 | | | | | | |
|---|
 | 3D Packaging and Integration |
| |
|
|
| Japan |
| |
|
|
| 3D Packaging & Integration 5 Year Review Task Force |
| |
| | | 6994 | | Reapproval of SEMI G89-0211 (Reapproved 0318) Specification for Leadframe Strip Size | |
| | | 6995 | | Reapproval of SEMI G71-0996 (Reapproved 0318) Specification for Barcode Marking of Intermediate Containers for Packaging Materials | |
| | | 6996 | | Reapproval of SEMI G69-0996 (Reapproved 0318): Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds | |
| | | 6997 | | Reapproval of SEMI G90-0811 (Reapproved 0318): Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes | |
| | | 6998 | | Reapproval of SEMI G66-96 (Reapproved 0318):Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic | |
| | | 6999 | | Reapproval of SEMI G23-0996 (Reapproved 0318): Test Method of Inductance for Internal Traces of Semiconductor Packages | |
| | | 7019 | | Reapproval of SEMI G64-1118,Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) | |
| | | 7020 | | Reapproval of SEMI G94-0113 (Reapproved 1118) Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm Wafer | |
| | | TFOF | | 3D Packaging & Integration 5 Year Review Task Force | |
|
|
| 3DS IC Bonded Layer Inspection Metrology TF |
| |
| | | TFOF | | 3DS IC Bonded Layer Inspection Metrology TF | |
|
|
| JA 450mm Assembly and Test Die Preparation Task Force |
| |
| | | TFOF | | JA 450mm Assembly and Test Die Preparation Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier Task Force |
| |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier Task Force | |
|
|
| North America |
| |
|
|
| 3DP&I Bonded Wafer Stacks Task Force |
| |
| | | TFOF | | 3DP&I Bonded Wafer Stacks Task Force | |
|
|
| 3DP&I Inspection and Metrology Task Force |
| |
| | | 7099 | | Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | |
| | | 7100 | | Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | |
| | | 7101 | | Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | |
| | | 7102 | | Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology | |
| | | TFOF | | 3DP&I Inspection and Metrology Task Force | |
|
|
| Panel Level Packaging (PLP) Panel Task Force |
| |
| | | TFOF | | Panel Level Packaging (PLP) Panel Task Force | |
|
|
| Taiwan |
| |
|
|
| 3DP&I Middle-End Process Task Force |
| |
| | | TFOF | | 3DP&I Middle-End Process Task Force | |
|
|
| 3DP&I Testing Task Force |
| |
| | | 6921 | | New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe | |
| | | TFOF | | 3DP&I Testing Task Force | |
| Automated Test Equipment |
| |
|
|
| North America |
| |
|
|
| NA ATE 5-Year Review |
| |
| | | TFOF | | NA ATE 5-Year Review | |
|
|
| Rich Interactive Test Database (RITdb) |
| |
| | | 6905 | | Line Item Revision to SEMI E183-1121: Specification for Rich Interactive Test Database (RITdb) | |
| | | 6973 | | New Standard: Guide for Generic Model on Manufacturing Flow Impacting Semiconductor Test | |
| | | 6974 | | New Standard: Specification for Rich Interactive Test Database Event Message Content | |
| | | TFOF | | Rich Interactive Test Database (RITdb) | |
|
|
| Standard Test Data Format (STDF) Task Force |
| |
| | | TFOF | | Standard Test Data Format (STDF) Task Force | |
|
|
| Test Cell Communications |
| |
| | | TFOF | | Test Cell Communications | |
|
|
| Tester Event Messaging for Semiconductors (TEMS) |
| |
| | | TFOF | | Tester Event Messaging for Semiconductors (TEMS) | |
| Automation Technology |
| |
|
|
| Japan |
| |
|
|
| A1 TF |
| |
| | | 6825 | | Line Item Revision to SEMI A1-0521 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | TFOF | | A1 TF | |
|
|
| F-GEM TF |
| |
| | | TFOF | | F-GEM TF | |
|
|
| SMT TF |
| |
| | | 6827 | | Line Item Revision to SEMI A2-0521 Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | TFOF | | SMT TF | |
|
|
| Taiwan |
| |
|
|
| Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force |
| |
| | | TFOF | | Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force | |
| Compound Semiconductor Materials |
| |
|
|
| China |
| |
|
|
| SiC Epitaxial Wafer Task Force |
| |
| | | 6693 | | New Standard: Specification for 4H-SiC Homoepitaxial Wafer | |
| | | TFOF | | SiC Epitaxial Wafer Task Force | |
|
|
| Silicon Carbide Substrate Task Force |
| |
| | | 6767 | | New Standard: Test Method for GBIR, SBIR, GF3R, SFQR and SORI of Silicon Carbide Wafers by Oblique Incident Interference Method | |
| | | 6768 | | New Standard: Test Method for Micropipe Density of Silicon Carbide Wafer by Laser Reflection | |
| | | 6769 | | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic | |
| | | TFOF | | Silicon Carbide Substrate Task Force | |
|
|
| Europe |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 7053 | | Line Item Revision of SEMI M63, TEST METHOD FOR MEASURING THE Al FRACTION IN AlGaAs ON GaAs SUBSTRATES BY HIGH RESOLUTION X-RAY DIFFRACTION | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| EU Compound Semiconductor Materials Committee |
| |
| | | TFOF | | EU Compound Semiconductor Materials Committee | |
|
|
| SiC Material and Wafer Specification TF |
| |
| | | TFOF | | SiC Material and Wafer Specification TF | |
|
|
| Test Methods Task Force |
| |
| | | 6870 | | New Standard: Test Method for Quantifying Basal Plane Dislocations in 4H-SiC by X-ray Topography | |
| | | TFOF | | Test Methods Task Force | |
|
|
| Japan |
| |
|
|
| SiC Epitaxial Wafer liaison TF |
| |
| | | TFOF | | SiC Epitaxial Wafer liaison TF | |
|
|
| Silicon Carbide Substrate liaison TF |
| |
| | | TFOF | | Silicon Carbide Substrate liaison TF | |
|
|
| North America |
| |
|
|
| M86 Revision Task Force |
| |
| | | TFOF | | M86 Revision Task Force | |
|
|
| M9 Revision Task Force |
| |
| | | TFOF | | M9 Revision Task Force | |
| EH&S |
| |
|
|
| Japan |
| |
|
|
| Japan Environmental Health and Safety Committee |
| |
| | | 7028 | | Reapproval of SEMI S21-0818, Safety Guideline for Worker Protection | |
| | | TFOF | | Japan Environmental Health and Safety Committee | |
|
|
| Japan S2 major revision liaison TF (JA-S2 revision LTF) |
| |
| | | TFOF | | Japan S2 major revision liaison TF (JA-S2 revision LTF) | |
|
|
| S18 Revision Task Force |
| |
| | | 6289 | | Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS | |
| | | TFOF | | S18 Revision Task Force | |
|
|
| Japan and North America |
| |
|
|
| Global Seismic Protection TF |
| |
| | | TFOF | | Global Seismic Protection TF | |
|
|
| S23 Revision Global Task Force |
| |
| | | TFOF | | S23 Revision Global Task Force | |
|
|
| North America |
| |
|
|
| Control of Hazardous Energy (CoHE) Task Force |
| |
| | | 6942 | | Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Related to CoHE/LOTO section of S2) | |
| | | TFOF | | Control of Hazardous Energy (CoHE) Task Force | |
|
|
| Energetic Materials EHS Task Force |
| |
| | | 7022 | | Line Item Revision to SEMI S30, Safety Guideline for Use of Energetic Materials in Semiconductor R&D and Manufacturing Processes (energetic materials)
| |
| | | TFOF | | Energetic Materials EHS Task Force | |
|
|
| Environmental Performance Rating (EPR) Task Force |
| |
| | | TFOF | | Environmental Performance Rating (EPR) Task Force | |
|
|
| Ergonomics Task Force |
| |
| | | 6309 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | 6943 | | Line Item Revisions to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment | |
| | | 6981 | | Line Item Revision to S8-0218, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | TFOF | | Ergonomics Task Force | |
|
|
| Fire Protection Task Force |
| |
| | | 6595 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
| |
| | | 6784 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
| |
| | | 6944 | | Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Regarding Fire Protection) | |
| | | TFOF | | Fire Protection Task Force | |
|
|
| Flammable Gas Task Force |
| |
| | | 6980 | | Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re:Flammable gas) | |
| | | TFOF | | Flammable Gas Task Force | |
|
|
| Manufacturing Equipment Safety Subcommittee |
| |
| | | TFOF | | Manufacturing Equipment Safety Subcommittee | |
|
|
| NA Environmental Health and Safety Committee |
| |
| | | TFOF | | NA Environmental Health and Safety Committee | |
|
|
| S1 Revision Task Force |
| |
| | | 6831 | | Revision to SEMI S1-1015 Safety Guideline for Equipment Safety Labels | |
| | | TFOF | | S1 Revision Task Force | |
|
|
| S10 Task Force |
| |
| | | TFOF | | S10 Task Force | |
|
|
| S12 (Equipment Decon) Review Task Force |
| |
| | | 6782 | | Line Item Revision of SEMI S12 - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | 6888 | | Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | TFOF | | S12 (Equipment Decon) Review Task Force | |
|
|
| S2 Major Revision Task Force |
| |
| | | TFOF | | S2 Major Revision Task Force | |
|
|
| S2 Mechanical Design Task Force |
| |
| | | 6884 | | Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment | |
| | | TFOF | | S2 Mechanical Design Task Force | |
|
|
| S2/S22 Task Force |
| |
| | | 7021 | | Line Items Revisions of S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment | |
| | | TFOF | | S2/S22 Task Force | |
|
|
| S3 Revision Task Force |
| |
| | | 6830 | | Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS | |
| | | TFOF | | S3 Revision Task Force | |
|
|
| S6 Revision Task Force |
| |
| | | 7023 | | Reapproval of SEMI S6, Environmental, Health, And Safety Guideline For Exhaust Ventilation Of Semiconductor Manufacturing Equipment
| |
| | | TFOF | | S6 Revision Task Force | |
|
|
| S7 Task Force |
| |
| | | 6907 | | Revision to SEMI S7-0515 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications | |
| | | TFOF | | S7 Task Force | |
|
|
| Taiwan |
| |
|
|
| Equipment Safety Task Force |
| |
| | | TFOF | | Equipment Safety Task Force | |
| Facilities |
| |
|
|
| Japan |
| |
|
|
| 5-year-review TF |
| |
| | | 7084 | | Reapproval of SEMI F44-0307 (Reapproved 0818), Specification for Machined Stainless Steel Weld Fittings | |
| | | 7085 | | Reapproval of SEMI F45-0307 (Reapproved 0818), Specification for Machined Stainless Steel Reducing Weld Fittings | |
| | | TFOF | | 5-year-review TF | |
|
|
| F1 Revision TF |
| |
| | | TFOF | | F1 Revision TF | |
|
|
| Gas Box Components Joint Task Force |
| |
| | | TFOF | | Gas Box Components Joint Task Force | |
|
|
| Japan Gases and Facilities Committee |
| |
| | | TFOF | | Japan Gases and Facilities Committee | |
|
|
| Korea |
| |
|
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | | Voltage Sag Immunity Task Force | |
|
|
| North America |
| |
|
|
| Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force |
| |
| | | 6628 | | New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling | |
| | | TFOF | | Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force | |
|
|
| NA Facilities Committee |
| |
| | | 6771 | | Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation | |
| | | 6773 | | Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services | |
| | | TFOF | | NA Facilities Committee | |
|
|
| Power Grid Harmonics Task Force |
| |
| | | TFOF | | Power Grid Harmonics Task Force | |
|
|
| SEMI F51 Revision Task Force |
| |
| | | TFOF | | SEMI F51 Revision Task Force | |
|
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | | Voltage Sag Immunity Task Force | |
| Flat Panel Display (FPD) - Materials & Components |
| |
|
|
| Japan |
| |
|
|
| Flexible Display Task Force |
| |
| | | TFOF | | Flexible Display Task Force | |
|
|
| FPD Color Filter Task Force |
| |
| | | TFOF | | FPD Color Filter Task Force | |
|
|
| FPD Mask Task Force |
| |
| | | 6868 | | Revision to SEMI D6-0211 (Reapproved 0117) “Specification For Liquid Crystal Display (LCD) Mask Substrates” with title change to “Specification For Flat Panel Display (FPD) Mask Substrates” | |
| | | 6869 | | Revision to SEMI D38-0211 (Reapproved 0117) “Guide For Quality Area Of LCD Masks” with title change to “Guide For Quality Area Of Flat Panel Display (FPD) Masks” | |
| | | 6937 | | New Standard: TERMINOLOGY FOR FPD PHASE SHIFT MASK AND MASK BLANKS | |
| | | TFOF | | FPD Mask Task Force | |
|
|
| FPD Materials & Components Maintenance Task Force |
| |
| | | 6912 | | Line Item Revision to SEMI D39-0704 (Reapproved 0117): “SPECIFICATION FOR MARKERS ON FPD POLARIZING FILMS” | |
| | | 6977 | | Line Item Revision to SEMI D34-0710: “TEST METHOD FOR FPD POLARIZING FILMS” | |
| | | TFOF | | FPD Materials & Components Maintenance Task Force | |
|
|
| Japan FPD Materials and Components Committee |
| |
| | | TFOF | | Japan FPD Materials and Components Committee | |
|
|
| Polarizing Film TF |
| |
| | | TFOF | | Polarizing Film TF | |
| Flat Panel Display (FPD) - Metrology |
| |
|
|
| Japan |
| |
|
|
| D31 Revision Task Force |
| |
| | | TFOF | | D31 Revision Task Force | |
|
|
| Korea |
| |
|
|
| Perceptual Image Quality |
| |
| | | 6659 | | Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays | |
| | | 6913 | | Line Item Revision to SEMI D61-1110, Test Method of Perceptual Angle for OLED Displays | |
| | | TFOF | | Perceptual Image Quality | |
|
|
| Perceptual Viewing Angle |
| |
| | | TFOF | | Perceptual Viewing Angle | |
|
|
| Picture Quality Evaluation Task Force |
| |
| | | 6701 | | New Standard: Test Method for Warm-up Properties of Display Picture Quality | |
| | | 6863 | | Line-item Revision to SEMI D64-0811, Test Method for Measuring the Spatial Contrast Ratio of Flat Panel Display | |
| | | 6975 | | New Standard, Test Method for Response Time Evaluation of Displays with Variable Refresh Rate | |
| | | 6976 | | Revision to SEMI D71-0614, Test Method of PDP Tone and Color Reproduction with Title Change to: Test Method of Tone and Color Reproduction For Flat Panel Displays | |
| | | TFOF | | Picture Quality Evaluation Task Force | |
|
|
| Transparent Display |
| |
| | | TFOF | | Transparent Display | |
|
|
| Taiwan |
| |
|
|
| Flexible Displays Task Force |
| |
| | | 6632 | | New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays | |
| | | TFOF | | Flexible Displays Task Force | |
|
|
| Maintenance Task Force |
| |
| | | 6960 | | Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection | |
| | | 6961 | | Line Item Revision to SEMI D58 Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display | |
| | | TFOF | | Maintenance Task Force | |
|
|
| Transparent Display Task Force |
| |
| | | 6201 | | New Standard: Guide for Tone Reproduction Curves for Transparent Displays | |
| | | 6737 | | New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays | |
| | | TFOF | | Transparent Display Task Force | |
| Flexible Hybrid Electronics (FHE) |
| |
|
|
| Japan |
| |
|
|
| FHE Terminology |
| |
| | | 6906 | | New Standard:Terminology for Flexible Hybrid Electronics (FHE) | |
| | | TFOF | | FHE Terminology | |
|
|
| Tactile texture characteristics for FHE |
| |
| | | 6978 | | New Standard: Test Method for The Tactile Texture Characteristics of FHE Materials And Products | |
| | | TFOF | | Tactile texture characteristics for FHE | |
|
|
| Taiwan |
| |
|
|
| FHE System for Wearable Task Force |
| |
| | | 6873 | | New Standard: Guide for Salt Mist and Washability Test Flow for Control Module Connector of Electronic textiles | |
| | | 7104 | | New Standard: Test Method of Electromyography Sensing Technology of Flexible Hybrid Electronics and Electronic Textiles | |
| | | TFOF | | FHE System for Wearable Task Force | |
| Gases |
| |
|
|
| Europe |
| |
|
|
| Cleaning Gases |
| |
| | | 6148 | | Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing | |
| | | TFOF | | Cleaning Gases | |
|
|
| Permeation Tubes for Trace Moisture Calibration |
| |
| | | TFOF | | Permeation Tubes for Trace Moisture Calibration | |
|
|
| North America |
| |
|
|
| Filters and Purifiers Task Force |
| |
| | | TFOF | | Filters and Purifiers Task Force | |
|
|
| Gases Specification Task Force |
| |
| | | 7097 | | Line-Item Revision to SEMI C54-1116, Specification for Oxygen | |
| | | 7098 | | Line-Item Revision to SEMI C56-1116, Specification for Dichlorosilane | |
| | | TFOF | | Gases Specification Task Force | |
|
|
| Heater Jacket Task Force |
| |
| | | 6916 | | Replacement of SEMI F109-0212, Guide for Heater Systems Requirements,
as a New Standard: Guide for Material Selection for Heater Systems | |
| | | TFOF | | Heater Jacket Task Force | |
|
|
| Mass Flow Controller Task Force |
| |
| | | 7092 | | Line-Item Revision to SEMI E29-1110 (Reapproved 0417), Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters | |
| | | 7093 | | Line-Item Revision to SEMI F62-1016, Test Method for Determining Mass Flow Controller Performance Characteristics for Ambient and Gas Temperature Effects | |
| | | 7094 | | Reapproval of SEMI E16-0517, Guide for Determining and Describing Mass Flow Controller Leak Rates | |
| | | 7095 | | Reapproval of SEMI E27-1017, Guide for Mass Flow Controller and Mass Flow Meter Linearity | |
| | | 7096 | | Reapproval of SEMI E66-0611 (Reapproved 0517), Test Method for Determining Particle Contribution by Mass Flow Controllers | |
| | | TFOF | | Mass Flow Controller Task Force | |
|
|
| Materials of Construction of Gas Delivery Systems Task Force |
| |
| | | 6394 | | Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems | |
| | | 6612 | | New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves | |
| | | 7052 | | Line-Item Revision to SEMI F20-0706, Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components used in General Purpose, High Purity and Ultra-high Purity Semiconductor Manufacturing Applications | |
| | | TFOF | | Materials of Construction of Gas Delivery Systems Task Force | |
|
|
| Pressure Measurement Task Force |
| |
| | | TFOF | | Pressure Measurement Task Force | |
|
|
| Surface Mount Sandwich Component Dimensions Task Force |
| |
| | | TFOF | | Surface Mount Sandwich Component Dimensions Task Force | |
| HB-LED |
| |
|
|
| China |
| |
|
|
| GaN based LED Epitaxial Wafer Task Force |
| |
| | | TFOF | | GaN based LED Epitaxial Wafer Task Force | |
|
|
| HB-LED Equipment Communication Interface |
| |
| | | TFOF | | HB-LED Equipment Communication Interface | |
|
|
| Patterned Sapphire Substrate Task Force |
| |
| | | 6371 | | New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate | |
| | | TFOF | | Patterned Sapphire Substrate Task Force | |
|
|
| Sapphire Single Crystal Ingot Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Ingot Task Force | |
|
|
| Sapphire Single Crystal Orientation Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Orientation Task Force | |
|
|
| Single Crystal Sapphire Task Force |
| |
| | | TFOF | | Single Crystal Sapphire Task Force | |
|
|
| North America |
| |
|
|
| HB-LED Assembly |
| |
| | | TFOF | | HB-LED Assembly | |
|
|
| HB-LED Equipment Automation Interfaces |
| |
| | | TFOF | | HB-LED Equipment Automation Interfaces | |
|
|
| HB-LED Equipment Communication Interfaces TF |
| |
| | | TFOF | | HB-LED Equipment Communication Interfaces TF | |
|
|
| HB-LED Source Materials TF |
| |
| | | 5984 | | New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing | |
| | | 5985 | | New Standard: Guide for Triethylgallium for HB-LED Manufacturing | |
| | | 5986 | | New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing | |
| | | 5987 | | New Standard: Guide for Trimethylgallium for HB-LED Manufacturing | |
| | | 5988 | | New Standard: Guide for Trimethylindium for HB-LED Manufacturing | |
| | | TFOF | | HB-LED Source Materials TF | |
|
|
| HB-LED Wafer TF |
| |
| | | TFOF | | HB-LED Wafer TF | |
|
|
| Impurities and Defects in HB-LED Sapphire Wafers |
| |
| | | TFOF | | Impurities and Defects in HB-LED Sapphire Wafers | |
|
|
| NA HB-LED Committee |
| |
| | | TFOF | | NA HB-LED Committee | |
|
|
| Patterned Sapphire Substrate (PSS) TF |
| |
| | | TFOF | | Patterned Sapphire Substrate (PSS) TF | |
|
|
| Test Methods TF |
| |
| | | TFOF | | Test Methods TF | |
| Information & Control |
| |
|
|
| China |
| |
|
|
| Advanced Backend Factory Integration Task Force |
| |
| | | 7018 | | Line Item Revision to SEMI E87-0921, Specification For Carrier Management (CMS) and E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS) | |
| | | TFOF | | Advanced Backend Factory Integration Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
|
|
| Japan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6920 | | Line Item Revision to SEMI E171-0916: SPECIFICATION FOR PREDICTIVE CARRIER LOGISTICS(PCL) and SEMI E171.1-0216: SPECIFICATION FOR SECS-II PROTOCOL FOR PREDICTIVE CARRIER LOGISTICS
| |
| | | TFOF | | GEM 300 Task Force | |
|
|
| JA I&C Maintenance Task Force |
| |
| | | 6770 | | Line-Item revision to E169-0615 Guide for Equipment Information System Security | |
| | | 6861 | | Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer | |
| | | 6862 | | Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer | |
| | | 7005 | | Line Item Revision to SEMI E91-1217: SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM) | |
| | | TFOF | | JA I&C Maintenance Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Korea |
| |
|
|
| Advanced Back-end Factory Integration TF |
| |
| | | TFOF | | Advanced Back-end Factory Integration TF | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 5832 | | New Standard, Specification for Equipment Generic Counter Model (EGCM) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| North America |
| |
|
|
| Advanced Backend Factory Integration |
| |
| | | 6840 | | New Standard: Specification for Equipment Adoption Criteria for GEM And GEM-Based Standards | |
| | | 6852 | | Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping | |
| | | 6924 | | New Standard: Specification for Equipment Management of Consumables and Durables | |
| | | 6925 | | New Subordinate Standard: Specification for SECS-II Protocol for Equipment Management of Consumables and Durables | |
| | | 6948 | | Line Item Revisions to SEMI E142-0921 - Specification for Substrate Mapping, SEMI E142.1-0921 - Specification for XML Schema for Substrate Mapping, Line Item Revision to SEMI E142.2-0921 - Specification for SECS II Protocol For Substrate Mapping, Line Item Revision to SEMI E142.3-0921 - Specification for Web Services Protocol for Substrate Mapping, Line Item Revision to SEMI E142.4-0921 - Specification for Secs II Protocol For Substrate Mapping Using Item Transfer | |
| | | TFOF | | Advanced Backend Factory Integration | |
|
|
| Diagnostic Data Acquisition Task Force NA |
| |
| | | 6837 | | LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS | |
| | | 6930 | | Revision to SEMI E164-0414 (Reapproved 0721): Specification for EDA Common Metadata | |
| | | 6947 | | Line Item Revision to SEMI E179-0320, Specification for Protocol Buffers Common Components | |
| | | 7001 | | Revision to SEMI E125-1022 Specification for Equipment Self Description (EqSD) and SEMI E125.2-1022 Specification for Protocol Buffers for Equipment Self Description (EqSD) | |
| | | 7002 | | Revision to SEMI E132-0922 Specification for Equipment Client Authentication and Authorization and SEMI E132.2-0422e Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) | |
| | | 7003 | | Revision to SEMI E134-1022 Specification for Data Collection Management and SEMI E134.2-1022 Specification for Protocol Buffers of Data Collection Management | |
| | | 7017 | | Line Item Revision to SEMI E120.2-0922, Specification for Protocol Buffers for Common Equipment Model (CEM) | |
| | | TFOF | | Diagnostic Data Acquisition Task Force NA | |
|
|
| Energy Saving Equipment Communication Task Force |
| |
| | | 6923 | | Line Item Revisions to SEMI E167-1213: Specification for Equipment Energy Saving Mode Communications (EESM), SEMI E167.1-1213: Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications, and SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC) | |
| | | TFOF | | Energy Saving Equipment Communication Task Force | |
|
|
| Equipment Data Publication (EDP) Task Force |
| |
| | | 7068 | | New Standard: Specification for Equipment Data Publication | |
| | | 7069 | | Revision to Add a New Subordinate Standard: Specification for Common Data for Etch Components to Specification for Equipment Data Publication | |
| | | 7070 | | Revision to Add a New Subordinate Standard: Specification for Common Data for Vacuum Components to Specification for Equipment Data Publication | |
| | | TFOF | | Equipment Data Publication (EDP) Task Force | |
|
|
| Fab & Equipment Computer and Device Security (CDS) Task Force |
| |
| | | 6565 | | New Standard: Specification for Application Accesslisting | |
| | | 6926 | | New Standard: Specification for Equipment Operator Access Management and Monitoring | |
| | | TFOF | | Fab & Equipment Computer and Device Security (CDS) Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6835 | | LINE ITEM REVISION TO SEMI E87-XXXX SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-XXXX SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT (CMS) | |
| | | 6836 | | LINE ITEM REVISION TO SEMI E87-0619 SPECIFICATION FOR CARRIER MANAGEMENT (CMS) and SEMI E87.1-0619 SPECIFICATION FOR SECS-II PROTOCOL FOR CARRIER MANAGEMENT(CMS) and SEMI E90-1218
SPECIFICATION FOR SUBSTRATE TRACKING and SEMI E90.1-0312
SPECIFICATION FOR SECS-II PROTOCOL FOR SUBSTRATE TRACKING | |
| | | 6991 | | Line Item Revision to SEMI E4-0418, Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I) | |
| | | 6992 | | Line Item Revision to SEMI E157-0611 (Reapproved 0616), Specification for Module Process Tracking | |
| | | 7004 | | Reapproval of E130-0618, Specification for Prober Specific Equipment Model for 300 mm Environment (PSEM300) | |
| | | 7063 | | Reapproval of SEMI E39-1218, Specification for Object Services: Concepts, Behavior, and Services | |
| | | 7064 | | Reapproval of SEMI E40-1218, Specification for Processing Management | |
| | | 7065 | | Line Item Revision to SEMI E172-0320, Specification for SECS Equipment Data Dictionary (SEDD) | |
| | | 7066 | | Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| Graphical User Interfaces (GUI) Task Force |
| |
| | | 6743 | | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment | |
| | | TFOF | | Graphical User Interfaces (GUI) Task Force | |
|
|
| NA Information and Control Committee |
| |
| | | TFOF | | NA Information and Control Committee | |
|
|
| Process Control System NA |
| |
| | | 6649 | | Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS) | |
| | | 6722 | | Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices | |
| | | 6724 | | Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device | |
| | | 6951 | | Reapproval of SEMI E126-0708 - Specification for Equipment Quality Information Parameters (EQIP) | |
| | | 7067 | | Line tem Revision to SEMI E133-1218, Specification for Automated Process Control Systems Interface and SEMI E133.1-0318, Specification for XML Messaging for Process Control System (PCS) | |
| | | TFOF | | Process Control System NA | |
| | | TFOF | | Process Control System NA | |
|
|
| Sensor Bus Task Force |
| |
| | | 6563 | | Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device | |
| | | 6564 | | Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges | |
| | | 6845 | | Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network | |
| | | 6846 | | Reapproval of SEMI E54.1-0316, Specification for Sensor/Actuator Network Common Device Mode | |
| | | 6847 | | Reapproval of SEMI E54.2-0316, Guide for Writing Sensor/Actuator Network (SAN) Letter Ballots | |
| | | 6848 | | Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT | |
| | | 6849 | | Reapproval of SEMI E54.24-1116, Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENsen) | |
| | | 6949 | | Line Item Revisions to E54, SEMI E54.1, SEMI E54.10, SEMI E54.11, SEMI E54.12, SEMI E54.13, SEMI E54.14, SEMI E54.15, SEMI E54.16, SEMI E54.17, SEMI E54.18, SEMI E54.19, SEMI E54.2, SEMI E54.20, SEMI E54.21, SEMI E54.22, SEMI E54.23, SEMI E54.24, SEMI E54.3, SEMI E54.4, SEMI E54.7, SEMI E54.8, SEMI E54.9 | |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Taiwan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Equipment Edge Data Governance (EEDG) Task Force |
| |
| | | 6938 | | New Standard: Guide for Equipment Edge Data Governance (EEDG) | |
| | | TFOF | | Equipment Edge Data Governance (EEDG) Task Force | |
|
|
| Equipment Information Integration Task Force |
| |
| | | TFOF | | Equipment Information Integration Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | 7103 | |
Line Item Revision to SEMI E187(0122)- Specification for Cybersecurity of Fab Equipment
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
| Liquid Chemicals |
| |
|
|
| Europe |
| |
|
|
| EU Gases and Liquid Chemicals Committee |
| |
| | | TFOF | | EU Gases and Liquid Chemicals Committee | |
|
|
| Precursor Specifications Task Force |
| |
| | | TFOF | | Precursor Specifications Task Force | |
|
|
| Solvents in Advanced Processes |
| |
| | | TFOF | | Solvents in Advanced Processes | |
|
|
| Japan |
| |
|
|
| Diaphragm Valves Task Force |
| |
| | | TFOF | | Diaphragm Valves Task Force | |
|
|
| Liquid-Borne Particle Counter Task Force |
| |
| | | 6979 | | Revision to C77-0912, TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 30 nm AND 100 nm with title change to TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 20 nm AND 100 nm | |
| | | TFOF | | Liquid-Borne Particle Counter Task Force | |
|
|
| Liquid Filter Task Force |
| |
| | | 6883 | | Reapproval of SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS) | |
| | | 6911 | | New Standard, Test Method For Metal Removal Performance Of Liquid Filter | |
| | | TFOF | | Liquid Filter Task Force | |
|
|
| Trace Metal Analysis for High Pure IPA Task Force |
| |
| | | 6820 | | New Standard: Guide for Trace Iron Analysis in High Purity IPA | |
| | | TFOF | | Trace Metal Analysis for High Pure IPA Task Force | |
|
|
| Welding Fitting Task Force |
| |
| | | TFOF | | Welding Fitting Task Force | |
|
|
| North America |
| |
|
|
| Chemical Analytical Methods Task Force |
| |
| | | 6315 | | Revision to SEMI C30-0218, Specification for Hydrogen Peroxide, with title change to: Specification and Guide for Hydrogen Peroxide | |
| | | 6388 | | Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid | |
| | | 7007 | | Reapproval of SEMI C21-0618, Specification and Guide for Ammonium Hydroxide | |
| | | 7008 | | Reapproval of SEMI C28-0618, Specification and Guide for Hydrofluoric Acid | |
| | | 7009 | | Reapproval of SEMI C29-0618, Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v) | |
| | | 7010 | | Reapproval of SEMI C35-0118, Specification and Guide for Nitric Acid | |
| | | 7011 | | Reapproval of SEMI C40-1110 (Reapproved 0618), Specification for Potassium Hydroxide, 45% Solution | |
| | | 7012 | | Reapproval of SEMI C41-0618, Specification and Guide for 2-Propanol | |
| | | 7013 | | Reapproval of SEMI C45-0518, Specification and Guide for Tetraethylorthosilicate (TEOS) | |
| | | 7014 | | Reapproval of SEMI C62-0309 (Reapproved 0618), Specification for Progen Precursors Used in Low K CVD Processes | |
| | | 7015 | | Reapproval of SEMI C63-1108 (Reapproved 0618), Specification for Organosilicate Precursors Used in Low K CVD Processes | |
| | | 7016 | | Reapproval of SEMI C81-0113 (Reapproved 0618), Guide for Tris(Dimethylamino) Silane (3DMAS) | |
| | | TFOF | | Chemical Analytical Methods Task Force | |
|
|
| Chemical Mechanical Planarization Consumables (CMP-C) Task Force |
| |
| | | 6904 | | New Standard: Guide for Reporting Performance Parameters of the Retaining Rings for Chemical Mechanical Planarization (CMP) used in Semiconductor Manufacturing | |
| | | 6970 | | New Standard: Guide for Reporting Performance Parameters of Pressure Sensitive Adhesives (PSA) for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing | |
| | | TFOF | | Chemical Mechanical Planarization Consumables (CMP-C) Task Force | |
|
|
| High Purity Liquid Assemblies & Systems Task Force |
| |
| | | 6828 | | Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems | |
| | | 6917 | | Revision to SEMI F39-0621, Guide for Chemical Blending Systems | |
| | | TFOF | | High Purity Liquid Assemblies & Systems Task Force | |
|
|
| High Purity Polymer Materials and Components Task Force |
| |
| | | 6601 | | New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water | |
| | | 6713 | | Line Item Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems | |
| | | 7006 | | Revision to SEMI C69-1015 (Reapproved 1220), Test Method for the Determination of Surface Areas of Polymer Pellets | |
| | | 7089 | | Line-Item Revision to SEMI C78-0113 (Reapproved 1218), Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy | |
| | | 7090 | | Line-Item Revision to SEMI C87-0515, Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Contact Profilometry | |
| | | 7091 | | Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems, with title change to: Test Method and Specification for Testing of Perfluoroalkoxy (PFA) and Other Fluorinated Materials Used in Liquid Chemical Distribution Systems | |
| | | TFOF | | High Purity Polymer Materials and Components Task Force | |
|
|
| Statistical Methods Task Force |
| |
| | | 6451 | | Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals | |
| | | 6509 | | Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change | |
| | | 6935 | | Revision to SEMI C10-1109 (Reapproved 1114), Guide for Determination of Method Detection Limits | |
| | | TFOF | | Statistical Methods Task Force | |
|
|
| Ultra Pure Water Task Force |
| |
| | | 6715 | | New Standard: Guide for Evaluating Metrology for Particle Precursors in Ultrapure Water | |
| | | 6716 | | Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems | |
| | | 7086 | | Revision to SEMI F61–0521, Guide for Design and Operation of a Semiconductor Ultrapure Water System | |
| | | 7087 | | Revision to SEMI F63-0521, Guide for Ultrapure Water Used in Semiconductor Processing | |
| | | 7088 | | Revision to SEMI F75-0521, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing | |
| | | TFOF | | Ultra Pure Water Task Force | |
|
|
| Water Management Task Force |
| |
| | | 6993 | | Line-Item Revision to SEMI F98-0521, Guide for Water Reuse in Semiconductor Industry | |
| | | TFOF | | Water Management Task Force | |
| MEMS / NEMS |
| |
|
|
| International |
| |
|
|
| Terminology |
| |
| | | TFOF | | Terminology | |
|
|
| North America |
| |
|
|
| MEMS and Miniaturized Gas Sensing Task Force |
| |
| | | TFOF | | MEMS and Miniaturized Gas Sensing Task Force | |
|
|
| MEMS Material Characterization Task Force |
| |
| | | TFOF | | MEMS Material Characterization Task Force | |
|
|
| MEMS Microfluidics Task Force |
| |
| | | TFOF | | MEMS Microfluidics Task Force | |
|
|
| MEMS Packaging Task Force |
| |
| | | TFOF | | MEMS Packaging Task Force | |
|
|
| MEMS Reliability Task Force |
| |
| | | TFOF | | MEMS Reliability Task Force | |
|
|
| MEMS Substrate Task Force |
| |
| | | TFOF | | MEMS Substrate Task Force | |
|
|
| NA MEMS/NEMS Committee |
| |
| | | TFOF | | NA MEMS/NEMS Committee | |
|
|
| Wafer Bond Task Force |
| |
| | | TFOF | | Wafer Bond Task Force | |
| Metrics |
| |
|
|
| Japan |
| |
|
|
| Cycle Time Metrics Task Force |
| |
| | | TFOF | | Cycle Time Metrics Task Force | |
|
|
| Japan RF Measurement liaison Task Force |
| |
| | | 6550 | | Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | Japan RF Measurement liaison Task Force | |
|
|
| North America |
| |
|
|
| Critical Chamber Components (CCC) Test Methods Task Force |
| |
| | | 6931 | | NEW STANDARD: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection | |
| | | TFOF | | Critical Chamber Components (CCC) Test Methods Task Force | |
|
|
| EMC Task Force |
| |
| | | 6894 | | Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment | |
| | | TFOF | | EMC Task Force | |
|
|
| Equipment Cost of Ownership Task Force |
| |
| | | 6841 | | Line-item Revisions to SEMI E35-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment | |
| | | 6842 | | Line-item Revisions to SEMI E140-0618 - Guide to Calculate Cost of Ownership (COO) Metrics for Gas Delivery Systems | |
| | | TFOF | | Equipment Cost of Ownership Task Force | |
|
|
| Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |
| |
| | | 6578 | | Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6579 | | Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity | |
| | | TFOF | | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force | |
|
|
| Equipment Training and Documentation Task Force |
| |
| | | TFOF | | Equipment Training and Documentation Task Force | |
|
|
| ESD/ESC Task Force- N.A |
| |
| | | 6971 | | Revision to SEMI E163-0212, Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas | |
| | | TFOF | | ESD/ESC Task Force- N.A | |
|
|
| License Server Certification |
| |
| | | TFOF | | License Server Certification | |
|
|
| Metrics Committee |
| |
| | | 7056 | | Reapproval of SEMI E168-0915, Specification for Product Time Measurement | |
| | | 7057 | | Reapproval of SEMI E168.1-1114, Specification for Product Time Measurement in GEM 300 Production Equipment | |
| | | 7058 | | Reapproval of SEMI E168.2-0915, Specification for Product Time Measurement for Material Control Systems | |
| | | 7059 | | Reapproval of SEMI E168.3-0915, Specification for Product Time Measurement for Transport | |
|
|
| North America Metrics Technical Committee |
| |
| | | TFOF | | North America Metrics Technical Committee | |
|
|
| RF Measurements Task Force |
| |
| | | 6838 | | Reapproval of SEMI E114-0302E (Reapproved 0616), Test Method for RF Cable Assemblies Used in Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | 6839 | | Reapproval of SEMI E115-0302E (Reapproved 0816), Test Method for Determining the Load Impedance and Efficiency of Matching Networks Used in Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | RF Measurements Task Force | |
| Micropatterning |
| |
|
|
| North America |
| |
|
|
| Curvilinear Format Task Force |
| |
| | | 6821 | | New Standard: Specification for Improved Curvilinear Layout Representation | |
| | | TFOF | | Curvilinear Format Task Force | |
|
|
| Mask Orders Task Force |
| |
| | | TFOF | | Mask Orders Task Force | |
|
|
| Micropatterning Committee |
| |
| | | 7026 | | Reapproval of SEMI P44-1216 Specification for Open Artwork System Interchange Standard (OASIS ®) Specific to Mask Tools
| |
| | | 7027 | | Reapproval of SEMI P39-0416 Specification for OASIS® – Open Artwork System Interchange Standard
| |
|
|
| NA Microlithography Committee for 5-Year Review |
| |
| | | TFOF | | NA Microlithography Committee for 5-Year Review | |
|
|
| P47 Revision Task Force |
| |
| | | 6516 | |
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
| |
| | | TFOF | | P47 Revision Task Force | |
|
|
| Patterning Metrology Task Force |
| |
| | | TFOF | | Patterning Metrology Task Force | |
| Photovoltaic |
| |
|
|
| China |
| |
|
|
| Building Integrated Photovoltaic (BIPV) Task Force |
| |
| | | 6542 | | New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building | |
| | | 6700 | | New Standard: Test Method of Wind Uplift Resistance for Photovoltaic Modules Roof (BIPV) | |
| | | TFOF | | Building Integrated Photovoltaic (BIPV) Task Force | |
|
|
| Crystalline Silicon Solar Cell Task Force |
| |
| | | 6872 | | Revision to SEMI PV75-1016, Test Method on Cell Level for Potential-induced-degradation Susceptibility of Solar Cells and Module Encapsulation Materials | |
| | | 7050 | | Reapproval of SEMI PV87-1018, Test Method for Peeling Force Between Electrode and Ribbon/Back Sheet | |
| | | TFOF | | Crystalline Silicon Solar Cell Task Force | |
|
|
| PV Equipment Task Force |
| |
| | | 7054 | | Reapproval of SEMI PV81-0318, Guide for Specifying Low Pressure Horizontal Diffusion Furnace | |
| | | 7055 | | New Standard: Guide for Tube PECVD Graphite Boat Materials for Solar Cell Production | |
| | | TFOF | | PV Equipment Task Force | |
|
|
| PV Module Task Force |
| |
| | | 7047 | | Reapproval of SEMI PV82-0318, Specification for Terrestrial Dual-Glass Module with Crystalline Silicon Solar Cell | |
| | | 7048 | | Reapproval of SEMI PV83-0318, Guide for Sample Preparation Method for Photovoltaic Backsheet Performance Tests | |
| | | 7049 | | Reapproval of SEMI PV85-1018, Practice for Metal Wrap Through (MWT) Back Contact Photovoltaic (PV) Module Assembly | |
| | | TFOF | | PV Module Task Force | |
|
|
| Thin Film PV Module Task Force |
| |
| | | TFOF | | Thin Film PV Module Task Force | |
|
|
| Taiwan |
| |
|
|
| Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force |
| |
| | | 6297 | | New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC) | |
| | | 6539 | | New Standard :Specification of reference device for indoor lighting simulator | |
| | | 6540 | | New Standard :Test Method for Durability of Flexible emerging PV | |
| | | TFOF | | Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force | |
|
|
| PV Reliability Test Method Task Force |
| |
| | | 6705 | | Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation | |
| | | TFOF | | PV Reliability Test Method Task Force | |
| Photovoltaic (PV) - Materials |
| |
|
|
| China |
| |
|
|
| PV Silicon Raw Materials Task Force |
| |
| | | 7051 | | Reapproval of SEMI PV88-1018, Test Method for Determination of Hydrogen in Photovoltaic (PV) Polysilicon by Inert Gas Fusion Infrared Absorption Method | |
| | | TFOF | | PV Silicon Raw Materials Task Force | |
|
|
| PV Silicon Wafer Task Force |
| |
| | | 6922 | | New Standard: Classification of Reusable Silicon Material | |
| | | TFOF | | PV Silicon Wafer Task Force | |
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|
| Europe |
| |
|
|
| PV Material Degradation Task Force |
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| | | TFOF | | PV Material Degradation Task Force | |
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|
| PV Silicon Materials Task Force |
| |
| | | TFOF | | PV Silicon Materials Task Force | |
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|
| Japan |
| |
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|
| Japan PV Materials Task Force |
| |
| | | TFOF | | Japan PV Materials Task Force | |
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|
| North America |
| |
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|
| International PV Analytical Test Methods, Metrology, and Inspection Task Force |
| |
| | | TFOF | | International PV Analytical Test Methods, Metrology, and Inspection Task Force | |
| Physical Interfaces & Carriers |
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|
|
| International |
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|
|
| Global PIC Maintenance Task Force |
| |
| | | 6833 | | Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
| | | 6834 | | Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | 7000 | | Line Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface | |
| | | TFOF | | Global PIC Maintenance Task Force | |
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|
| Japan |
| |
|
|
| 300mm Tape Frame PI&C Task Force |
| |
| | | 6895 | | Line Item Revision to SEMI E185-1221-SPECIFICATION FOR 300 mm TAPE FRAME FOUP | |
|
|
| Global PIC Maintenance Task Force |
| |
| | | 6897 | | Revision of E92, Specification For 300 mm Light Weight and Compact Box Opener/Loader To Tool-Interoperability Standard (Bolts/Light) | |
|
|
| Japan Electron Microscopy Workflow liaison Task Force |
| |
| | | TFOF | | Japan Electron Microscopy Workflow liaison Task Force | |
|
|
| Panel Level Packaging Panel FOUP Task Force |
| |
| | | 6898 | | Revision to SEMI E181, - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING | |
| | | 6899 | | Revision to SEMI E181.1, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 12 Slots | |
| | | 6900 | | Revision to SEMI E181.2, - Specification for Panel FOUP for 510 to 515 mm Panel Size and 6 Slots | |
| | | 6901 | | Revision to SEMI E181.3, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 12 Slots | |
| | | 6902 | | Revision to SEMI E181.4, - Specification for Panel FOUP for 600 to 600 mm Panel Size and 6 Slots | |
| | | 6936 | | Line Item Revision of SEMI E182-0621 - Specification for Panel FOUP Loadport for Panel Level Packaging | |
| | | TFOF | | Panel Level Packaging Panel FOUP Task Force | |
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|
| North America |
| |
|
|
| Electron Microscopy Workflow Task Force |
| |
| | | 6592 | | New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows | |
| | | 6832 | | New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user | |
| | | TFOF | | Electron Microscopy Workflow Task Force | |
|
|
| Global PIC Maintenance Task Force |
| |
| | | 6918 | | Line-Item Revision to SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface | |
|
|
| Packaging Tape Frame Handling Task Force |
| |
| | | 6896 | | New Standard: Specification for 300 mm Frame Carrier FOUP | |
| | | TFOF | | Packaging Tape Frame Handling Task Force | |
|
|
| SEMI E72 Revision Task Force |
| |
| | | 6919 | | Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight | |
| | | TFOF | | SEMI E72 Revision Task Force | |
| Silicon Wafer |
| |
|
|
| Europe |
| |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 6982 | | Revision to SEMI M78-0618 GUIDE FOR DETERMINING NANOTOPOGRAPHY OF UNPATTERNED SILICON WAFERS FOR THE 130 nm to 22 nm GENERATIONS IN HIGH VOLUME MANUFACTURING | |
| | | 6985 | | Reapproval of SEMI MF1390, Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning | |
| | | 6986 | | Reapproval of SEMI M43, Guide for Reporting Wafer Nanotopography | |
| | | 6987 | | Reapproval of SEMI M84, Specification for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications | |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | 6984 | | Line item revision of SEMI M050-00-1116, Test Method for Determining Capture Rate and False Count Rate for Surface Scanning Inspection Systems by the Overlay Method | |
| | | 6988 | | Reapproval of SEMI M84, Specification for Polished Single Crystal Silicon Wafers for Gallium Nitride-On-Silicon Applications | |
| | | 6989 | | Reapproval of SEMI M40, Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers | |
| | | 6990 | | Reapproval of SEMI ME1392, Guide for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces | |
|
|
| International Polished Wafers Task Force |
| |
| | | 6462 | | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
| |
| | | 7024 | | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
| |
|
|
| International |
| |
|
|
| International 450 mm Shipping Box |
| |
| | | TFOF | | International 450 mm Shipping Box | |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | TFOF | | International Advanced Wafer Geometry Task Force | |
|
|
| International Annealed Si Wafer Task Force |
| |
| | | TFOF | | International Annealed Si Wafer Task Force | |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | TFOF | | International Automated Advanced Surface Inspection Task Force | |
|
|
| International Epitaxial Wafers Task Force |
| |
| | | TFOF | | International Epitaxial Wafers Task Force | |
|
|
| International Polished Wafers Task Force |
| |
| | | TFOF | | International Polished Wafers Task Force | |
|
|
| International SOI Wafers Task Force |
| |
| | | TFOF | | International SOI Wafers Task Force | |
|
|
| International Terminology Task Force |
| |
| | | TFOF | | International Terminology Task Force | |
|
|
| International Test Methods Task Force |
| |
| | | TFOF | | International Test Methods Task Force | |
|
|
| Japan |
| |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 6983 | | Revision for M49 “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 16 nm TECHNOLOGY GENERATIONS" | |
|
|
| International Test Methods Task Force |
| |
| | | 6570 | | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique | |
| | | 6687 | | Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity | |
|
|
| JA Shipping Box Task Force |
| |
| | | TFOF | | JA Shipping Box Task Force | |
|
|
| Japan AWG Task Force |
| |
| | | TFOF | | Japan AWG Task Force | |
|
|
| Japan TC Chapter of Global Technical Tommittee |
| |
| | | TFOF | | Japan TC Chapter of Global Technical Tommittee | |
|
|
| Japan Test Method Task Force |
| |
| | | 5772 | | Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | |
| | | 6702 | | Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION | |
| | | TFOF | | Japan Test Method Task Force | |
|
|
| Test Method Task Force |
| |
| | | TFOF | | Test Method Task Force | |
|
|
| North America |
| |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | 6957 | | Line Item Revision of SEMI M52 - Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 5 nm Technology Generations | |
|
|
| International SOI Wafers Task Force |
| |
| | | 6583 | | New Standard: Specification for SOI Wafers for RF Device Applications | |
|
|
| International Test Methods Task Force |
| |
| | | 6958 | | Reapproval of SEMI M21 - Guide for Assigning Addresses to Rectangular Elements in a Cartesian Array | |
| | | 7025 | | Line Item Revision of SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure”
| |
| | | 7029 | | Reapproval of SEMI M61-0612 (Reapproved 0319)Specification for Silicon Epitaxial Wafers with Buried Layers
| |
| | | 7030 | | Reapproval of SEMI MF95-1107 (Reapproved 0718) Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer
| |
| | | 7031 | | Reapproval of SEMI MF950-1107 (Reapproved 0718) Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Wafer Surface by Angle Polished and Defect Etching
| |
| | | 7032 | | Reapproval of SEMI MF84-0312 (Reapproved 0718) Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Prober
| |
| | | 7033 | | Reapproval of SEMI MF672-0412 (Reapproved 1018) Guide for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe
| |
| | | 7034 | | Reapproval of SEMI MF671-0312 (Reapproved 0718) Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials
| |
| | | 7035 | | Reapproval of SEMI MF576-0812 (Reapproved 0718)) Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
| |
| | | 7036 | | Reapproval of SEMI MF533-0310 (Reapproved 0416) Test Method for Thickness and Thickness Variation of Silicon Wafers | |
| | | 7037 | | Reapproval of SEMI MF525-0312 (Reapproved 0718) Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe | |
| | | 7038 | | Reapproval of SEMI MF523-1107 (Reapproved 0718) Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces | |
| | | 7039 | | Reapproval of SEMI MF397-0812 (Reapproved 0718) Test Method for Resistivity of Silicon Bars Using a Two-Point Probe | |
| | | 7040 | | Reapproval of SEMI MF374-0312 (Reapproved 0718)Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure | |
| | | 7041 | | Reapproval of SEMI MF26-0714E Test Method for Determining the Orientation of a Semiconductive Single Crystal | |
| | | 7042 | | Reapproval of SEMI MF2074-0912 (Reapproved 0718) Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers | |
| | | 7043 | | Reapproval of SEMI MF1982-0317 Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography | |
| | | 7044 | | Reapproval of SEMI MF1763-0318 Test Method for Measuring Contrast of a Linear Polarizer | |
| | | 7045 | | Reapproval of SEMI MF1630-1107 (Reapproved 0718) Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities | |
| | | 7046 | | Reapproval of SEMI MF1619-1107 (Reapproved 0718) Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at the Brewster Angle
s | |
| | | 7072 | | Reapproval of SEMI MF1569-0307 (Reapproved 0718) Guide for Generation of Consensus Reference Materials for Semiconductor Technology
| |
| | | 7073 | | Reapproval of SEMI MF1527-0412 (Reapproved 1018) Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon | |
| | | 7074 | | Reapproval of SEMI MF1392-0307 (Reapproved 0718) Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements with a Mercury Probe | |
| | | 7075 | | Reapproval of SEMI MF1391-1107 (Reapproved 0912) Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption | |
| | | 7076 | | Reapproval of SEMI MF1388-0707 (Reapproved 0718) Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors | |
| | | 7077 | | Reapproval of SEMI MF1366-0308 (Reapproved 1018) Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometrys | |
| | | 7078 | | Reapproval of SEMI MF1188-1107 (Reapproved 0718) Test Method for Interstitial Oxygen Content of Silicon by Infrared Absorption With Short Baseline | |
| | | 7079 | | Reapproval of SEMI MF110-1107 (Reapproved 0718) Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique | |
| | | 7080 | | Reapproval of SEMI MF1049-0308 (Reapproved 1018) Practice for Shallow Etch Pit Detection on Silicon Wafers | |
| | | 7081 | | Reapproval of SEMI M8-0312 (Reapproved 0718) Specification for Polished Monocrystalline Silicon Test Wafers | |
| | | 7082 | | Reapproval of SEMI M56-1018 Practice for Determining Cost Components for Metrology Equipment Due to Measurement Variability and Bias | |
| | | 7083 | | Reapproval of SEMI M38-0312 (Reapproved 0718) Specification for Polished Reclaimed Silicon Wafers | |
|
|
| Silicon Wafer Committee |
| |
| | | TFOF | | Silicon Wafer Committee | |
| Traceability |
| |
|
|
| Japan |
| |
|
|
| 5 Year Review TF |
| |
| | | 6935 | | Reapproval of SEMI T19 - Specification for Device Marking | |
| | | TFOF | | 5 Year Review TF | |
|
|
| Blockchain Task Force |
| |
| | | 6910 | | New Standard: Specification of Blockchain for Semiconductor supply chain Traceability | |
| | | TFOF | | Blockchain Task Force | |
|
|
| Japan Equipment & Materials Traceability liaison Task Force |
| |
| | | TFOF | | Japan Equipment & Materials Traceability liaison Task Force | |
|
|
| Japan Single Device Traceability liaison Task Force |
| |
| | | TFOF | | Japan Single Device Traceability liaison Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force |
| |
| | | 6674 | | New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force | |
|
|
| North America |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 7060 | | Reapproval of SEMI T17-0706 (Reapproved 0718), Specification of Substrate Traceability | |
| | | 7061 | | Reapproval of SEMI T10-0701 (Reapproved 0618), Test Method for the Assessment of 2D Data Matrix Direct Mark Quality | |
| | | 7062 | | Reapproval of SEMI T18-1106 (Reapproved 0718), Specification of Parts and Components Traceability | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| Equipment and Materials Traceability Task Force |
| |
| | | 6449 | | New Standard: Specification for Equipment and Materials Part Traceability | |
| | | TFOF | | Equipment and Materials Traceability Task Force | |
|
|
| Single Device Traceability Task Force |
| |
| | | 6504 | | New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain | |
| | | TFOF | | Single Device Traceability Task Force | |