 | | | | | | |
|---|
 | 3D Packaging and Integration |
| |
|
|
| Japan |
| |
|
|
| 3D Packaging & Integration 5 Year Review Task Force |
| |
| | | 6496 | | Line Item Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” | |
| | | 6703 | | Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” | |
| | | TFOF | | 3D Packaging & Integration 5 Year Review Task Force | |
|
|
| 3DS IC Bonded Layer Inspection Metrology TF |
| |
| | | TFOF | | 3DS IC Bonded Layer Inspection Metrology TF | |
|
|
| Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging |
| |
| | | 6706 | | New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials | |
| | | 6707 | | New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6708 | | New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6709 | | New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6710 | | New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials | |
| | | 6711 | | New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | 6712 | | New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials | |
| | | TFOF | | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging | |
|
|
| JA 450mm Assembly and Test Die Preparation Task Force |
| |
| | | 6497 | | Line Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process" | |
| | | TFOF | | JA 450mm Assembly and Test Die Preparation Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier Task Force |
| |
| | | 6590 | | New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier Task Force | |
|
|
| Thin Chip Handling Task Force |
| |
| | | TFOF | | Thin Chip Handling Task Force | |
|
|
| North America |
| |
|
|
| NA 3D Packaging and Integration Committee |
| |
| | | 6810 | | Reapproval of SEMI 3D13-0715, Guide for Measuring Voids in Bonded Wafer Stacks | |
| | | 6811 | | Reapproval of SEMI 3D2-0216, Specification for Glass Carrier Wafers for 3DS-IC Applications | |
| | | 6812 | | Reapproval of SEMI 3D4-0915, Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks | |
|
|
| 3DP&I Bonded Wafer Stacks Task Force |
| |
| | | 6641 | | Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process | |
| | | TFOF | | 3DP&I Bonded Wafer Stacks Task Force | |
|
|
| 3DP&I Inspection and Metrology Task Force |
| |
| | | TFOF | | 3DP&I Inspection and Metrology Task Force | |
|
|
| Panel Level Packaging (PLP) Panel Task Force |
| |
| | | 6591 | | Revision to SEMI 3D20-0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Panel Task Force | |
|
|
| Taiwan |
| |
|
|
| 3DP&I Middle-End Process Task Force |
| |
| | | 5800 | | New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process | |
| | | 6405 | | Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS | |
| | | 6411 | | Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro-bump Processes for Frontside Through Silicon Via (TSV) Integration | |
| | | TFOF | | 3DP&I Middle-End Process Task Force | |
|
|
| 3DP&I Testing Task Force |
| |
| | | TFOF | | 3DP&I Testing Task Force | |
| Automated Test Equipment |
| |
|
|
| North America |
| |
|
|
| NA ATE 5-Year Review |
| |
| | | TFOF | | NA ATE 5-Year Review | |
|
|
| Rich Interactive Test Database (RITdb) |
| |
| | | 6518 | | New Standard: Specification for Rich Interactive Test Database (RITdb) | |
| | | TFOF | | Rich Interactive Test Database (RITdb) | |
|
|
| Standard Test Data Format (STDF) Task Force |
| |
| | | TFOF | | Standard Test Data Format (STDF) Task Force | |
|
|
| Test Cell Communications |
| |
| | | TFOF | | Test Cell Communications | |
|
|
| Tester Event Messaging for Semiconductors (TEMS) |
| |
| | | 6580 | | New Standard: Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) | |
| | | 6581 | | New Subordinate Standard: Specification for HTTP JSON Protocol Implementation for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) | |
| | | TFOF | | Tester Event Messaging for Semiconductors (TEMS) | |
| Automation Technology |
| |
|
|
| Europe |
| |
|
|
| Equipment Interface Specification (EIS) |
| |
| | | 5151 | | New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES) | |
| | | 5154 | | New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: 4804 "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM") | |
| | | 5339 | | Specification for Single Material Tracking and Tracing For Crystalline Silicon PV | |
| | | 5566 | | Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation. | |
| | | TFOF | | Equipment Interface Specification (EIS) | |
|
|
| PV Wafer Traceability Task Force |
| |
| | | TFOF | | PV Wafer Traceability Task Force | |
|
|
| Global |
| |
|
|
| Equipment Interface Specification (EIS) |
| |
| | | TFOF | | Equipment Interface Specification (EIS) | |
|
|
| Japan |
| |
|
|
| A1 TF |
| |
| | | 6692 | | Line Item Revision to SEMI A1-1020 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | TFOF | | A1 TF | |
|
|
| F-GEM TF |
| |
| | | 6673 | | New Standard: SPECIFICATION FOR FACTORY OPERATION EXTENSION FOR SEMI A2 SMASH (SMASH-FOX) | |
| | | 6749 | | Line Item Revision to SEMI Ax-mmyy (Doc. #6673) Specification for Factory Operation Extension for SEMI A2 SMASH (SMASH-FOX) | |
| | | TFOF | | F-GEM TF | |
|
|
| Flow Oriented Manufacturing Line Operation System (FOMLOS) |
| |
| | | TFOF | | Flow Oriented Manufacturing Line Operation System (FOMLOS) | |
|
|
| SMT TF |
| |
| | | 6672 | | Line Item Revision to SEMI A2-mmyy (Doc. #6630) Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | 6725 | | Line Item Revision to SEMI A2-1020 (or A2-mmyy (Doc. #6672) if published) Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | TFOF | | SMT TF | |
|
|
| Taiwan |
| |
|
|
| Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force |
| |
| | | 6263 | | New Standard: SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI) | |
| | | 6704 | | Line Item Revisions to SEMI A3-0819 SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI) | |
| | | TFOF | | Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force | |
| Compound Semiconductor Materials |
| |
|
|
| China |
| |
|
|
| SiC Epitaxial Wafer Task Force |
| |
| | | 6693 | | New Standard: Specification for 4H-SiC Homo-Epitaxial Wafer | |
| | | TFOF | | SiC Epitaxial Wafer Task Force | |
|
|
| Silicon Carbide Substrate Task Force |
| |
| | | 6767 | | New Standard: Test Method for Flatness of Silicon Carbide Wafers by Optical Interference | |
| | | 6768 | | New Standard: Test Method for Micropipe Density of Silicon Carbide Wafer by Laser Reflection | |
| | | 6769 | | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic | |
| | | TFOF | | Silicon Carbide Substrate Task Force | |
|
|
| Europe |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 6779 | | Reapproval of SEMI M64 - Test Method for the EL2 Deep Donor Concentration in Semi-Insulating (SI) Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy | |
| | | 6780 | | Line Item Revision of SEMI M87 - Test Method for Contactless Resistivity Measurement of Semi-Insulating Semiconductors | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| EU Compound Semiconductor Materials Committee |
| |
| | | TFOF | | EU Compound Semiconductor Materials Committee | |
|
|
| Full-Wafer TSD Density Mapping of 4H-SiC Task Force |
| |
| | | 6717 | | New Standard: Test Method for quantifying TSDs in 4H-SiC Crystals | |
| | | TFOF | | Full-Wafer TSD Density Mapping of 4H-SiC Task Force | |
|
|
| SiC Material and Wafer Specification TF |
| |
| | | 6615 | | Revision of SEMI M55-0817, Specification for Polished Monocrystalline Silicon Carbide Wafers | |
| | | TFOF | | SiC Material and Wafer Specification TF | |
|
|
| Japan |
| |
|
|
| Silicon Carbide Substrate liaison TF |
| |
| | | TFOF | | Silicon Carbide Substrate liaison TF | |
|
|
| North America |
| |
|
|
| M86 Revision Task Force |
| |
| | | 6806 | | Revision of M86-0915 Specification for polished monocrystalline c-plane gallium nitride wafers | |
| | | TFOF | | M86 Revision Task Force | |
|
|
| M9 Revision Task Force |
| |
| | | 6805 | | Revision Of SEMI M9.5-0813, Specification For Round 100 mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications | |
| | | 6818 | | Withdrawal Of SEMI M9.1-0813 — Specification For Round 50.8 Mm Polished Monocrystalline Gallium Arsenide Wafers For Electronic Device Applications | |
| | | 6819 | | Withdrawal Of SEMI M9.6-0813 — Specification For Round 125 Mm Diameter Polished Monocrystalline Gallium Arsenide Wafers | |
| | | TFOF | | M9 Revision Task Force | |
| EH&S |
| |
|
|
| Japan |
| |
|
|
| GHG Emission Characterization Task Force |
| |
| | | TFOF | | GHG Emission Characterization Task Force | |
|
|
| Japan Environmental Health and Safety Committee |
| |
| | | 6776 | | Reapproval of SEMI S19-0311 (Reapproved 0816): Safety Guideline for Training of Manufacturing Equipment Installation, Maintenance and Service Personnel | |
| | | 6777 | | Reapproval of SEMI S26-0516: Environmental, Health, and Safety Guideline for FPD Manufacturing System | |
| | | TFOF | | Japan Environmental Health and Safety Committee | |
|
|
| S13 Revision Task Force |
| |
| | | TFOF | | S13 Revision Task Force | |
|
|
| S17 Revision Task Force |
| |
| | | TFOF | | S17 Revision Task Force | |
|
|
| S18 Revision Task Force |
| |
| | | TFOF | | S18 Revision Task Force | |
|
|
| SDRCM(S Documents REG-PG-SM Conformance Maintenance) TF |
| |
| | | TFOF | | SDRCM(S Documents REG-PG-SM Conformance Maintenance) TF | |
|
|
| Seismic Protection Task Force |
| |
| | | TFOF | | Seismic Protection Task Force | |
|
|
| Japan and North America |
| |
|
|
| Global Seismic Protection TF |
| |
| | | TFOF | | Global Seismic Protection TF | |
|
|
| S23 Revision Global Task Force |
| |
| | | TFOF | | S23 Revision Global Task Force | |
|
|
| North America |
| |
|
|
| Control of Hazardous Energy (CoHE) Task Force |
| |
| | | TFOF | | Control of Hazardous Energy (CoHE) Task Force | |
|
|
| Energetic Materials EHS Task Force |
| |
| | | TFOF | | Energetic Materials EHS Task Force | |
|
|
| Ergonomics Task Force |
| |
| | | 5996 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment | |
| | | 6309 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | TFOF | | Ergonomics Task Force | |
|
|
| Fire Protection Task Force |
| |
| | | 6595 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
| |
| | | 6784 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
| |
| | | TFOF | | Fire Protection Task Force | |
|
|
| Manufacturing Equipment Safety Subcommittee |
| |
| | | TFOF | | Manufacturing Equipment Safety Subcommittee | |
|
|
| NA Environmental Health and Safety Committee |
| |
| | | TFOF | | NA Environmental Health and Safety Committee | |
|
|
| Restriction of Materials Task Force |
| |
| | | 6439 | | New Standard: Specification for PFOA Restriction in Fluoromaterials | |
| | | TFOF | | Restriction of Materials Task Force | |
|
|
| S1 Revision Task Force |
| |
| | | 6783 | | Line Item Revisions to SEMI S1-1015 Safety Guideline for Equipment Safety Labels | |
| | | TFOF | | S1 Revision Task Force | |
|
|
| S10 Task Force |
| |
| | | 6049 | | Line-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation Process | |
| | | TFOF | | S10 Task Force | |
|
|
| S12 (Equipment Decon) Review Task Force |
| |
| | | 6782 | | Line Item Revision of SEMI S12 - Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination | |
| | | TFOF | | S12 (Equipment Decon) Review Task Force | |
|
|
| S2 Chemical Exposure Task Force |
| |
| | | 6171 | | Line Item revision for chemical exposure improvements to SEMI S2 | |
| | | TFOF | | S2 Chemical Exposure Task Force | |
|
|
| S2 Korean High Pressure Gas Safety Task Force |
| |
| | | 6354 | | Line Item Revision to SEMI S2-1016b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
| |
| | | TFOF | | S2 Korean High Pressure Gas Safety Task Force | |
|
|
| S2 Mechanical Design Task Force |
| |
| | | 6696 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Delayed Revision on “date of shipment” currently in Sections 18.6.3 and 18.7.5) | |
| | | TFOF | | S2 Mechanical Design Task Force | |
|
|
| S2 Pressure Guidelines Task Force |
| |
| | | 6651 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Addition of Pressure section) | |
| | | TFOF | | S2 Pressure Guidelines Task Force | |
|
|
| S22 Task Force |
| |
| | | TFOF | | S22 Task Force | |
|
|
| S23 Revision Global Task Force |
| |
| | | 6515 | | Line Item Revision of SEMI S23-1216 - Guide for Energy, Utilities, and Materials Use Efficiency of Semiconductor Manufacturing Equipment | |
|
|
| S3 Revision Task Force |
| |
| | | TFOF | | S3 Revision Task Force | |
|
|
| S5 (FLD) Review Task Force |
| |
| | | 6781 | | Line Item Revision of SEMI S5 - Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gases | |
| | | TFOF | | S5 (FLD) Review Task Force | |
|
|
| S6 Revision Task Force |
| |
| | | TFOF | | S6 Revision Task Force | |
|
|
| S7 Task Force |
| |
| | | TFOF | | S7 Task Force | |
|
|
| Seismic Liaison Task Force |
| |
| | | 6372 | | Line Item Revision SEMI S2-1016b Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revision to Delayed Revision on Seismic) | |
| | | TFOF | | Seismic Liaison Task Force | |
|
|
| Taiwan |
| |
|
|
| Equipment Safety Task Force |
| |
| | | TFOF | | Equipment Safety Task Force | |
|
|
| Seismic Task Force |
| |
| | | TFOF | | Seismic Task Force | |
| Facilities |
| |
|
|
| Japan |
| |
|
|
| 5-year-review TF |
| |
| | | TFOF | | 5-year-review TF | |
|
|
| F1 Revision TF |
| |
| | | TFOF | | F1 Revision TF | |
|
|
| Gas Box Components Joint Task Force |
| |
| | | TFOF | | Gas Box Components Joint Task Force | |
|
|
| Japan Gases and Facilities Committee |
| |
| | | TFOF | | Japan Gases and Facilities Committee | |
|
|
| Korea |
| |
|
|
| Equipment Cleanness Task Force |
| |
| | | TFOF | | Equipment Cleanness Task Force | |
|
|
| North America |
| |
|
|
| Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force |
| |
| | | 6628 | | New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling | |
| | | TFOF | | Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force | |
|
|
| NA Facilities Committee |
| |
| | | 6771 | | Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation | |
| | | 6772 | | Reapproval of SEMI E70-1213, Guide for Tool Accommodation Process | |
| | | 6773 | | Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services | |
| | | 6774 | | Reapproval of SEMI F49-0200 (Reapproved 1213), Guide for Semiconductor Factory Systems Voltage Sag Immunity | |
| | | 6775 | | Reapproval of SEMI F50-0200 (Reapproved 1213), Guide for Electric Utility Voltage Sag Performance for Semiconductor Factories | |
| | | TFOF | | NA Facilities Committee | |
|
|
| Power Grid Harmonics Task Force |
| |
| | | TFOF | | Power Grid Harmonics Task Force | |
|
|
| SEMI F51 Revision Task Force |
| |
| | | TFOF | | SEMI F51 Revision Task Force | |
|
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | | Voltage Sag Immunity Task Force | |
| Flat Panel Display (FPD) - Materials & Components |
| |
|
|
| Japan |
| |
|
|
| Flexible Display Task Force |
| |
| | | 6547 | | New Standard: Test method for Measurement of Water Vapor Transmission Rate for High Gas Barrier Plastic Film in a Short Time | |
| | | 6694 | | Line Item Revision to SEMI D74-0116 “Guide for Measuring Dimensions of Plastic Films/Substrates” | |
| | | TFOF | | Flexible Display Task Force | |
|
|
| FPD Color Filter Task Force |
| |
| | | TFOF | | FPD Color Filter Task Force | |
|
|
| FPD Mask Task Force |
| |
| | | 6584 | | Reapproval to SEMI D20-0706 (Reapproved 0815): “Terminology for FPD Mask Defect” | |
| | | 6585 | | Reapproval to SEMI D21-0706 (Reapproved 0815): “Terminology for FPD Mask Pattern Accuracy” | |
| | | 6633 | | Revision to SEMI D42-0308 (Reapproved 0815): “Specification for Ultra Large Size Mask Substrate Case” | |
| | | 6634 | | Revision to SEMI D53-0708 (Reapproved 0815): “Specification for Liquid Crystal Display (LCD) Pellicles” with title change to “Specification for Flat Panel Display (FPD) Pellicles” | |
| | | TFOF | | FPD Mask Task Force | |
|
|
| FPD Materials & Components Maintenance Task Force |
| |
| | | 6675 | | Reapproval of SEMI D9-0303 (Reapproved 0515) “Terminology for FPD Substrates” | |
| | | 6745 | | Line Item Revision to SEMI D50-0316: “TEST METHOD FOR SURFACE HARDNESS OF FLAT PANEL DISPLAY (FPD) COMPONENTS”
| |
| | | TFOF | | FPD Materials & Components Maintenance Task Force | |
|
|
| Japan FPD Materials and Components Committee |
| |
| | | TFOF | | Japan FPD Materials and Components Committee | |
|
|
| Polarizing Film TF |
| |
| | | TFOF | | Polarizing Film TF | |
| Flat Panel Display (FPD) - Metrology |
| |
|
|
| Japan |
| |
|
|
| D31 Revision Task Force |
| |
| | | TFOF | | D31 Revision Task Force | |
|
|
| Korea |
| |
|
|
| Perceptual Image Quality |
| |
| | | 6614 | | New Standard, Test Method for Dimming Property for Flat Panel Displays | |
| | | 6659 | | Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays | |
| | | TFOF | | Perceptual Image Quality | |
|
|
| Perceptual Viewing Angle |
| |
| | | 5633 | | New Standard, Test Method for Viewing Angle Characteristic using Mixed Color on Visual Displays | |
| | | 6644 | | New Standard, Test Method for Viewing Angle of Flat Panel Displays | |
| | | TFOF | | Perceptual Viewing Angle | |
|
|
| Picture Quality Evaluation Task Force |
| |
| | | 6701 | | New Standard: Test Method for Warm-up Properties of Display Picture Quality | |
| | | TFOF | | Picture Quality Evaluation Task Force | |
|
|
| Transparent Display |
| |
| | | TFOF | | Transparent Display | |
|
|
| Taiwan |
| |
|
|
| Flexible Displays Task Force |
| |
| | | 5948 | | New Standard: Guide for Mechanical Stress Test Methods in the Measurement of Gas Barrier Performance for Flexible Display Components and Devices under a Normal Usage Condition | |
| | | 5949 | | New Standard: TEST METHOD FOR LOCAL AND OVERALL FLICKER OF FLEXIBLE DISPLAYS | |
| | | 6632 | | New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays | |
| | | TFOF | | Flexible Displays Task Force | |
|
|
| Maintenance Task Force |
| |
| | | TFOF | | Maintenance Task Force | |
|
|
| Transparent Display Task Force |
| |
| | | 6201 | | New Standard: Guide for Tone Reproduction Curves for Transparent Displays | |
| | | 6303 | | Reapproval of SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection | |
| | | 6737 | | New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays | |
| | | TFOF | | Transparent Display Task Force | |
| Flexible Hybrid Electronics (FHE) |
| |
|
|
| Taiwan |
| |
|
|
| FHE System for Wearable Task Force |
| |
| | | 6690 | | New Standard: Test Method of Line Impedance for Flexible Hybrid Electronics | |
| | | 6691 | | New Standard: Test Method of Sheet Resistance for Flexible Hybrid Electronics | |
| | | TFOF | | FHE System for Wearable Task Force | |
| Gases |
| |
|
|
| Europe |
| |
|
|
| Cleaning Gases |
| |
| | | 6148 | | Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing | |
| | | TFOF | | Cleaning Gases | |
|
|
| Permeation Tubes for Trace Moisture Calibration |
| |
| | | TFOF | | Permeation Tubes for Trace Moisture Calibration | |
|
|
| North America |
| |
|
|
| Filters and Purifiers Task Force |
| |
| | | TFOF | | Filters and Purifiers Task Force | |
|
|
| Gases Specification Task Force |
| |
| | | TFOF | | Gases Specification Task Force | |
|
|
| Heater Jacket Task Force |
| |
| | | TFOF | | Heater Jacket Task Force | |
|
|
| Mass Flow Controller Task Force |
| |
| | | 6643 | | New Standard: Specification for Location and Dimensions for Power Connectors and EtherCAT ports in Mass Flow Controllers and Mass Flow Meters | |
| | | TFOF | | Mass Flow Controller Task Force | |
|
|
| Materials of Construction of Gas Delivery Systems Task Force |
| |
| | | 6394 | | Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems | |
| | | 6510 | | Line Item Revision to SEMI F32-0211, Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves | |
| | | 6582 | | New Standard: Test Method for Measuring Pitting Resistance of Stainless Steel Component | |
| | | 6612 | | New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves | |
| | | TFOF | | Materials of Construction of Gas Delivery Systems Task Force | |
|
|
| NA Gases Committee |
| |
| | | 6747 | | Line Item to Replace Designation Letter from C to F for SEMI C88-0815, Specification for Dimensions of Sandwich Components for 1.125 Inch Type Surface Mount Gas Distribution Systems, SEMI C91-115, Test Method for Determination of Moisture Dry-Down Characteristics of Gas Delivery Components, and SEMI C92-0216, Test Method for Determining the Critical Pitting Temperature of Stainless Steel Surfaces Used in Corrosive Gas Systems by Use of a Ferric Chloride Solution | |
| | | 6813 | | Reapproval of SEMI F28-1103 (Reapproved 0815), Test Method for Measuring Particle Generation from Process Panels | |
| | | 6814 | | Reapproval of SEMI F43-0308 (Reapproved 0613), Test Method for Determination of Particle Contribution by Point-of-Use Gas Purifiers and Gas Filters | |
| | | 6815 | | Reapproval of SEMI F59-0302 (Reapproved 0613), Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves | |
| | | 6816 | | Reapproval of SEMI F67-1101 (Reapproved 0713), Test Method for Determining Inert Gas Purifier Capacity | |
| | | 6817 | | Reapproval of SEMI F68-1101 (Reapproved 0713), Test Method for Determining Purifier Efficiency | |
|
|
| Pressure Measurement Task Force |
| |
| | | TFOF | | Pressure Measurement Task Force | |
|
|
| Surface Mount Sandwich Component Dimensions Task Force |
| |
| | | TFOF | | Surface Mount Sandwich Component Dimensions Task Force | |
| HB-LED |
| |
|
|
| China |
| |
|
|
| GaN based LED Epitaxial Wafer Task Force |
| |
| | | TFOF | | GaN based LED Epitaxial Wafer Task Force | |
|
|
| HB-LED Equipment Communication Interface |
| |
| | | 6589 | | Revision to SEMI HB4-0913 (Reapproved 0419), Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) | |
| | | TFOF | | HB-LED Equipment Communication Interface | |
|
|
| Patterned Sapphire Substrate Task Force |
| |
| | | 6371 | | New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate | |
| | | TFOF | | Patterned Sapphire Substrate Task Force | |
|
|
| Sapphire Single Crystal Ingot Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Ingot Task Force | |
|
|
| Sapphire Single Crystal Orientation Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Orientation Task Force | |
|
|
| Single Crystal Sapphire Task Force |
| |
| | | TFOF | | Single Crystal Sapphire Task Force | |
|
|
| North America |
| |
|
|
| HB-LED Assembly |
| |
| | | TFOF | | HB-LED Assembly | |
|
|
| HB-LED Equipment Automation Interfaces |
| |
| | | TFOF | | HB-LED Equipment Automation Interfaces | |
|
|
| HB-LED Equipment Communication Interfaces TF |
| |
| | | TFOF | | HB-LED Equipment Communication Interfaces TF | |
|
|
| HB-LED Source Materials TF |
| |
| | | 5984 | | New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing | |
| | | 5985 | | New Standard: Guide for Triethylgallium for HB-LED Manufacturing | |
| | | 5986 | | New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing | |
| | | 5987 | | New Standard: Guide for Trimethylgallium for HB-LED Manufacturing | |
| | | 5988 | | New Standard: Guide for Trimethylindium for HB-LED Manufacturing | |
| | | TFOF | | HB-LED Source Materials TF | |
|
|
| HB-LED Wafer TF |
| |
| | | TFOF | | HB-LED Wafer TF | |
|
|
| Impurities and Defects in HB-LED Sapphire Wafers |
| |
| | | TFOF | | Impurities and Defects in HB-LED Sapphire Wafers | |
|
|
| NA HB-LED Committee |
| |
| | | TFOF | | NA HB-LED Committee | |
|
|
| Patterned Sapphire Substrate (PSS) TF |
| |
| | | TFOF | | Patterned Sapphire Substrate (PSS) TF | |
|
|
| Test Methods TF |
| |
| | | TFOF | | Test Methods TF | |
| Information & Control |
| |
|
|
| Europe |
| |
|
|
| Process Control Solutions (PCS) |
| |
| | | TFOF | | Process Control Solutions (PCS) | |
|
|
| Japan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | TFOF | | GEM 300 Task Force | |
|
|
| JA I&C Maintenance Task Force |
| |
| | | 6770 | | Line-Item revision to E169-0615 Guide for Equipment Information System Security | |
| | | TFOF | | JA I&C Maintenance Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Korea |
| |
|
|
| Advanced Back-end Factory Integration TF |
| |
| | | TFOF | | Advanced Back-end Factory Integration TF | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 5832 | | New Standard, Specification for Equipment Generic Counter Model (EGCM) | |
| | | 6695 | | Line Item Revision to E87-0619, Specification for Carrier Management (CMS) and E87.1-0619, Specification for SECS-II Protocol for Carrier Management (CMS) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| North America |
| |
|
|
| Advanced Backend Factory Integration |
| |
| | | 6648 | |
Line Item Revision to E142-0211 (Reapproved 1016): Specification for Substrate Mapping | |
| | | 6682 | | Line Item Revision to E142-XXXX: Specification for Substrate Mapping, E142.1-1016 XML Schema for Substrate Mapping and E142.2-1016 SECS II Protocol for Substrate Mapping | |
| | | 6802 | | Line Item Revision to SEMI E5-0220: SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-II) | |
| | | 6804 | | Revision to Add a New Subordinate Standard: SPECIFICATION FOR SECS II PROTOCOL FOR SUBSTRATE MAPPING WITH ITEM TRANSFER to E142-0820: SPECIFICATION FOR SUBSTRATE MAPPING | |
| | | TFOF | | Advanced Backend Factory Integration | |
|
|
| Diagnostic Data Acquisition Task Force NA |
| |
| | | 6343 | | Line-Item Revision to SEMI E138: Specification for XML Semiconductor Common Components | |
| | | 6345 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for
Equipment Self Description (EqSD) to SEMI E125-0414, Specification for Equipment Self Description
(EqSD) | |
| | | 6346 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) to SEMI E132-1015, Specification for Equipment Client Authentication and Authorization | |
| | | 6347 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers of Data
Collection Management to SEMI E134-0414, Specification for Data Collection Management | |
| | | 6527 | | Revision to SEMI E125-0414, Specification for Equipment Self Description (EqSD) | |
| | | 6553 | | Revision to SEMI E134-0319 Specification for Data Collection Management | |
| | | 6571 | | Revision to SEMI E132-0419: Specification for Equipment Client Authentication and Authorization | |
| | | 6718 | | Revision to E125 SPECIFICATION FOR EQUIPMENT SELF DESCRIPTION (EqSD) | |
| | | 6719 | | Revision to SEMI E132-0419: Specification for Equipment Client Authentication and Authorization | |
| | | 6720 | | Revision to SEMI E134-0414: Specification for Data Collection Management | |
| | | 6721 | | Reapproval of SEMI E164 - Specification for EDA Common Metadata | |
| | | 6803 | | LINE ITEM REVISION TO SEMI E179-0320 SPECIFICATION FOR PROTOCOL BUFFERS COMMON COMPONENTS | |
| | | TFOF | | Diagnostic Data Acquisition Task Force NA | |
|
|
| Energy Saving Equipment Communication Task Force |
| |
| | | TFOF | | Energy Saving Equipment Communication Task Force | |
|
|
| Fab & Equipment Computer and Device Security (CDS) Task Force |
| |
| | | 6565 | | New Standard: Specification for Application Whitelisting | |
| | | 6566 | | New Standard: Specification for Malware Free Equipment Integration | |
| | | TFOF | | Fab & Equipment Computer and Device Security (CDS) Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6348 | | Revision to E30-0418: Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) | |
| | | 6552 | | Line Item Revision to SEMI E5-0219: Specification For SEMI Equipment Communications Standard 2 Message Content (SECS-II) | |
| | | 6572 | | Revision to SEMI E30-0418: Specification for The Generic Model for Communications and Control of Manufacturing Equipment (GEM) | |
| | | 6597 | | Line Item Revision to SEMI E173-0415E: Specification for XML SECS-II Message Notation (SMN) | |
| | | 6598 | | Line Item Revision to SEMI E37-0819: Specification For High Speed Secs Message Services (HSMS) Generic Services and E37.1-XXYY: Specification For High-Speed Secs Message Service Single Selected-Session Mode (HSMS-SS) | |
| | | 6647 | | Line Item Revision to Standard E116-0518 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING (EPT) and E116.1-0707 (Reapproved 0518) SPECIFICATION FOR SECS-II PROTOCOL FOR EQUIPMENT PERFORMANCE TRACKING (EPT) | |
| | | 6683 | | Line Item Revision to Standard SEMI E148-1109 (Reapproved 0614)
SPECIFICATION FOR TIME SYNCHRONIZATION AND DEFINITION OF
THE TS-CLOCK OBJECT | |
| | | 6723 | | Reapproval of SEMI E90.1-0312 - Specification for SECS-II Protocol Substrate Tracking | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| Graphical User Interfaces (GUI) Task Force |
| |
| | | 6124 | | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor Manufacturing Equipment | |
| | | 6743 | | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment | |
| | | TFOF | | Graphical User Interfaces (GUI) Task Force | |
|
|
| NA Information and Control Committee |
| |
| | | TFOF | | NA Information and Control Committee | |
|
|
| Process Control System NA |
| |
| | | TFOF | | Process Control System NA | |
|
|
| Process Control System NA Task Force |
| |
| | | 6649 | | Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS) | |
| | | 6722 | | Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices | |
| | | 6724 | | Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device | |
| | | TFOF | | Process Control System NA Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | 6174 | | Line Item Revision to SEMI E54.9, Specification for Sensor/Actuator Network Communication Specification for Modbus/TCP over TCP/IP
| |
| | | 6562 | | Line-item Revision to SEMI E54.23: Specification for Sensor/Actuator Network Communications for CC-Link IE Field Network | |
| | | 6563 | | Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device | |
| | | 6564 | | Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges | |
| | | 6744 | | Line Item Revision to SEMI E54.4-0316, Specification for Sensor/Actuator Network Communications for DeviceNet | |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Taiwan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | 6147 | | New Standard: Specification of Backend Die Traceability | |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Equipment Edge Computing Data Governance (EECDG) |
| |
| | | TFOF | | Equipment Edge Computing Data Governance (EECDG) | |
|
|
| Equipment Information Integration Task Force |
| |
| | | TFOF | | Equipment Information Integration Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | 6506 | | New Standard: Specification for Cybersecurity of Fab Equipment | |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
| Liquid Chemicals |
| |
|
|
| Europe |
| |
|
|
| EU Gases and Liquid Chemicals Committee |
| |
| | | TFOF | | EU Gases and Liquid Chemicals Committee | |
|
|
| Precursor Specifications Task Force |
| |
| | | TFOF | | Precursor Specifications Task Force | |
|
|
| Solvents in Advanced Processes |
| |
| | | TFOF | | Solvents in Advanced Processes | |
|
|
| Japan |
| |
|
|
| Diaphragm Valves Task Force |
| |
| | | TFOF | | Diaphragm Valves Task Force | |
|
|
| Liquid-Borne Particle Counter Task Force |
| |
| | | TFOF | | Liquid-Borne Particle Counter Task Force | |
|
|
| Liquid Filter Task Force |
| |
| | | TFOF | | Liquid Filter Task Force | |
|
|
| Trace Metal Analysis for High Pure IPA Task Force |
| |
| | | TFOF | | Trace Metal Analysis for High Pure IPA Task Force | |
|
|
| Welding Fitting Task Force |
| |
| | | TFOF | | Welding Fitting Task Force | |
|
|
| North America |
| |
|
|
| Chemical Analytical Methods Task Force |
| |
| | | 6315 | | Line Item Revision to SEMI C30-0218, Specification for Hydrogen Peroxide | |
| | | 6388 | | Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid | |
| | | 6451 | | Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals | |
| | | 6465 | | Line Item Revision to SEMI C36-1213, Specifications for Phosphoric Acid, to correct nonconforming title to: Specification for Phosphoric Acid | |
| | | 6509 | | Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change | |
| | | 6727 | | Line Item Revision to SEMI C96-0618: Test Method for Determining Density of Chemical Mechanical Polish (CMP) Slurries, with title change to: Test Method for Determining Density of Chemical Mechanical Planarization (CMP) Slurries | |
| | | 6728 | | Line Item Revision to SEMI C99-0320: Test Method for Determining Conductivity of Chemical Mechanical Polish (CMP) Slurries and Related Chemicals, with title change to: Test Method for Determining Conductivity of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals | |
| | | TFOF | | Chemical Analytical Methods Task Force | |
|
|
| Chemical Mechanical Planarization Consumables (CMP-C) Task Force |
| |
| | | 6677 | | New Standard: Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks used in Semiconductor Manufacturing | |
| | | 6748 | | New Standard: Guide for Reporting Performance Parameters of the Polymer Windows for Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing | |
| | | TFOF | | Chemical Mechanical Planarization Consumables (CMP-C) Task Force | |
|
|
| High Purity Liquid Assemblies & Systems Task Force |
| |
| | | TFOF | | High Purity Liquid Assemblies & Systems Task Force | |
|
|
| High Purity Polymer Materials and Components Task Force |
| |
| | | 6601 | | New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems | |
| | | 6713 | | Line Item Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems | |
| | | 6729 | | Line Item Revision to SEMI F57-0120, Specification for Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems | |
| | | TFOF | | High Purity Polymer Materials and Components Task Force | |
|
|
| Ultra Pure Water Task Force |
| |
| | | TFOF | | Ultra Pure Water Task Force | |
|
|
| Water Management Task Force |
| |
| | | 6600 | | New Standard: Guide for Drain Segregation for Semiconductor Manufacturing Tools to Support Site Water Reuse | |
| | | 6714 | | Line Item Revision to SEMI C93-0620, Guide for Determining the Quality of Ion Exchange Resin Used in Polish Applications of Ultrapure Water System | |
| | | 6715 | | New Standard: Guide for Measuring Particle Precursors in Ultrapure Water | |
| | | 6716 | | Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems | |
| | | TFOF | | Water Management Task Force | |
| MEMS / NEMS |
| |
|
|
| International |
| |
|
|
| Terminology |
| |
| | | TFOF | | Terminology | |
|
|
| North America |
| |
|
|
| MEMS and Miniaturized Gas Sensing Task Force |
| |
| | | 6746 | | New Standard: Guide for Critical Parameters of Gas Sensors | |
| | | TFOF | | MEMS and Miniaturized Gas Sensing Task Force | |
|
|
| MEMS Material Characterization Task Force |
| |
| | | TFOF | | MEMS Material Characterization Task Force | |
|
|
| MEMS Microfluidics Task Force |
| |
| | | TFOF | | MEMS Microfluidics Task Force | |
|
|
| MEMS Packaging Task Force |
| |
| | | TFOF | | MEMS Packaging Task Force | |
|
|
| MEMS Reliability Task Force |
| |
| | | TFOF | | MEMS Reliability Task Force | |
|
|
| MEMS Substrate Task Force |
| |
| | | TFOF | | MEMS Substrate Task Force | |
|
|
| NA MEMS/NEMS Committee |
| |
| | | TFOF | | NA MEMS/NEMS Committee | |
|
|
| Wafer Bond Task Force |
| |
| | | TFOF | | Wafer Bond Task Force | |
| Metrics |
| |
|
|
| Japan |
| |
|
|
| Cycle Time Metrics Task Force |
| |
| | | TFOF | | Cycle Time Metrics Task Force | |
|
|
| Japan RF Measurement liaison Task Force |
| |
| | | 6550 | | Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | Japan RF Measurement liaison Task Force | |
|
|
| North America |
| |
|
|
| Critical Chamber Components (CCC) Test Methods Task Force |
| |
| | | 6473 | | New Subordinate Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Showerheads Used in Semiconductor Wafer Processing | |
| | | 6599 | | Line Item Revision to SEMI E180-1219, Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing. | |
| | | TFOF | | Critical Chamber Components (CCC) Test Methods Task Force | |
|
|
| EMC Task Force |
| |
| | | TFOF | | EMC Task Force | |
|
|
| Equipment Cost of Ownership Task Force |
| |
| | | TFOF | | Equipment Cost of Ownership Task Force | |
|
|
| Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |
| |
| | | 6578 | | Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6579 | | Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity | |
| | | 6678 | | Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6679 | | Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity | |
| | | 6785 | | LINE ITEM REVISIONS TO SEMI E10-0221: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6786 | | LINE ITEM REVISIONS TO SEMI E79-0221: Specification for Definition and Measurement of Equipment Productivity | |
| | | TFOF | | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force | |
|
|
| Equipment Training and Documentation Task Force |
| |
| | | TFOF | | Equipment Training and Documentation Task Force | |
|
|
| ESD/ESC Task Force- N.A |
| |
| | | 6467 | | Line-Item Revision to SEMI E129-0912, Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility | |
| | | 6468 | | Line-Item Revision to SEMI E78-0912, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment | |
| | | TFOF | | ESD/ESC Task Force- N.A | |
|
|
| North America Metrics Technical Committee |
| |
| | | TFOF | | North America Metrics Technical Committee | |
|
|
| RF Measurements Task Force |
| |
| | | 6676 | | Revision to SEMI E136-1104 (Reapproved 0512)
TEST METHOD FOR DETERMINING THE OUTPUT POWER OF RF
GENERATORS USED IN SEMICONDUCTOR PROCESSING
EQUIPMENT RF POWER DELIVERY SYSTEMS | |
| | | TFOF | | RF Measurements Task Force | |
| Micropatterning |
| |
|
|
| North America |
| |
|
|
| Mask Orders Task Force |
| |
| | | TFOF | | Mask Orders Task Force | |
|
|
| Micropatterning Committee |
| |
| | | 6807 | | Reapproval of SEMI P5-0416 Specification for Pellicles | |
| | | 6808 | | Reapproval of SEMI P40-1109 (Reapproved 0416) Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks | |
| | | 6809 | | Reapproval of SEMI P48-1110 (Reapproved 0416) Specification of Fiducial Marks for EUV Mask Blank | |
|
|
| NA Microlithography Committee for 5-Year Review |
| |
| | | TFOF | | NA Microlithography Committee for 5-Year Review | |
|
|
| P47 Revision Task Force |
| |
| | | 6516 | |
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
| |
| | | TFOF | | P47 Revision Task Force | |
|
|
| Patterning Metrology Task Force |
| |
| | | 6220 | | Line Item revision to SEMI P19-92 (Reapproved 0707)
SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE | |
| | | 6221 | | Revision to SEMI P18-92 (Reapproved 1104)
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS | |
| | | TFOF | | Patterning Metrology Task Force | |
| Photovoltaic |
| |
|
|
| China |
| |
|
|
| Building Integrated Photovoltaic (BIPV) Task Force |
| |
| | | 6542 | | New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building | |
| | | 6700 | | New Standard: Test Method of Wind Uplift Resistance for Roof-Top Building Integrated Photovoltaics (BIPV) | |
| | | TFOF | | Building Integrated Photovoltaic (BIPV) Task Force | |
|
|
| Crystalline Silicon Solar Cell Task Force |
| |
| | | 6670 | | Revision to SEMI PV58-0115, Specification for Aluminum Paste, Used in Back Surface Field of Crystalline Silicon Solar Cells | |
| | | TFOF | | Crystalline Silicon Solar Cell Task Force | |
|
|
| PV Equipment Task Force |
| |
| | | 5983 | | New Standard: Test method for In-Line Sheet Resistance Inspection Using the Junction Photo-Voltage Method
| |
| | | 6667 | | Reapproval of SEMI PV68-0815, Test Method for the Wire Tension of Multi-Wire Saws | |
| | | TFOF | | PV Equipment Task Force | |
|
|
| PV Module Task Force |
| |
| | | 6113 | | New Standard: Test Method for Abrasion Resistance of the Polymer Backsheet of Crystalline Silicon Solar Modules | |
| | | 6610 | | Revision to SEMI PV86-1018, Specification for Crystalline Silicon Photovoltaic Module Dimensions | |
| | | TFOF | | PV Module Task Force | |
|
|
| Thin Film PV Module Task Force |
| |
| | | 6401 | | New Standard: Test Method for Indentation Force of Flexible Thin Film PV Modules | |
| | | 6402 | | New Standard: Test Method for Vibration Durability of Flexible Thin Film PV Module | |
| | | 6697 | |
Withdrawal of SEMI PV73-0216, Test Method for Thin-Film Silicon Photovoltaic (PV) Modules Light Soaking
| |
| | | 6778 | | Reapproval to SEMI PV78-0817, Test Method for Bending Property of Flexible Thin Film Photovoltaic (PV) Modules | |
| | | TFOF | | Thin Film PV Module Task Force | |
|
|
| Taiwan |
| |
|
|
| Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force |
| |
| | | 6297 | | New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC) | |
| | | 6539 | | New Standard :Specification of reference device for indoor lighting simulator | |
| | | 6540 | | New Standard :Test Method for Durability of Flexible emerging PV | |
| | | 6730 | | Revision of SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV57 - Test Method for Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC) | |
| | | 6731 | | Revision of SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV69 - Test Method for Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC)and Perovskite Solar Cell(PSC) | |
| | | 6732 | | Revision of SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) With Title Change To SEMI PV76 - Test Method for Durability of Low Light Intensity Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC) and Perovskite Solar Cell(PSC) | |
| | | 6733 | | Revision of SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic With Title Change To SEMI PV80 - Specification of Indoor Lighting Simulator Requirements for Emerging Photovoltaic and Perovskite Solar Cell(PSC) | |
| | | 6734 | | Revision of SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic With Title Change To SEMI PV89 - Test Method of Current-Voltage (I-V) Measurement in Indoor Lighting for Dye-Sensitized Solar Cell and Organic Photovoltaic and Perovskite Solar Cell(PSC) | |
| | | TFOF | | Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force | |
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|
| PV Reliability Test Method Task Force |
| |
| | | 6705 | | Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation | |
| | | TFOF | | PV Reliability Test Method Task Force | |
| Photovoltaic (PV) - Materials |
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|
| China |
| |
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|
| PV Silicon Raw Materials Task Force |
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| | | TFOF | | PV Silicon Raw Materials Task Force | |
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| PV Silicon Wafer Task Force |
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| | | TFOF | | PV Silicon Wafer Task Force | |
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| Europe |
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|
| PV Material Degradation Task Force |
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| | | TFOF | | PV Material Degradation Task Force | |
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|
| PV Silicon Materials Task Force |
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| | | TFOF | | PV Silicon Materials Task Force | |
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|
| Japan |
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| Japan PV Materials Task Force |
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| | | TFOF | | Japan PV Materials Task Force | |
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| North America |
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|
| International PV Analytical Test Methods, Metrology, and Inspection Task Force |
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| | | 6642 | | Reapproval of SEMI PV13 Test Method for Contactless Excess-Charge-Carrier Recombination Lifetime Measurement in Silicon Wafers, Ingots, and Bricks Using an Eddy-Current Sensor | |
| | | TFOF | | International PV Analytical Test Methods, Metrology, and Inspection Task Force | |
| Physical Interfaces & Carriers |
| |
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|
| Europe |
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|
| EU Equipment Automation Committee (Physical Interfaces & Carriers) |
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| | | TFOF | | EU Equipment Automation Committee (Physical Interfaces & Carriers) | |
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|
| International |
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| Global PIC Maintenance Task Force |
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| | | TFOF | | Global PIC Maintenance Task Force | |
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|
| International 450 mm Physical Interfaces & Carriers |
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| | | TFOF | | International 450 mm Physical Interfaces & Carriers | |
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|
| International Reticle SMIF Pod and Load Port Interoperability Task Force |
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| | | TFOF | | International Reticle SMIF Pod and Load Port Interoperability Task Force | |
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|
| Japan |
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| 300mm Tape Frame PI&C Task Force |
| |
| | | 6688 | | New Standard - SPECIFICATION FOR 300mm TAPE FRAME FOUP LOAD PORT | |
| | | 6689 | | New Standard – SPECIFICATION FOR 300mm TAPE FRAME FOUP | |
| | | TFOF | | 300mm Tape Frame PI&C Task Force | |
|
|
| Japan Electron Microscopy Workflow liaison Task Force |
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| | | TFOF | | Japan Electron Microscopy Workflow liaison Task Force | |
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|
| Panel Level Packaging Panel FOUP Task Force |
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| | | 6618 | | New Standard - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING | |
| | | 6619 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 12 SLOTS | |
| | | 6620 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 6 SLOTS | |
| | | 6621 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 12 SLOTS | |
| | | 6622 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 6 SLOTS | |
| | | 6684 | | New Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING | |
| | | 6685 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 510MM-515MM PANEL SIZE | |
| | | 6686 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR 600MM-600MM PANEL SIZE | |
| | | 6750 | | Line Item Revision to SEMI E181-0321 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING, SEMI E181.1-0321 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS, SEMI E181.2-0321 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS, SEMI E181.3-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and SEMI E181.4-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS | |
| | | 6751 | | Line Item Revision to SEMI E181.3-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS | |
| | | 6752 | | Line Item Revision to SEMI E181.4-0321 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS | |
| | | TFOF | | Panel Level Packaging Panel FOUP Task Force | |
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|
| North America |
| |
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|
| Electron Microscopy Workflow Task Force |
| |
| | | 6592 | | New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows | |
| | | TFOF | | Electron Microscopy Workflow Task Force | |
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|
| NA 450mm Assembly Test Die Prep Task Force |
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| | | TFOF | | NA 450mm Assembly Test Die Prep Task Force | |
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| NA 450mm Shipping Box Task Force |
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| | | TFOF | | NA 450mm Shipping Box Task Force | |
| Silicon Wafer |
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|
|
| Europe |
| |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 6613 | | Reapproval of SEMI M20-0215, Practice for Establishing a Wafer Coordinate System | |
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|
| International Polished Wafers Task Force |
| |
| | | 6462 | | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
| |
|
|
| International |
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|
|
| International 450 mm Shipping Box |
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| | | TFOF | | International 450 mm Shipping Box | |
|
|
| International Advanced Wafer Geometry Task Force |
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| | | TFOF | | International Advanced Wafer Geometry Task Force | |
|
|
| International Annealed Si Wafer Task Force |
| |
| | | TFOF | | International Annealed Si Wafer Task Force | |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | TFOF | | International Automated Advanced Surface Inspection Task Force | |
|
|
| International Epitaxial Wafers Task Force |
| |
| | | TFOF | | International Epitaxial Wafers Task Force | |
|
|
| International Polished Wafers Task Force |
| |
| | | TFOF | | International Polished Wafers Task Force | |
|
|
| International SOI Wafers Task Force |
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| | | TFOF | | International SOI Wafers Task Force | |
|
|
| International Terminology Task Force |
| |
| | | TFOF | | International Terminology Task Force | |
|
|
| International Test Methods Task Force |
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| | | TFOF | | International Test Methods Task Force | |
|
|
| Japan |
| |
|
|
| International Advanced Wafer Geometry Task Force |
| |
| | | 6680 | | Reapproval of M77-1015 Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA | |
|
|
| International Test Methods Task Force |
| |
| | | 6570 | | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique | |
| | | 6681 | | Reapproval of MF1451 Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning | |
| | | 6687 | | Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity | |
|
|
| JA Shipping Box Task Force |
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| | | TFOF | | JA Shipping Box Task Force | |
|
|
| Japan AWG Task Force |
| |
| | | TFOF | | Japan AWG Task Force | |
|
|
| Japan TC Chapter of Global Technical Tommittee |
| |
| | | TFOF | | Japan TC Chapter of Global Technical Tommittee | |
|
|
| Japan Test Method Task Force |
| |
| | | 5772 | | Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | |
| | | 6526 | | New Standard Document: Test Method for Bulk Microdefect density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy after Preferential Etching
| |
| | | 6702 | | Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION | |
| | | TFOF | | Japan Test Method Task Force | |
|
|
| Test Method Task Force |
| |
| | | 5981 | | NEW STANDARD: TEST METHOD FOR RECOMBINATION LIFETIME OF THE EPILAYER OF THE SILICON EPITAXIAL WAFER (p/p+, n/n+) BY THE SHORT WAVELENGTH EXCITAION MICROWAVE PHOTOCONDUCTIVE DECAY METHOD | |
| | | TFOF | | Test Method Task Force | |
|
|
| North America |
| |
|
|
| International Annealed Si Wafer Task Force |
| |
| | | 6766 | | Reapproval of SEMI M57-0316 Specification for Silicon Annealed Wafers | |
|
|
| International Automated Advanced Surface Inspection Task Force |
| |
| | | 6363 | | Revision of SEMI M52-0214 GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 11 nm TECHNOLOGY GENERATIONS | |
|
|
| International Polished Wafers Task Force |
| |
| | | 6097 | | Line Item Revision to SEMI M1-0416 Specification for Polished Single Crystal Silicon Wafers, to address issues with primary fiducials across text, table and figures.
| |
| | | 6425 | | Line Item Revision to SEMI M1 Specification for Polished Single Crystal Silicon Wafers | |
|
|
| International SOI Wafers Task Force |
| |
| | | 6583 | | New Standard: Specification for SOI Wafers for RF Device Applications | |
|
|
| International Test Methods Task Force |
| |
| | | 6753 | | Reapproval of SEMI MF723-0307E (Reapproved 0412)E Practice for Conversion Between Resistivity and Dopant or Carrier Density for Boron-Doped, Phosphorous-Doped, and Arsenic-Doped Silicon | |
| | | 6754 | | Reapproval of SEMI MF674-0316 Practice for Preparing Silicon for Spreading Resistance Measurements | |
| | | 6755 | | Reapproval of SEMI MF533-0310 (Reapproved 0416) Test Method for Thickness and Thickness Variation of Silicon Wafers | |
| | | 6756 | | Reapproval of SEMI MF43-0316 Test Method for Resistivity of Semiconductor Materials | |
| | | 6757 | | Reapproval of SEMI MF42-0316 Test Method for Conductivity Type of Extrinsic Semiconducting Materials | |
| | | 6758 | | Reapproval of SEMI MF2139-1103 (Reapproved 0416) Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry | |
| | | 6759 | | Reapproval of SEMI MF1811-1116 Guide for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data | |
| | | 6760 | | Reapproval of SEMI MF1771-0416 Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique | |
| | | 6761 | | Reapproval of SEMI MF1535-1015 Test Method for Carrier Recombination Lifetime in Electronic-Grade Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance | |
| | | 6762 | | Reapproval of SEMI MF1529-1110 (Reapproved 1115) Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure | |
| | | 6763 | | Reapproval of SEMI MF1239-0305 (Reapproved 0416) Test Method for Oxygen Precipitation Characteristics of Silicon Wafers by Measurement of Interstitial Oxygen Reduction | |
| | | 6764 | | Reapproval of SEMI MF1153-1110 (Reapproved 1015) Test Method for Characterization of Metal-Oxide Silicon (MOS) Structures by Capacitance-Voltage Measurements | |
| | | 6765 | | Reapproval of SEMI MF1152-0316 Test Method for Dimensions of Notches on Silicon Wafers | |
| | | 6787 | | Reapproval of SEMI MF951 - Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers | |
| | | 6788 | | Reapproval of SEMI MF847 - Test Method for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques | |
| | | 6789 | | Reapproval of SEMI MF81 - Test Method for Measuring Radial Resistivity Variation on Silicon Wafers | |
| | | 6790 | | Reapproval of SEMI MF1809 - Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon | |
| | | 6791 | | Reapproval of SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers | |
| | | 6792 | | Reapproval of SEMI MF1725 - Practice for Analysis of Crystallographic Perfection of Silicon Ingots | |
| | | 6793 | | Reapproval of SEMI MF1726 - Practice for Analysis of Crystallographic Perfection of Silicon Wafers | |
| | | 6794 | | Reapproval of SEMI MF1727 - Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers | |
| | | 6795 | | Reapproval of SEMI MF1617 - Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry | |
| | | 6796 | | Reapproval of SEMI MF1618 - Practice for Determination of Uniformity of Thin Films on Silicon Wafers | |
| | | 6797 | | Reapproval of SEMI MF154 - Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces | |
| | | 6798 | | Reapproval of SEMI MF1389 - Test Method for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities | |
| | | 6799 | | Reapproval of SEMI M66 - Test Method to Extract Effective Work Function in Oxide and High-K Gate Stacks Using the MIS Flat Band Voltage-Insulator Thickness Technique | |
| | | 6800 | | Reapproval of SEMI M16 - Specification for Polycrystalline Silicon | |
| | | 6801 | | Reapproval of SEMI M17 - Guide for a Universal Wafer Grid | |
|
|
| Silicon Wafer Committee |
| |
| | | TFOF | | Silicon Wafer Committee | |
| Traceability |
| |
|
|
| Japan |
| |
|
|
| 5 Year Review TF |
| |
| | | TFOF | | 5 Year Review TF | |
|
|
| Blockchain Task Force |
| |
| | | TFOF | | Blockchain Task Force | |
|
|
| Japan Equipment & Materials Traceability liaison Task Force |
| |
| | | TFOF | | Japan Equipment & Materials Traceability liaison Task Force | |
|
|
| Japan Single Device Traceability liaison Task Force |
| |
| | | TFOF | | Japan Single Device Traceability liaison Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force |
| |
| | | 6674 | | New Standard: Specification of ID Marking for Glass Carrier Characteristics of Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force | |
|
|
| North America |
| |
|
|
| 5 Year Review Task Force |
| |
| | | 6604 | | Line Item Revision to SEMI T5-1214: Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers | |
| | | 6605 | | Reapproval to SEMI T11-0703 (Reapproved 1014): Specification for Marking of Hard Surface Reticle Substrates | |
| | | 6669 | | Revision of SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers | |
| | | 6698 | | Revision of SEMI M12-0706 (reapproved 0318), Specification for Serial Alphanumeric Marking of the Front Surface of Wafers, with title change to: Specification for Alphanumeric Marking of Wafers | |
| | | 6699 | | Revision of SEMI M13-0706 (reapproved 0318), Specification for Alphanumeric Marking of Silicon Wafers (Subject: adding alphanumeric marking at back surface in addition to front surface.) | |
| | | 6738 | | Reapproval of SEMI T16-0310 (Reapproved 0216) - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks | |
| | | 6739 | | Reapproval of SEMI T20-0710 (Reapproved 0416) - Specification for Authentication of Semiconductors and Related Products | |
| | | 6740 | | Reapproval of SEMI T8-1110 (Reapproved 0216) - Specification for Marking of Glass Flat Panel Display Substrates with a Two-Dimensional Matrix Code Symbol | |
| | | 6741 | | Reapproval of SEMI T9-1110 (Reapproved 0216) - Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol | |
| | | 6742 | | Reapproval of SEMI T7-0516 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol | |
| | | TFOF | | 5 Year Review Task Force | |
|
|
| Equipment and Materials Traceability Task Force |
| |
| | | 6448 | | New Standard – Specification for Equipment and Materials Labels | |
| | | 6449 | | New Standard – Specification for Equipment and Materials Part Traceability | |
| | | TFOF | | Equipment and Materials Traceability Task Force | |
|
|
| Single Device Traceability Task Force |
| |
| | | 6504 | | New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain | |
| | | TFOF | | Single Device Traceability Task Force | |