substrates” with title change to “Specification For Flat Panel Display (FPD) Mask Substrates”
6869 Revision to SEMI D38-0211 (Reapproved 0117) “Guide For Quality Area Of LCD Masks” with title change to “Guide For Quality Area Of Flat Panel Display (FPD) Masks”
6937 New Standard: TERMINOLOGY FOR FPD PHASE SHIFT MASK AND MASK BLANKS
TFOF FPD Mask Task Force
Hide details for FPD Materials & Components Maintenance Task ForceFPD Materials & Components Maintenance Task Force
6912 Line Item Revision to SEMI D39-0704 (Reapproved 0117): “SPECIFICATION FOR MARKERS ON FPD POLARIZING FILMS”
6977 Line Item Revision to SEMI D34-0710: “TEST METHOD FOR FPD POLARIZING FILMS”
TFOF FPD Materials & Components Maintenance Task Force
Hide details for Japan FPD Materials and Components CommitteeJapan FPD Materials and Components Committee
TFOF Japan FPD Materials and Components Committee
Hide details for Polarizing Film TFPolarizing Film TF
TFOF Polarizing Film TF
Hide details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Hide details for JapanJapan
Hide details for D31 Revision Task ForceD31 Revision Task Force
TFOF D31 Revision Task Force
Hide details for KoreaKorea
Hide details for Perceptual Image QualityPerceptual Image Quality
6659 Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays
6913 Line Item Revision to SEMI D61-1110, Test Method of Perceptual Angle for OLED Displays
TFOF Perceptual Image Quality
Hide details for Perceptual Viewing AnglePerceptual Viewing Angle
TFOF Perceptual Viewing Angle
Hide details for Picture Quality Evaluation Task ForcePicture Quality Evaluation Task Force
6701 New Standard: Test Method for Warm-up Properties of Display Picture Quality
6863 Line-item Revision to SEMI D64-0811, Test Method for Measuring the Spatial Contrast Ratio of Flat Panel Display
6975 New Standard, Test Method for Response Time Evaluation of Displays with Variable Refresh Rate
6976 Revision to SEMI D71-0614, Test Method of PDP Tone and Color Reproduction with Title Change to: Test Method of Tone and Color Reproduction For Flat Panel Displays
TFOF Picture Quality Evaluation Task Force
Hide details for Transparent DisplayTransparent Display
TFOF Transparent Display
Hide details for TaiwanTaiwan
Hide details for Flexible Displays Task ForceFlexible Displays Task Force
6632 New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays
TFOF Flexible Displays Task Force
Hide details for Maintenance Task ForceMaintenance Task Force
6960 Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection
6961 Line Item Revision to SEMI D58 Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display
TFOF Maintenance Task Force
Hide details for Transparent Display Task ForceTransparent Display Task Force
6201 New Standard: Guide for Tone Reproduction Curves for Transparent Displays
6737 New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays
TFOF Transparent Display Task Force
Hide details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Hide details for JapanJapan
Hide details for FHE TerminologyFHE Terminology
6906 New Standard:Terminology for Flexible Hybrid Electronics (FHE)
TFOF FHE Terminology
Hide details for Tactile texture characteristics for FHETactile texture characteristics for FHE
6978 New Standard: Test Method for The Tactile Texture Characteristics of FHE Materials And Products
TFOF Tactile texture characteristics for FHE
Hide details for TaiwanTaiwan
Hide details for FHE System for Wearable Task ForceFHE System for Wearable Task Force
6873 New Standard: Guide for Salt Mist and Washability Test Flow for Control Module Connector of Electronic textiles
7104 New Standard: Test Method of Electromyography Sensing Technology of Flexible Hybrid Electronics and Electronic Textiles
TFOF FHE System for Wearable Task Force
Hide details for GasesGases
Hide details for EuropeEurope
Hide details for Cleaning GasesCleaning Gases
6148 Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing
TFOF Cleaning Gases
Hide details for Permeation Tubes for Trace Moisture CalibrationPermeation Tubes for Trace Moisture Calibration
TFOF Permeation Tubes for Trace Moisture Calibration
Hide details for North AmericaNorth America
Hide details for Filters and Purifiers Task ForceFilters and Purifiers Task Force
TFOF Filters and Purifiers Task Force
Hide details for Gases Specification Task ForceGases Specification Task Force
7097 Line-Item Revision to SEMI C54-1116, Specification for Oxygen
7098 Line-Item Revision to SEMI C56-1116, Specification for Dichlorosilane
TFOF Gases Specification Task Force
Hide details for Heater Jacket Task ForceHeater Jacket Task Force
6916 Replacement of SEMI F109-0212, Guide for Heater Systems Requirements,
as a New Standard: Guide for Material Selection for Heater Systems
TFOF Heater Jacket Task Force
Hide details for Mass Flow Controller Task ForceMass Flow Controller Task Force
7092 Line-Item Revision to SEMI E29-1110 (Reapproved 0417), Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters
7093 Line-Item Revision to SEMI F62-1016, Test Method for Determining Mass Flow Controller Performance Characteristics for Ambient and Gas Temperature Effects
7094 Reapproval of SEMI E16-0517, Guide for Determining and Describing Mass Flow Controller Leak Rates
7095 Reapproval of SEMI E27-1017, Guide for Mass Flow Controller and Mass Flow Meter Linearity
7096 Reapproval of SEMI E66-0611 (Reapproved 0517), Test Method for Determining Particle Contribution by Mass Flow Controllers
TFOF Mass Flow Controller Task Force
Hide details for Materials of Construction of Gas Delivery Systems Task ForceMaterials of Construction of Gas Delivery Systems Task Force
6394 Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems
6612 New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves
7052 Line-Item Revision to SEMI F20-0706, Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components used in General Purpose, High Purity and Ultra-high Purity Semiconductor Manufacturing Applications
TFOF Materials of Construction of Gas Delivery Systems Task Force
Hide details for Pressure Measurement Task ForcePressure Measurement Task Force
TFOF Pressure Measurement Task Force
Hide details for Surface Mount Sandwich Component Dimensions Task ForceSurface Mount Sandwich Component Dimensions Task Force
TFOF Surface Mount Sandwich Component Dimensions Task Force
Hide details for HB-LEDHB-LED
Hide details for ChinaChina
Hide details for GaN based LED Epitaxial Wafer Task ForceGaN based LED Epitaxial Wafer Task Force
TFOF GaN based LED Epitaxial Wafer Task Force
Hide details for HB-LED Equipment Communication InterfaceHB-LED Equipment Communication Interface
TFOF HB-LED Equipment Communication Interface
Hide details for Patterned Sapphire Substrate Task ForcePatterned Sapphire Substrate Task Force
6371 New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
TFOF Patterned Sapphire Substrate Task Force
Hide details for Sapphire Single Crystal Ingot Task ForceSapphire Single Crystal Ingot Task Force
TFOF Sapphire Single Crystal Ingot Task Force
Hide details for Sapphire Single Crystal Orientation Task Force Sapphire Single Crystal Orientation Task Force
TFOF Sapphire Single Crystal Orientation Task Force
Hide details for Single Crystal Sapphire Task ForceSingle Crystal Sapphire Task Force
TFOF Single Crystal Sapphire Task Force
Hide details for North AmericaNorth America
Hide details for HB-LED AssemblyHB-LED Assembly
TFOF HB-LED Assembly
Hide details for HB-LED Equipment Automation InterfacesHB-LED Equipment Automation Interfaces
TFOF HB-LED Equipment Automation Interfaces
Hide details for HB-LED Equipment Communication Interfaces TFHB-LED Equipment Communication Interfaces TF
TFOF HB-LED Equipment Communication Interfaces TF
Hide details for HB-LED Source Materials TFHB-LED Source Materials TF
5984 New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing
5985 New Standard: Guide for Triethylgallium for HB-LED Manufacturing
5986 New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing
5987 New Standard: Guide for Trimethylgallium for HB-LED Manufacturing
5988 New Standard: Guide for Trimethylindium for HB-LED Manufacturing
TFOF HB-LED Source Materials TF
Hide details for HB-LED Wafer TFHB-LED Wafer TF
TFOF HB-LED Wafer TF
Hide details for Impurities and Defects in HB-LED Sapphire WafersImpurities and Defects in HB-LED Sapphire Wafers
TFOF Impurities and Defects in HB-LED Sapphire Wafers
Hide details for NA HB-LED CommitteeNA HB-LED Committee
TFOF NA HB-LED Committee
Hide details for Patterned Sapphire Substrate (PSS) TFPatterned Sapphire Substrate (PSS) TF
TFOF Patterned Sapphire Substrate (PSS) TF
Hide details for Test Methods TFTest Methods TF
TFOF Test Methods TF
Hide details for Information & ControlInformation & Control
Hide details for ChinaChina
Hide details for Advanced Backend Factory Integration Task ForceAdvanced Backend Factory Integration Task Force
7018 Line Item Revision to SEMI E87-0921, Specification For Carrier Management (CMS) and E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS)
TFOF Advanced Backend Factory Integration Task Force
Hide details for GEM300 Task ForceGEM300 Task Force
TFOF GEM300 Task Force
Hide details for JapanJapan
Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
TFOF Backend Factory Integration Task Force
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOF Diagnostic Data Acquisition Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
TFOF Fab & Equipment Information Security Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
6920 Line Item Revision to SEMI E171-0916: SPECIFICATION FOR PREDICTIVE CARRIER LOGISTICS(PCL) and SEMI E171.1-0216: SPECIFICATION FOR SECS-II PROTOCOL FOR PREDICTIVE CARRIER LOGISTICS
TFOF GEM 300 Task Force
Hide details for JA I&C Maintenance Task ForceJA I&C Maintenance Task Force
6770 Line-Item revision to E169-0615 Guide for Equipment Information System Security
6861 Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer
6862 Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer
7005 Line Item Revision to SEMI E91-1217: SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM)
TFOF JA I&C Maintenance Task Force
Hide details for Sensor Bus Task ForceSensor Bus Task Force
TFOF Sensor Bus Task Force
Hide details for KoreaKorea
Hide details for Advanced Back-end Factory Integration TFAdvanced Back-end Factory Integration TF
TFOF Advanced Back-end Factory Integration TF
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOF Diagnostic Data Acquisition Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
5832 New Standard, Specification for Equipment Generic Counter Model (EGCM)
TFOF GEM 300 Task Force
Hide details for North AmericaNorth America
Hide details for Advanced Backend Factory IntegrationAdvanced Backend Factory Integration
6840 New Standard: Specification for Equipment Adoption Criteria for GEM And GEM-Based Standards
6852 Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping
6924 New Standard: Specification for Equipment Management of Consumables and Durables
6925 New Subordinate Standard: Specification for SECS-II Protocol for Equipment Management of Consumables and Durables
6948 Line Item Revisions to SEMI E142-0921 - Specification for Substrate Mapping, SEMI E142.1-0921 - Specification for XML Schema for Substrate Mapping, Line Item Revision to SEMI E142.2-0921 - Specification for SECS II Protocol For Substrate Mapping, Line Item Revision to SEMI E142.3-0921 - Specification for Web Services Protocol for Substrate Mapping, Line Item Revision to SEMI E142.4-0921 - Specification for Secs II Protocol For Substrate Mapping Using Item Transfer
TFOF Advanced Backend Factory Integration
Hide details for Diagnostic Data Acquisition Task Force NADiagnostic Data Acquisition Task Force NA
6837 LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS
6930 Revision to SEMI E164-0414 (Reapproved 0721): Specification for EDA Common Metadata
6947 Line Item Revision to SEMI E179-0320, Specification for Protocol Buffers Common Components
7001 Revision to SEMI E125-1022 Specification for Equipment Self Description (EqSD) and SEMI E125.2-1022 Specification for Protocol Buffers for Equipment Self Description (EqSD)
7002 Revision to SEMI E132-0922 Specification for Equipment Client Authentication and Authorization and SEMI E132.2-0422e Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA)
7003 Revision to SEMI E134-1022 Specification for Data Collection Management and SEMI E134.2-1022 Specification for Protocol Buffers of Data Collection Management
7017 Line Item Revision to SEMI E120.2-0922, Specification for Protocol Buffers for Common Equipment Model (CEM)
TFOF Diagnostic Data Acquisition Task Force NA
Hide details for Energy Saving Equipment Communication Task ForceEnergy Saving Equipment Communication Task Force
6923 Line Item Revisions to SEMI E167-1213: Specification for Equipment Energy Saving Mode Communications (EESM), SEMI E167.1-1213: Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications, and SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC)
TFOF Energy Saving Equipment Communication Task Force
Hide details for Equipment Data Publication (EDP) Task ForceEquipment Data Publication (EDP) Task Force
7068 New Standard: Specification for Equipment Data Publication
7069 Revision to Add a New Subordinate Standard: Specification for Common Data for Etch Components to Specification for Equipment Data Publication
7070 Revision to Add a New Subordinate Standard: Specification for Common Data for Vacuum Components to Specification for Equipment Data Publication
TFOF Equipment Data Publication (EDP) Task Force
Hide details for Fab & Equipment Computer and Device Security (CDS) Task ForceFab & Equipment Computer and Device Security (CDS) Task Force
6565 New Standard: Specification for Application Accesslisting
6926 New Standard: Specification for Equipment Operator Access Management and Monitoring
TFOF Fab & Equipment Computer and Device Security (CDS) Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
6835 LINE ITEM REVISION TO SEMI E87-XXXX SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-XXXX SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT (CMS)
6836 LINE ITEM REVISION TO SEMI E87-0619 SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-0619 SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT(CMS) and SEMI E90-1218
SPECIFICATION FOR SUBSTRATE TRACKING and SEMI E90.1-0312
SPECIFICATION FOR SECS-II PROTOCOL FOR SUBSTRATE TRACKING
6991 Line Item Revision to SEMI E4-0418, Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
6992 Line Item Revision to SEMI E157-0611 (Reapproved 0616), Specification for Module Process Tracking
7004 Reapproval of E130-0618, Specification for Prober Specific Equipment Model for 300 mm Environment (PSEM300)
7063 Reapproval of SEMI E39-1218, Specification for Object Services: Concepts, Behavior, and Services
7064 Reapproval of SEMI E40-1218, Specification for Processing Management
7065 Line Item Revision to SEMI E172-0320, Specification for SECS Equipment Data Dictionary (SEDD)
7066 Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS)
TFOF GEM 300 Task Force
Hide details for Graphical User Interfaces (GUI) Task ForceGraphical User Interfaces (GUI) Task Force
6743 Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment
TFOF Graphical User Interfaces (GUI) Task Force
Hide details for NA Information and Control CommitteeNA Information and Control Committee
TFOF NA Information and Control Committee
Hide details for Process Control System NAProcess Control System NA
6649 Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS)
6722 Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices
6724 Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device
6951 Reapproval of SEMI E126-0708 - Specification for Equipment Quality Information Parameters (EQIP)
7067 Line tem Revision to SEMI E133-1218, Specification for Automated Process Control Systems Interface and SEMI E133.1-0318, Specification for XML Messaging for Process Control System (PCS)
TFOF Process Control System NA
TFOF Process Control System NA
Hide details for Sensor Bus Task ForceSensor Bus Task Force
6563 Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device
6564 Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges
6845 Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network
6846 Reapproval of SEMI E54.1-0316, Specification for Sensor/Actuator Network Common Device Mode
6847 Reapproval of SEMI E54.2-0316, Guide for Writing Sensor/Actuator Network (SAN) Letter Ballots
6848 Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT
6849 Reapproval of SEMI E54.24-1116, Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENsen)
6949 Line Item Revisions to E54, SEMI E54.1, SEMI E54.10, SEMI E54.11, SEMI E54.12, SEMI E54.13, SEMI E54.14, SEMI E54.15, SEMI E54.16, SEMI E54.17, SEMI E54.18, SEMI E54.19, SEMI E54.2, SEMI E54.20, SEMI E54.21, SEMI E54.22, SEMI E54.23, SEMI E54.24, SEMI E54.3, SEMI E54.4, SEMI E54.7, SEMI E54.8, SEMI E54.9
TFOF Sensor Bus Task Force
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Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
TFOF Backend Factory Integration Task Force
Hide details for Equipment Edge Data Governance (EEDG) Task ForceEquipment Edge Data Governance (EEDG) Task Force
6938 New Standard: Guide for Equipment Edge Data Governance (EEDG)
TFOF Equipment Edge Data Governance (EEDG) Task Force
Hide details for Equipment Information Integration Task ForceEquipment Information Integration Task Force
TFOF Equipment Information Integration Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
7103
Line Item Revision to SEMI E187(0122)- Specification for Cybersecurity of Fab Equipment
TFOF Fab & Equipment Information Security Task Force
Hide details for GEM300 Task Force GEM300 Task Force
TFOF GEM300 Task Force
Hide details for Liquid ChemicalsLiquid Chemicals
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Hide details for EU Gases and Liquid Chemicals CommitteeEU Gases and Liquid Chemicals Committee
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Hide details for Diaphragm Valves Task ForceDiaphragm Valves Task Force
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6979 Revision to C77-0912, TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 30 nm AND 100 nm with title change to TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 20 nm AND 100 nm
TFOF Liquid-Borne Particle Counter Task Force
Hide details for Liquid Filter Task ForceLiquid Filter Task Force
6883 Reapproval of SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS)
6911 New Standard, Test Method For Metal Removal Performance Of Liquid Filter
TFOF Liquid Filter Task Force
Hide details for Trace Metal Analysis for High Pure IPA Task ForceTrace Metal Analysis for High Pure IPA Task Force
6820 New Standard: Guide for Trace Iron Analysis in High Purity IPA
TFOF Trace Metal Analysis for High Pure IPA Task Force
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TFOF Welding Fitting Task Force
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Hide details for Chemical Analytical Methods Task ForceChemical Analytical Methods Task Force
6315 Revision to SEMI C30-0218, Specification for Hydrogen Peroxide, with title change to: Specification and Guide for Hydrogen Peroxide
6388 Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid
7007 Reapproval of SEMI C21-0618, Specification and Guide for Ammonium Hydroxide
7008 Reapproval of SEMI C28-0618, Specification and Guide for Hydrofluoric Acid
7009 Reapproval of SEMI C29-0618, Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v)
7010 Reapproval of SEMI C35-0118, Specification and Guide for Nitric Acid
7011 Reapproval of SEMI C40-1110 (Reapproved 0618), Specification for Potassium Hydroxide, 45% Solution
7012 Reapproval of SEMI C41-0618, Specification and Guide for 2-Propanol
7013 Reapproval of SEMI C45-0518, Specification and Guide for Tetraethylorthosilicate (TEOS)
7014 Reapproval of SEMI C62-0309 (Reapproved 0618), Specification for Progen Precursors Used in Low K CVD Processes
7015 Reapproval of SEMI C63-1108 (Reapproved 0618), Specification for Organosilicate Precursors Used in Low K CVD Processes
7016 Reapproval of SEMI C81-0113 (Reapproved 0618), Guide for Tris(Dimethylamino) Silane (3DMAS)
TFOF Chemical Analytical Methods Task Force
Hide details for Chemical Mechanical Planarization Consumables (CMP-C) Task ForceChemical Mechanical Planarization Consumables (CMP-C) Task Force
6904 New Standard: Guide for Reporting Performance Parameters of the Retaining Rings for Chemical Mechanical Planarization (CMP) used in Semiconductor Manufacturing
6970 New Standard: Guide for Reporting Performance Parameters of Pressure Sensitive Adhesives (PSA) for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
TFOF Chemical Mechanical Planarization Consumables (CMP-C) Task Force
Hide details for High Purity Liquid Assemblies & Systems Task ForceHigh Purity Liquid Assemblies & Systems Task Force
6828 Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems
6917 Revision to SEMI F39-0621, Guide for Chemical Blending Systems
TFOF High Purity Liquid Assemblies & Systems Task Force
Hide details for High Purity Polymer Materials and Components Task ForceHigh Purity Polymer Materials and Components Task Force
6601 New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water
6713 Line Item Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems
7006 Revision to SEMI C69-1015 (Reapproved 1220), Test Method for the Determination of Surface Areas of Polymer Pellets
7089 Line-Item Revision to SEMI C78-0113 (Reapproved 1218), Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy
7090 Line-Item Revision to SEMI C87-0515, Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Contact Profilometry
7091 Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems, with title change to: Test Method and Specification for Testing of Perfluoroalkoxy (PFA) and Other Fluorinated Materials Used in Liquid Chemical Distribution Systems
TFOF High Purity Polymer Materials and Components Task Force
Hide details for Statistical Methods Task ForceStatistical Methods Task Force
6451 Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals
6509 Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change
6935 Revision to SEMI C10-1109 (Reapproved 1114), Guide for Determination of Method Detection Limits
TFOF Statistical Methods Task Force
Hide details for Ultra Pure Water Task ForceUltra Pure Water Task Force
6715 New Standard: Guide for Evaluating Metrology for Particle Precursors in Ultrapure Water
6716 Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems
7086 Revision to SEMI F61–0521, Guide for Design and Operation of a Semiconductor Ultrapure Water System
7087 Revision to SEMI F63-0521, Guide for Ultrapure Water Used in Semiconductor Processing
7088 Revision to SEMI F75-0521, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing
TFOF Ultra Pure Water Task Force
Hide details for Water Management Task ForceWater Management Task Force
6993 Line-Item Revision to SEMI F98-0521, Guide for Water Reuse in Semiconductor Industry
TFOF Water Management Task Force
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TFOF Terminology
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Hide details for MEMS and Miniaturized Gas Sensing Task ForceMEMS and Miniaturized Gas Sensing Task Force
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Hide details for Cycle Time Metrics Task ForceCycle Time Metrics Task Force
TFOF Cycle Time Metrics Task Force
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6550 Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems
TFOF Japan RF Measurement liaison Task Force
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Hide details for Critical Chamber Components (CCC) Test Methods Task Force Critical Chamber Components (CCC) Test Methods Task Force
6931 NEW STANDARD: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection
TFOF Critical Chamber Components (CCC) Test Methods Task Force
Hide details for EMC Task ForceEMC Task Force
6894 Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment
TFOF EMC Task Force
Hide details for Equipment Cost of Ownership Task ForceEquipment Cost of Ownership Task Force
6841 Line-item Revisions to SEMI E35-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment
6842 Line-item Revisions to SEMI E140-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems
TFOF Equipment Cost of Ownership Task Force
Hide details for Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task ForceEquipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
6578 Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization
6579 Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity
TFOF Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
Hide details for Equipment Training and Documentation Task ForceEquipment Training and Documentation Task Force
TFOF Equipment Training and Documentation Task Force
Hide details for ESD/ESC Task Force- N.AESD/ESC Task Force- N.A
6971 Revision to SEMI E163-0212, Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas
TFOF ESD/ESC Task Force- N.A
Hide details for License Server CertificationLicense Server Certification
TFOF License Server Certification
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7056 Reapproval of SEMI E168-0915, Specification for Product Time Measurement
7057 Reapproval of SEMI E168.1-1114, Specification for Product Time Measurement in GEM 300 Production Equipment
7058 Reapproval of SEMI E168.2-0915, Specification for Product Time Measurement for Material Control Systems
7059 Reapproval of SEMI E168.3-0915, Specification for Product Time Measurement for Transport
Hide details for North America Metrics Technical CommitteeNorth America Metrics Technical Committee
TFOF North America Metrics Technical Committee
Hide details for RF Measurements Task ForceRF Measurements Task Force
6838 Reapproval of SEMI E114-0302E (Reapproved 0616), Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems
6839 Reapproval of SEMI E115-0302E (Reapproved 0816), Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems
TFOF RF Measurements Task Force
Hide details for MicropatterningMicropatterning
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Hide details for Curvilinear Format Task ForceCurvilinear Format Task Force
6821 New Standard: Specification for Improved Curvilinear Layout Representation
TFOF Curvilinear Format Task Force
Hide details for Mask Orders Task ForceMask Orders Task Force
TFOF Mask Orders Task Force
Hide details for Micropatterning CommitteeMicropatterning Committee
7026 Reapproval of SEMI P44-1216 Specification for Open Artwork System Interchange Standard (OASIS ®) Specific to Mask Tools
7027 Reapproval of SEMI P39-0416 Specification for OASIS® – Open Artwork System Interchange Standard
Hide details for NA Microlithography Committee for 5-Year ReviewNA Microlithography Committee for 5-Year Review
TFOF NA Microlithography Committee for 5-Year Review
Hide details for P47 Revision Task ForceP47 Revision Task Force
6516
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
TFOF P47 Revision Task Force
Hide details for Patterning Metrology Task ForcePatterning Metrology Task Force
TFOF Patterning Metrology Task Force
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Hide details for Building Integrated Photovoltaic (BIPV) Task ForceBuilding Integrated Photovoltaic (BIPV) Task Force
6542 New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building
6700 New Standard: Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV)
TFOF Building Integrated Photovoltaic (BIPV) Task Force
Hide details for Crystalline Silicon Solar Cell Task ForceCrystalline Silicon Solar Cell Task Force
6872 Revision to SEMI PV75-1016, Test Method on Cell Level for Potential-induced-degradation Susceptibility of Solar Cells and Module Encapsulation Materials
7050 Reapproval of SEMI PV87-1018, Test Method for Peeling Force Between Electrode and Ribbon/Back Sheet
TFOF Crystalline Silicon Solar Cell Task Force
Hide details for PV Equipment Task ForcePV Equipment Task Force
7054 Reapproval of SEMI PV81-0318, Guide for Specifying Low Pressure Horizontal Diffusion Furnace
7055 New Standard: Guide for Tube PECVD Graphite Boat Materials for Solar Cell Production
TFOF PV Equipment Task Force
Hide details for PV Module Task ForcePV Module Task Force
7047 Reapproval of SEMI PV82-0318, Specification for Terrestrial Dual-Glass Module with Crystalline Silicon Solar Cell
7048 Reapproval of SEMI PV83-0318, Guide for Sample Preparation Method for Photovoltaic Backsheet Performance Tests
7049 Reapproval of SEMI PV85-1018, Practice for Metal Wrap Through (MWT) Back Contact Photovoltaic (PV) Module Assembly
TFOF PV Module Task Force
Hide details for Thin Film PV Module Task ForceThin Film PV Module Task Force
TFOF Thin Film PV Module Task Force
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Hide details for  Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
6297 New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC)
6539 New Standard :Specification of reference device for indoor lighting simulator
6540 New Standard :Test Method for Durability of Flexible emerging PV
TFOF Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
Hide details for PV Reliability Test Method Task Force PV Reliability Test Method Task Force
6705 Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation
TFOF PV Reliability Test Method Task Force
Hide details for Photovoltaic (PV) - MaterialsPhotovoltaic (PV) - Materials
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Hide details for PV Silicon Raw Materials Task ForcePV Silicon Raw Materials Task Force
7051 Reapproval of SEMI PV88-1018, Test Method for Determination of Hydrogen in Photovoltaic (PV) Polysilicon by Inert Gas Fusion Infrared Absorption Method
TFOF PV Silicon Raw Materials Task Force
Hide details for PV Silicon Wafer Task ForcePV Silicon Wafer Task Force
6922 New Standard: Classification of Reusable Silicon Material
TFOF PV Silicon Wafer Task Force
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TFOF PV Material Degradation Task Force
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Hide details for Japan PV Materials Task ForceJapan PV Materials Task Force
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TFOF International PV Analytical Test Methods, Metrology, and Inspection Task Force
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Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6833 Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
6834 Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
7000 Line Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface
TFOF Global PIC Maintenance Task Force
Hide details for JapanJapan
Hide details for 300mm Tape Frame PI&C Task Force300mm Tape Frame PI&C Task Force
6895 Line Item Revision to SEMI E185-1221-SPECIFICATION FOR 300 mm TAPE FRAME FOUP
Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6897 Revision of E92, Specification For 300 mm Light Weight and Compact Box Opener/Loader To Tool-Interoperability Standard (Bolts/Light)
Hide details for Japan Electron Microscopy Workflow liaison Task ForceJapan Electron Microscopy Workflow liaison Task Force
TFOF Japan Electron Microscopy Workflow liaison Task Force
Hide details for Panel Level Packaging Panel FOUP Task ForcePanel Level Packaging Panel FOUP Task Force
6898 Revision to SEMI E181, - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING
6899 Revision to SEMI E181.1, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 12 Slots
6900 Revision to SEMI E181.2, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 6 Slots
6901 Revision to SEMI E181.3, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 12 Slots
6902 Revision to SEMI E181.4, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 6 Slots
6936 Line Item Revision of SEMI E182-0621 - Specification for Panel FOUP Loadport for Panel Level Packaging
TFOF Panel Level Packaging Panel FOUP Task Force
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Hide details for Electron Microscopy Workflow Task ForceElectron Microscopy Workflow Task Force
6592 New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows
6832 New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user
TFOF Electron Microscopy Workflow Task Force
Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6918 Line-Item Revision to SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
Hide details for Packaging Tape Frame Handling Task ForcePackaging Tape Frame Handling Task Force
6896 New Standard: Specification for 300 mm Frame Carrier FOUP
TFOF Packaging Tape Frame Handling Task Force
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6919 Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
TFOF SEMI E72 Revision Task Force
Hide details for Silicon WaferSilicon Wafer
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
6982 Revision to SEMI M78-0618 GUIDE FOR DETERMINING NANOTOPOGRAPHY OF UNPATTERNED SILICON WAFERS FOR THE 130 nm to 22 nm GENERATIONS IN HIGH VOLUME MANUFACTURING
6985 Reapproval of SEMI MF1390, Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning
6986 Reapproval of SEMI M43, Guide for Reporting Wafer Nanotopography
6987 Reapproval of SEMI M84, Specification for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications
Hide details for International Automated Advanced Surface Inspection Task ForceInternational Automated Advanced Surface Inspection Task Force
6984 Line item revision of SEMI M050-00-1116, Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method
6988 Reapproval of SEMI M84, Specification for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications
6989 Reapproval of SEMI M40, Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
6990 Reapproval of SEMI ME1392, Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces
Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
6462 Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
7024 Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
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Hide details for International 450 mm Shipping BoxInternational 450 mm Shipping Box
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TFOF International Advanced Wafer Geometry Task Force
Hide details for International Annealed Si Wafer Task ForceInternational Annealed Si Wafer Task Force
TFOF International Annealed Si Wafer Task Force
Hide details for International Automated Advanced Surface Inspection Task ForceInternational Automated Advanced Surface Inspection Task Force
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Hide details for International Epitaxial Wafers Task ForceInternational Epitaxial Wafers Task Force
TFOF International Epitaxial Wafers Task Force
Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
TFOF International Polished Wafers Task Force
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TFOF International SOI Wafers Task Force
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TFOF International Terminology Task Force
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TFOF International Test Methods Task Force
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
6983 Revision for M49 “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 16 nm TECHNOLOGY GENERATIONS"
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6570 New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique
6687 Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
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Hide details for Japan TC Chapter of Global Technical TommitteeJapan TC Chapter of Global Technical Tommittee
TFOF Japan TC Chapter of Global Technical Tommittee
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5772 Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
6702 Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION
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6957 Line Item Revision of SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations
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6583 New Standard: Specification for SOI Wafers for RF Device Applications
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6958 Reapproval of SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array
7025 Line Item Revision of SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure”
7029 Reapproval of SEMI M61-0612 (Reapproved 0319)Specification for Silicon Epitaxial Wafers with Buried Layers
7030 Reapproval of SEMI MF95-1107 (Reapproved 0718) Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
7031 Reapproval of SEMI MF950-1107 (Reapproved 0718) Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Wafer Surface by Angle Polished and Defect Etching

7032 Reapproval of SEMI MF84-0312 (Reapproved 0718) Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Prober
7033 Reapproval of SEMI MF672-0412 (Reapproved 1018) Guide for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe
7034 Reapproval of SEMI MF671-0312 (Reapproved 0718) Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
7035 Reapproval of SEMI MF576-0812 (Reapproved 0718)) Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
7036 Reapproval of SEMI MF533-0310 (Reapproved 0416) Test Method for Thickness and Thickness Variation of Silicon Wafers
7037 Reapproval of SEMI MF525-0312 (Reapproved 0718) Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe
7038 Reapproval of SEMI MF523-1107 (Reapproved 0718) Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
7039 Reapproval of SEMI MF397-0812 (Reapproved 0718) Test Method for Resistivity of Silicon Bars Using a Two-Point Probe
7040 Reapproval of SEMI MF374-0312 (Reapproved 0718)Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure
7041 Reapproval of SEMI MF26-0714E Test Method for Determining the Orientation of a Semiconductive Single Crystal
7042 Reapproval of SEMI MF2074-0912 (Reapproved 0718) Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers
7043 Reapproval of SEMI MF1982-0317 Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography
7044 Reapproval of SEMI MF1763-0318 Test Method for Measuring Contrast of a Linear Polarizer
7045 Reapproval of SEMI MF1630-1107 (Reapproved 0718) Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities
7046 Reapproval of SEMI MF1619-1107 (Reapproved 0718) Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at the Brewster Angle
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7072 Reapproval of SEMI MF1569-0307 (Reapproved 0718) Guide for Generation of Consensus Reference Materials for Semiconductor Technology

7073 Reapproval of SEMI MF1527-0412 (Reapproved 1018) Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
7074 Reapproval of SEMI MF1392-0307 (Reapproved 0718) Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements with a Mercury Probe
7075 Reapproval of SEMI MF1391-1107 (Reapproved 0912) Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
7076 Reapproval of SEMI MF1388-0707 (Reapproved 0718) Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors
7077 Reapproval of SEMI MF1366-0308 (Reapproved 1018) Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometrys
7078 Reapproval of SEMI MF1188-1107 (Reapproved 0718) Test Method for Interstitial Oxygen Content of Silicon by Infrared Absorption With Short Baseline
7079 Reapproval of SEMI MF110-1107 (Reapproved 0718) Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique
7080 Reapproval of SEMI MF1049-0308 (Reapproved 1018) Practice for Shallow Etch Pit Detection on Silicon Wafers
7081 Reapproval of SEMI M8-0312 (Reapproved 0718) Specification for Polished Monocrystalline Silicon Test Wafers
7082 Reapproval of SEMI M56-1018 Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias
7083 Reapproval of SEMI M38-0312 (Reapproved 0718) Specification for Polished Reclaimed Silicon Wafers
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
TFOF Silicon Wafer Committee
Hide details for TraceabilityTraceability
Hide details for JapanJapan
Hide details for 5 Year Review TF5 Year Review TF
6935 Reapproval of SEMI T19 - Specification for Device Marking
TFOF 5 Year Review TF
Hide details for Blockchain Task ForceBlockchain Task Force
6910 New Standard: Specification of Blockchain for Semiconductor supply chain Traceability
TFOF Blockchain Task Force
Hide details for Japan Equipment & Materials Traceability liaison Task ForceJapan Equipment & Materials Traceability liaison Task Force
TFOF Japan Equipment & Materials Traceability liaison Task Force
Hide details for Japan Single Device Traceability liaison Task ForceJapan Single Device Traceability liaison Task Force
TFOF Japan Single Device Traceability liaison Task Force
Hide details for Panel Level Packaging (PLP) Glass Carrier ID Marking Task ForcePanel Level Packaging (PLP) Glass Carrier ID Marking Task Force
6674 New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications
TFOF Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force
Hide details for North AmericaNorth America
Hide details for 5 Year Review Task Force5 Year Review Task Force
7060 Reapproval of SEMI T17-0706 (Reapproved 0718), Specification of Substrate Traceability
7061 Reapproval of SEMI T10-0701 (Reapproved 0618), Test Method for the Assessment of 2D Data Matrix Direct Mark Quality
7062 Reapproval of SEMI T18-1106 (Reapproved 0718), Specification of Parts and Components Traceability
TFOF 5 Year Review Task Force
Hide details for Equipment and Materials Traceability Task ForceEquipment and Materials Traceability Task Force
6449 New Standard: Specification for Equipment and Materials Part Traceability
TFOF Equipment and Materials Traceability Task Force
Hide details for Single Device Traceability Task Force Single Device Traceability Task Force
6504 New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain
TFOF Single Device Traceability Task Force

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