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 | 3D Packaging and Integration |
| |
|
|
| Japan |
| |
|
|
| 3D Packaging & Integration 5 Year Review Task Force |
| |
| | | 6496 | | Line Item Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength” | |
| | | 6640 | | Revision to SEMI G52-1115 “TEST METHOD FOR MEASUREMENT OF IONIC CONTAMINATION ON SEMICONDUCTOR LEADFRAMES” | |
| | | TFOF | | 3D Packaging & Integration 5 Year Review Task Force | |
|
|
| 3DS IC Bonded Layer Inspection Metrology TF |
| |
| | | TFOF | | 3DS IC Bonded Layer Inspection Metrology TF | |
|
|
| Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging |
| |
| | | TFOF | | Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging | |
|
|
| JA 450mm Assembly and Test Die Preparation Task Force |
| |
| | | 6497 | | Line Item Revision to SEMI G95-0314 "Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process" with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process" | |
| | | 6635 | | Reapproval of SEMI G74-0699 (Reapproved 0215) “Specification for Tape Frame for 300 mm Wafers” | |
| | | 6636 | | Reapproval of SEMI G77-0699 (Reapproved 0215) “Specification for Frame Cassette for 300 mm Wafers” | |
| | | 6637 | | Reapproval of SEMI G82-1115 “Specification for 300 mm Load Port for Frame Cassettes in Backend Process” | |
| | | 6638 | | Reapproval of SEMI G87-1108 (Reapproved 0215) “Specification for Plastic Tape Frame for 300 mm Wafer” | |
| | | 6639 | | Reapproval of SEMI G92-0315 “Specification for Tape Frame Cassette for 450 mm Wafer” | |
| | | TFOF | | JA 450mm Assembly and Test Die Preparation Task Force | |
|
|
| Panel Level Packaging (PLP) Glass Carrier Task Force |
| |
| | | 6590 | | New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier Task Force | |
|
|
| Thin Chip Handling Task Force |
| |
| | | TFOF | | Thin Chip Handling Task Force | |
|
|
| North America |
| |
|
|
| 3DP&I Bonded Wafer Stacks Task Force |
| |
| | | 6641 | | Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process | |
| | | TFOF | | 3DP&I Bonded Wafer Stacks Task Force | |
|
|
| 3DP&I Inspection and Metrology Task Force |
| |
| | | 6631 | | Line Item Revision to SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers | |
| | | TFOF | | 3DP&I Inspection and Metrology Task Force | |
|
|
| Panel Level Packaging (PLP) Panel Task Force |
| |
| | | 6591 | | Revision to SEMI 3D20-0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications | |
| | | TFOF | | Panel Level Packaging (PLP) Panel Task Force | |
|
|
| Taiwan |
| |
|
|
| 3DP&I Middle-End Process Task Force |
| |
| | | 5800 | | New Standard: Guide for Wafer Edge Trimming for 3DS-IC Process | |
| | | 6405 | | Reapproval of SEMI 3D7-0913, GUIDE FOR ALIGNMENT MARK FOR 3DS-IC PROCESS | |
| | | 6411 | | Line Item Revision of SEMI 3D6-0913 Guide for CMP and Micro-bump Processes for Frontside Through Silicon Via (TSV) Integration | |
| | | TFOF | | 3DP&I Middle-End Process Task Force | |
|
|
| 3DP&I Testing Task Force |
| |
| | | TFOF | | 3DP&I Testing Task Force | |
| Automated Test Equipment |
| |
|
|
| North America |
| |
|
|
| NA ATE 5-Year Review |
| |
| | | TFOF | | NA ATE 5-Year Review | |
|
|
| Rich Interactive Test Database (RITdb) |
| |
| | | 6518 | | New Standard: Specification for Rich Interactive Test Database (RITdb) | |
| | | TFOF | | Rich Interactive Test Database (RITdb) | |
|
|
| Tester Event Messaging for Semiconductors (TEMS) |
| |
| | | 6580 | | New Standard: Specification for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) | |
| | | 6581 | | New Subordinate Standard: Specification for HTTP JSON Protocol Implementation for the Automated Test Equipment Tester Event Messaging for Semiconductors (TEMS) | |
| | | TFOF | | Tester Event Messaging for Semiconductors (TEMS) | |
| Automation Technology |
| |
|
|
| Europe |
| |
|
|
| Equipment Interface Specification (EIS) |
| |
| | | 5151 | | New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES) | |
| | | 5154 | | New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: 4804 "SPECIFICATION FOR A HORIZONTAL COMMUNICATION BETWEEN EQUIPMENT FOR PHOTOVOLTAIC FABRICATION SYSTEM") | |
| | | 5339 | | Specification for Single Material Tracking and Tracing For Crystalline Silicon PV | |
| | | 5566 | | Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation. | |
| | | TFOF | | Equipment Interface Specification (EIS) | |
|
|
| PV Wafer Traceability Task Force |
| |
| | | TFOF | | PV Wafer Traceability Task Force | |
|
|
| Global |
| |
|
|
| Equipment Interface Specification (EIS) |
| |
| | | TFOF | | Equipment Interface Specification (EIS) | |
|
|
| Japan |
| |
|
|
| A1 TF |
| |
| | | 6624 | | Line Item Revision to SEMI A1-1019 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | 6625 | | Line Item Revision to SEMI A1.1-1019 SPECIFICATION FOR TCP/IP INTERFACE FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | 6629 | | Line Item Revision to SEMI A1-1019 SPECIFICATION FOR PRODUCTION EQUIPMENT SMART CONNECTION INTERFACE (PESCI) | |
| | | TFOF | | A1 TF | |
|
|
| F-GEM TF |
| |
| | | 6673 | | New Standard: SPECIFICATION FOR FACTORY OPERATION EXTENSION FOR SEMI A2 SMASH (SMASH-FOX) | |
| | | TFOF | | F-GEM TF | |
|
|
| Flow Oriented Manufacturing Line Operation System (FOMLOS) |
| |
| | | 6514 | | Revision to SEMI A1-mmyy (#6454) SPECIFICATION FOR HORIZONTAL COMMUNICATION (HC) BETWEEN EQUIPMENT FOR FACTORY AUTOMATION SYSTEM and A1.1-0918 SPECIFICATION FOR MEDIA INTERFACE FOR A HORIZONTAL COMMUNICATION (HC) BETWEEN EQUIPMENT | |
|
|
| SMT TF |
| |
| | | 6478 | | Line Item Revision to SEMI An-mmyy (Doc. 6396) Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | 6626 | | Line Item Revision to SEMI A2-1019 Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | 6630 | | Line Item Revision to SEMI A2-1019 Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | 6672 | | Line Item Revision to SEMI A2-mmyy (Doc. #6630) Specification for Surface Mount Assembler Smart Hookup (SMASH) | |
| | | TFOF | | SMT TF | |
|
|
| Taiwan |
| |
|
|
| Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force |
| |
| | | 6263 | | New Standard: SPECIFICATION FOR PRINTED CIRCUIT BOARD EQUIPMENT COMMUNICATION INTERFACES (PCBECI) | |
| | | TFOF | | Printed Circuit Board Equipment Communication Interface (PCBECI) Task Force | |
| Compound Semiconductor Materials |
| |
|
|
| Europe |
| |
|
|
| Contactless capacitive resistivity measurement of semi-insulating semiconductors |
| |
| | | TFOF | | Contactless capacitive resistivity measurement of semi-insulating semiconductors | |
|
|
| EU Compound Semiconductor Materials Committee |
| |
| | | TFOF | | EU Compound Semiconductor Materials Committee | |
|
|
| M54 Revision |
| |
| | | TFOF | | M54 Revision | |
|
|
| M82 Revision Task Force |
| |
| | | 6474 | | Revision to SEMI M82-0813: Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy | |
| | | TFOF | | M82 Revision Task Force | |
|
|
| M83 Revision Task Force |
| |
| | | 6546 | | Revision to SEMI M83-0913 Test Method For Determination Of Dislocation Etch Pit Density In Monocrystals Of III-V Compound Semiconductors | |
| | | TFOF | | M83 Revision Task Force | |
|
|
| SiC Material and Wafer Specification TF |
| |
| | | 6615 | | Revision of SEMI M55-0817, Specification for Polished Monocrystalline Silicon Carbide Wafers | |
| | | TFOF | | SiC Material and Wafer Specification TF | |
|
|
| North America |
| |
|
|
| Gallium Nitride (GaN) Task Force |
| |
| | | TFOF | | Gallium Nitride (GaN) Task Force | |
|
|
| NA Compound Semiconductor Materials Committee 5-Year Review TF |
| |
| | | TFOF | | NA Compound Semiconductor Materials Committee 5-Year Review TF | |
|
|
| Silicon Carbide Task Force |
| |
| | | TFOF | | Silicon Carbide Task Force | |
| EH&S |
| |
|
|
| Japan |
| |
|
|
| Japan Environmental Health and Safety Committee |
| |
| | | TFOF | | Japan Environmental Health and Safety Committee | |
|
|
| S18 Revision Task Force |
| |
| | | TFOF | | S18 Revision Task Force | |
|
|
| Japan and North America |
| |
|
|
| Global Seismic Protection TF |
| |
| | | TFOF | | Global Seismic Protection TF | |
|
|
| S23 Revision Global Task Force |
| |
| | | TFOF | | S23 Revision Global Task Force | |
|
|
| North America |
| |
|
|
| Control of Hazardous Energy (CoHE) Task Force |
| |
| | | 5957 | | Line Item Revision of S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. ( Re: Control of Hazardous Energy) | |
| | | TFOF | | Control of Hazardous Energy (CoHE) Task Force | |
|
|
| Energetic Materials EHS Task Force |
| |
| | | TFOF | | Energetic Materials EHS Task Force | |
|
|
| Ergonomics Task Force |
| |
| | | 5996 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment | |
| | | 6309 | | Line Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment | |
| | | TFOF | | Ergonomics Task Force | |
|
|
| Fire Protection Task Force |
| |
| | | 6594 | | Line item revision to SEMI S14-1016: Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing Equipment (Risk Ranking Criteria and Title) | |
| | | 6595 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)
| |
| | | TFOF | | Fire Protection Task Force | |
|
|
| Lifting Equipment Task Force |
| |
| | | TFOF | | Lifting Equipment Task Force | |
|
|
| Manufacturing Equipment Safety Subcommittee |
| |
| | | TFOF | | Manufacturing Equipment Safety Subcommittee | |
|
|
| NA Environmental Health and Safety Committee |
| |
| | | TFOF | | NA Environmental Health and Safety Committee | |
|
|
| Restriction of Materials Task Force |
| |
| | | 6439 | | New Standard: Specification for PFOA Restriction in Fluoromaterials | |
| | | TFOF | | Restriction of Materials Task Force | |
|
|
| S10 Task Force |
| |
| | | 6049 | | Line-Item Revision to SEMI S10-0815E Safety Guideline for Risk Assessment and Risk Evaluation Process | |
| | | TFOF | | S10 Task Force | |
|
|
| S2 Chemical Exposure Task Force |
| |
| | | 6171 | | Line Item revision for chemical exposure improvements to SEMI S2 | |
| | | TFOF | | S2 Chemical Exposure Task Force | |
|
|
| S2 Interlock and Safety Control Systems Reliability Selection |
| |
| | | TFOF | | S2 Interlock and Safety Control Systems Reliability Selection | |
|
|
| S2 Korean High Pressure Gas Safety Task Force |
| |
| | | 6354 | | Line Item Revision to SEMI S2-1016b, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
| |
| | | TFOF | | S2 Korean High Pressure Gas Safety Task Force | |
|
|
| S2 Ladders & Steps Task Force |
| |
| | | TFOF | | S2 Ladders & Steps Task Force | |
|
|
| S2 Mechanical Design Task Force |
| |
| | | 6593 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment ( Section 18 Mechanical Design) | |
| | | TFOF | | S2 Mechanical Design Task Force | |
|
|
| S2 Non-Ionizing Radiation Task Force |
| |
| | | TFOF | | S2 Non-Ionizing Radiation Task Force | |
|
|
| S2 Pressure Guidelines Task Force |
| |
| | | 6651 | | Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re: Addition of Pressure section) | |
| | | TFOF | | S2 Pressure Guidelines Task Force | |
|
|
| S22 Task Force |
| |
| | | TFOF | | S22 Task Force | |
|
|
| S23 Revision Global Task Force |
| |
| | | 6515 | | Line Item Revision of SEMI S23-1216 - Guide for Energy, Utilities, and Materials Use Efficiency of Semiconductor Manufacturing Equipment | |
|
|
| S3 Revision Task Force |
| |
| | | 6209 | | Revision of S3 with title change, Safety Guideline for Process Liquid Heating Systems | |
| | | TFOF | | S3 Revision Task Force | |
|
|
| S6 Revision Task Force |
| |
| | | 4975 | | Revision to SEMI S6, EHS Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment (Line item revisions for addressing gas detectors and other concerns) | |
| | | TFOF | | S6 Revision Task Force | |
|
|
| Seismic Liaison Task Force |
| |
| | | 6372 | | Line Item Revision SEMI S2-1016b Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Revision to Delayed Revision on Seismic) | |
| | | TFOF | | Seismic Liaison Task Force | |
|
|
| Taiwan |
| |
|
|
| Equipment Safety Task Force |
| |
| | | TFOF | | Equipment Safety Task Force | |
|
|
| Seismic Task Force |
| |
| | | TFOF | | Seismic Task Force | |
| Facilities |
| |
|
|
| Japan |
| |
|
|
| 5-year-review TF |
| |
| | | TFOF | | 5-year-review TF | |
|
|
| F1 Revision TF |
| |
| | | 6395 | | Revision to SEMI F1-0812, Specification for Leak Integrity of High Purity Gas Piping Systems and Components | |
| | | TFOF | | F1 Revision TF | |
|
|
| Korea |
| |
|
|
| Equipment Cleanness Task Force |
| |
| | | 4922 | | New Standard: Guide for Equipment Fan Filter Unit (EFFU) Performance | |
| | | TFOF | | Equipment Cleanness Task Force | |
|
|
| North America |
| |
|
|
| Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force |
| |
| | | 6628 | | New Standard: Guide for Facilities Data Package for Semiconductor Equipment Installation and Building Information Modeling | |
| | | TFOF | | Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force | |
|
|
| NA Facilities Committee |
| |
| | | TFOF | | NA Facilities Committee | |
|
|
| Power Grid Harmonics Task Force |
| |
| | | TFOF | | Power Grid Harmonics Task Force | |
|
|
| SEMI F51 Revision Task Force |
| |
| | | TFOF | | SEMI F51 Revision Task Force | |
|
|
| Voltage Sag Immunity Task Force |
| |
| | | TFOF | | Voltage Sag Immunity Task Force | |
| Flat Panel Display (FPD) - Materials & Components |
| |
|
|
| Japan |
| |
|
|
| Flexible Display Task Force |
| |
| | | 6547 | | New Standard: Test method for Measurement of Water Vapor Transmission Rate for High Gas Barrier Plastic Film in a Short Time | |
| | | TFOF | | Flexible Display Task Force | |
|
|
| FPD Mask Task Force |
| |
| | | 6584 | | Reapproval to SEMI D20-0706 (Reapproved 0815): “Terminology for FPD Mask Defect” | |
| | | 6585 | | Reapproval to SEMI D21-0706 (Reapproved 0815): “Terminology for FPD Mask Pattern Accuracy” | |
| | | 6633 | | Revision to SEMI D42-0308 (Reapproved 0815): “Specification for Ultra Large Size Mask Substrate Case” | |
| | | 6634 | | Revision to SEMI D53-0708 (Reapproved 0815): “Specification for Liquid Crystal Display (LCD) Pellicles” with title change to “Specification for Flat Panel Display (FPD) Pellicles” | |
| | | TFOF | | FPD Mask Task Force | |
|
|
| Japan FPD Materials and Components Committee |
| |
| | | TFOF | | Japan FPD Materials and Components Committee | |
|
|
| Polarizing Film TF |
| |
| | | TFOF | | Polarizing Film TF | |
| Flat Panel Display (FPD) - Metrology |
| |
|
|
| Korea |
| |
|
|
| Perceptual Image Quality |
| |
| | | 6586 | | New Standard: Test Method for Motion Blur of Laptop Displays | |
| | | 6614 | | New Standard, Test Method for Dimming Property for Flat Panel Displays | |
| | | 6659 | | Revision to SEMI D75-0118, Test Method for Color Reproduction and Perceptual Contrast of Displays | |
| | | TFOF | | Perceptual Image Quality | |
|
|
| Perceptual Viewing Angle |
| |
| | | 6351 | | New Standard, Test Method for Viewing Angle of Flat Panel Displays | |
| | | 6644 | | New Standard, Test Method for Viewing Angle of Flat Panel Displays | |
| | | TFOF | | Perceptual Viewing Angle | |
|
|
| Transparent Display |
| |
| | | 6222 | | New Standard, Test Method for Clarity Characteristic of Transparent Display | |
|
|
| Taiwan |
| |
|
|
| Flexible Displays Task Force |
| |
| | | 5949 | | New Standard: TEST METHOD FOR LOCAL AND OVERALL FLICKER OF FLEXIBLE DISPLAYS | |
| | | 6535 | | Line Item Revision of SEMI D72-1014, Test Methods for Color Properties of Electronic Paper Displays | |
| | | 6536 | | Line Item Revision of SEMI D73-1014, Test Methods for Positional Accuracy of Capacitive Touchscreen Panel | |
| | | 6632 | | New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays | |
| | | TFOF | | Flexible Displays Task Force | |
|
|
| Transparent Display Task Force |
| |
| | | 6201 | | New Standard: Guide for Tone Reproduction Curves for Transparent Displays | |
| | | 6302 | | Line Item Revision of SEMI D56-0310, TEST METHOD FOR MEASUREMENT FOR AMBIENT CONTRAST OF LIQUID CRYSTAL DISPLAYS | |
| | | 6303 | | Reapproval of SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection | |
| | | 6304 | | Reapproval of SEMI D58-0310, Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display | |
| | | 6305 | | Line Item Revision of SEMI D59-0710, Terminology for 3D Display | |
| | | 6306 | | Line Item Revision of SEMI D62-0611, Test Method for Measurement of LED Light Bar for Liquid Crystal Displays | |
| | | 6307 | | Line Item Revision of SEMI D65-1011, Test Method for Measurement for the Color Breakup of Field Sequential Color Display | |
| | | 6308 | | Line Item Revision of SEMI D68-0512, Test Method for Optical Properties of Electronic Paper Displays | |
| | | 6533 | | Reapproval of SEMI D69-0314, Test Method of FPD-Based Stereoscopic Display with Active Glasses | |
| | | 6534 | | Reapproval of SEMI D70-0314, Test Method of FPD-Based Stereoscopic Display with Passive Glasses | |
| | | TFOF | | Transparent Display Task Force | |
| FPD - Materials & Components |
| |
|
|
| Japan |
| |
|
|
| FPD Materials & Components Maintenance Task Force |
| |
| | | TFOF | | FPD Materials & Components Maintenance Task Force | |
| FPD - Metrology |
| |
|
|
| Korea |
| |
|
|
| Picture Quality Evaluation Task Force |
| |
| | | TFOF | | Picture Quality Evaluation Task Force | |
| Gases |
| |
|
|
| Europe |
| |
|
|
| Cleaning Gases |
| |
| | | 6148 | | Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing | |
| | | TFOF | | Cleaning Gases | |
|
|
| Permeation Tubes for Trace Moisture Calibration |
| |
| | | TFOF | | Permeation Tubes for Trace Moisture Calibration | |
|
|
| North America |
| |
|
|
| Filters and Purifiers Task Force |
| |
| | | TFOF | | Filters and Purifiers Task Force | |
|
|
| Gases Specification Task Force |
| |
| | | 6656 | | Line Item Revision to SEMI C3.6-0710 (Reapproved 0815), Specification for Phosphine (PH3) in Cylinders, 99.98% Quality | |
| | | 6657 | | Line Item Revision to SEMI C3.35-1109E (Reapproved 0815), Specification for Hydrogen Chloride (HCI), 99.997% Quality | |
| | | 6658 | | Line Item Revision to SEMI C71-0815, Specification and Guide for Boron Trichloride (BCI3) | |
| | | TFOF | | Gases Specification Task Force | |
|
|
| Heater Jacket Task Force |
| |
| | | TFOF | | Heater Jacket Task Force | |
|
|
| Mass Flow Controller Task Force |
| |
| | | 6616 | | Revision to SEMI E12-1213, Guide for Standardized Pressure, Temperature, Density, and Flow Units Used in Mass Flow Meters and Mass Flow Controllers | |
| | | 6643 | | New Standard: Specification for Location and Dimensions for Power Connectors and EtherCAT ports in Mass Flow Controllers and Mass Flow Meters | |
| | | TFOF | | Mass Flow Controller Task Force | |
|
|
| Materials of Construction of Gas Delivery Systems Task Force |
| |
| | | 6394 | | Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems | |
| | | 6510 | | Line Item to SEMI F32-0211, Test Method for Determining of Flow Coefficient for High Purity Shutoff Valves | |
| | | 6582 | | New Standard: Test Method for Measuring Pitting Resistance of Stainless Steel Component | |
| | | 6612 | | New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves | |
| | | 6623 | | Reapproval for SEMI F72-0214, Test Method for Auger Electron Spectroscopy (AES) Evaluation of Oxide Layer of Wetted Surfaces of Passivated 316L Stainless Steel Components | |
| | | TFOF | | Materials of Construction of Gas Delivery Systems Task Force | |
|
|
| Pressure Measurement Task Force |
| |
| | | TFOF | | Pressure Measurement Task Force | |
|
|
| Surface Mount Sandwich Component Dimensions Task Force |
| |
| | | TFOF | | Surface Mount Sandwich Component Dimensions Task Force | |
| HB-LED |
| |
|
|
| China |
| |
|
|
| GaN based LED Epitaxial Wafer Task Force |
| |
| | | TFOF | | GaN based LED Epitaxial Wafer Task Force | |
|
|
| HB-LED Equipment Communication Interface |
| |
| | | 6370 | | New Standard: Specification of Susceptors for HB-LED MOCVD Equipment Communication Interface | |
| | | 6503 | | New Standard:Specification of Recipe Management for LED Equipment | |
| | | 6589 | | Revision to SEMI HB4-0913 (Reapproved 0419), Specification of Communication Interfaces for High Brightness LED Manufacturing Equipment (HB-LED ECI) | |
| | | TFOF | | HB-LED Equipment Communication Interface | |
|
|
| Patterned Sapphire Substrate Task Force |
| |
| | | 6192 | | New Standard: Specification for Dry-Etched Patterned Sapphire Substrates (DPSS) | |
| | | 6371 | | New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate | |
| | | TFOF | | Patterned Sapphire Substrate Task Force | |
|
|
| Sapphire Single Crystal Ingot Task Force |
| |
| | | 5775 | | New Standard: Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers | |
| | | 6502 | | Line Item Revision to SEMI HB11-0819, Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers | |
| | | TFOF | | Sapphire Single Crystal Ingot Task Force | |
|
|
| Sapphire Single Crystal Orientation Task Force |
| |
| | | TFOF | | Sapphire Single Crystal Orientation Task Force | |
|
|
| Single Crystal Sapphire Task Force |
| |
| | | 5629 | | New Standard, Guide for Identification Defects on Bare Surfaces of Sapphire Wafers | |
| | | 5946 | | New Standard: Test Method for Grain Boundary of Single Crystal Sapphire by Optical Homogeneity Technique (OHT) | |
| | | TFOF | | Single Crystal Sapphire Task Force | |
|
|
| North America |
| |
|
|
| HB-LED Equipment Automation Interfaces |
| |
| | | TFOF | | HB-LED Equipment Automation Interfaces | |
|
|
| HB-LED Equipment Communication Interfaces TF |
| |
| | | TFOF | | HB-LED Equipment Communication Interfaces TF | |
|
|
| HB-LED Source Materials TF |
| |
| | | 5984 | | New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing | |
| | | 5985 | | New Standard: Guide for Triethylgallium for HB-LED Manufacturing | |
| | | 5986 | | New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing | |
| | | 5987 | | New Standard: Guide for Trimethylgallium for HB-LED Manufacturing | |
| | | 5988 | | New Standard: Guide for Trimethylindium for HB-LED Manufacturing | |
| | | TFOF | | HB-LED Source Materials TF | |
|
|
| HB-LED Wafer TF |
| |
| | | TFOF | | HB-LED Wafer TF | |
|
|
| Impurities and Defects in HB-LED Sapphire Wafers |
| |
| | | TFOF | | Impurities and Defects in HB-LED Sapphire Wafers | |
|
|
| NA HB-LED Committee |
| |
| | | TFOF | | NA HB-LED Committee | |
|
|
| Patterned Sapphire Substrate (PSS) TF |
| |
| | | TFOF | | Patterned Sapphire Substrate (PSS) TF | |
|
|
| Test Methods TF |
| |
| | | TFOF | | Test Methods TF | |
| Information & Control |
| |
|
|
| Europe |
| |
|
|
| Process Control Solutions (PCS) |
| |
| | | TFOF | | Process Control Solutions (PCS) | |
|
|
| Japan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | 6300 | | New Standard: Guide for EDA Freeze Version | |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6484 | | Line Item Revision to SEMI E170.1-mmyy(#R6375): SPECIFICATION FOR SECS-II PROTOCOL FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM | |
| | | 6548 | | Line Item Revision to SEMI E170-0419: SPECIFICATION FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM (SFORMS) | |
| | | 6549 | | Line Item Revision to SEMI E170-0419: SPECIFICATION FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM (SFORMS) and SEMI E170.1-0419: SPECIFICATION FOR SECS-II PROTOCOL FOR SECURED FOUNDATION OF RECIPE MANAGEMENT SYSTEM | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| JA I&CC Maintenance Task Force |
| |
| | | TFOF | | JA I&CC Maintenance Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | 6374 | | Line Item Revisions to E54.21 Specification of Sensor Actuator Network for Motionnet | |
| | | 6376 | | Line Item Revisions to E54.12 Specification of Sensor Actuator Network for CC-Link | |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Korea |
| |
|
|
| Advanced Back-end Factory Integration TF |
| |
| | | 6301 | | Line Item Revision to E142-0211(Reapproved 1016) Specification for Substrate Mapping: Adding packaging raw materials traceability method | |
| | | TFOF | | Advanced Back-end Factory Integration TF | |
|
|
| Diagnostic Data Acquisition Task Force |
| |
| | | TFOF | | Diagnostic Data Acquisition Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 5832 | | New Standard, Specification for Equipment Generic Counter Model (EGCM) | |
| | | 6650 | | Line Item Revision to E87, Specification for Carrier Management (CMS),Revision Carrier Ready to Unload Prediction Feature | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| North America |
| |
|
|
| Advanced Backend Factory Integration |
| |
| | | 6648 | |
Line Item Revision to E142-0211 (Reapproved 1016): Specification for Substrate Mapping | |
| | | TFOF | | Advanced Backend Factory Integration | |
|
|
| Diagnostic Data Acquisition Task Force NA |
| |
| | | 6343 | | Line-Item Revision to SEMI E138: Specification for XML Semiconductor Common Components | |
| | | 6345 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for
Equipment Self Description (EqSD) to SEMI E125-0414, Specification for Equipment Self Description
(EqSD) | |
| | | 6346 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA) to SEMI E132-1015, Specification for Equipment Client Authentication and Authorization | |
| | | 6347 | | Revision to Add a New Subordinate Standard: Specification for Protocol Buffers of Data
Collection Management to SEMI E134-0414, Specification for Data Collection Management | |
| | | 6527 | | Revision to SEMI E125-0414, Specification for Equipment Self Description (EqSD) | |
| | | 6553 | | Revision to SEMI E134-0319 Specification for Data Collection Management | |
| | | 6571 | | Revision to SEMI E132-0419: Specification for Equipment Client Authentication and Authorization | |
| | | TFOF | | Diagnostic Data Acquisition Task Force NA | |
|
|
| Energy Saving Equipment Communication Task Force |
| |
| | | TFOF | | Energy Saving Equipment Communication Task Force | |
|
|
| Fab & Equipment Computer and Device Security (CDS) Task Force |
| |
| | | 6565 | | New Standard: Specification for Application Whitelisting | |
| | | 6566 | | New Standard: Specification for Malware Free Equipment Integration | |
| | | TFOF | | Fab & Equipment Computer and Device Security (CDS) Task Force | |
|
|
| GEM 300 Task Force |
| |
| | | 6348 | | Revision to E30-0418: Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) | |
| | | 6552 | | Line Item Revision to SEMI E5-0219: Specification For SEMI Equipment Communications Standard 2 Message Content (SECS-II) | |
| | | 6572 | | Revision to SEMI E30-0418: Specification for The Generic Model for Communications and Control of Manufacturing Equipment (GEM) | |
| | | 6597 | | Line Item Revision to SEMI E173-0415E: Specification for XML SECS-II Message Notation (SMN) | |
| | | 6598 | | Line Item Revision to SEMI E37-0819: Specification For High Speed Secs Message Services (HSMS) Generic Services and E37.1-XXYY: Specification For High-Speed Secs Message Service Single Selected-Session Mode (HSMS-SS) | |
| | | 6647 | | Line Item Revision to Standard E116-0518 SPECIFICATION FOR EQUIPMENT PERFORMANCE TRACKING (EPT) and E116.1-0707 (Reapproved 0518) SPECIFICATION FOR SECS-II PROTOCOL FOR EQUIPMENT PERFORMANCE TRACKING (EPT) | |
| | | TFOF | | GEM 300 Task Force | |
|
|
| Graphical User Interfaces (GUI) Task Force |
| |
| | | 6124 | | Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor Manufacturing Equipment | |
| | | TFOF | | Graphical User Interfaces (GUI) Task Force | |
|
|
| NA Information and Control Committee |
| |
| | | TFOF | | NA Information and Control Committee | |
|
|
| Process Control System NA Task Force |
| |
| | | 6649 | | Line item revisions to SEMI E133-1218: Specification for Automated Process Control Systems Interface, and SEMI E133.1-0318: Specification for XML Messaging for Process Control System (PCS) | |
| | | TFOF | | Process Control System NA Task Force | |
|
|
| Sensor Bus Task Force |
| |
| | | 6174 | | Line Item Revision to SEMI E54.9, Specification for Sensor/Actuator Network Communication Specification for Modbus/TCP over TCP/IP
| |
| | | 6562 | | Line-item Revision to SEMI E54.23: Specification for Sensor/Actuator Network Communications for CC-Link IE Field Network | |
| | | 6563 | | Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device | |
| | | 6564 | | Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges | |
| | | TFOF | | Sensor Bus Task Force | |
|
|
| Taiwan |
| |
|
|
| Backend Factory Integration Task Force |
| |
| | | 6147 | | New Standard: Specification of Backend Die Traceability | |
| | | TFOF | | Backend Factory Integration Task Force | |
|
|
| Equipment Information Integration Task Force |
| |
| | | TFOF | | Equipment Information Integration Task Force | |
|
|
| Fab & Equipment Information Security Task Force |
| |
| | | 6506 | | New Standard: Specification for Cybersecurity of Fab Equipment | |
| | | TFOF | | Fab & Equipment Information Security Task Force | |
|
|
| GEM300 Task Force |
| |
| | | TFOF | | GEM300 Task Force | |
| Liquid Chemicals |
| |
|
|
| Europe |
| |
|
|
| EU Gases and Liquid Chemicals Committee |
| |
| | | TFOF | | EU Gases and Liquid Chemicals Committee | |
|
|
| Precursor Specifications Task Force |
| |
| | | TFOF | | Precursor Specifications Task Force | |
|
|
| Solvents in Advanced Processes |
| |
| | | TFOF | | Solvents in Advanced Processes | |
|
|
| Japan |
| |
|
|
| Diaphragm Valves Task Force |
| |
| | | TFOF | | Diaphragm Valves Task Force | |
|
|
| Liquid-Borne Particle Counter Task Force |
| |
| | | TFOF | | Liquid-Borne Particle Counter Task Force | |
|
|
| Liquid Filter Task Force |
| |
| | | TFOF | | Liquid Filter Task Force | |
|
|
| Trace Metal Analysis for High Pure IPA Task Force |
| |
| | | TFOF | | Trace Metal Analysis for High Pure IPA Task Force | |
|
|
| Welding Fitting Task Force |
| |
| | | TFOF | | Welding Fitting Task Force | |
|
|
| North America |
| |
|
|
| Chemical Analytical Methods Task Force |
| |
| | | 6315 | | Line Item Revision to SEMI C30-1110, Specifications and Guidelines for Hydrogen Peroxide, including title change to "Specification and Guide for Hydrogen Peroxide" | |
| | | 6388 | | Revision to SEMI C44-0618, Specification and Guide for Sulfuric Acid | |
| | | 6451 | | Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals | |
| | | 6465 | | Line-item Revision for SEMI C36-1213, Specifications for Phosphoric Acid, to correct nonconforming title to: Specification for Phosphoric Acid | |
| | | 6509 | | Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change | |
| | | 6602 | | New Standard: Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals
| |
| | | 6606 | | Reapproval to SEMI C69-1015: Test Method for the Determination of Surface Areas of Polymer Pellets | |
| | | TFOF | | Chemical Analytical Methods Task Force | |
|
|
| Chemical Mechanical Planarization Consumables (CMP-C) Task Force |
| |
| | | 6489 | | New Standard: Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness used in Semiconductor Manufacturing | |
| | | 6646 | | New Standard: Guide for Reporting Density of the Chemical Mechanical Planarization (CMP) Pads used in Semiconductor Manufacturing | |
| | | TFOF | | Chemical Mechanical Planarization Consumables (CMP-C) Task Force | |
|
|
| High Purity Liquid Assemblies & Systems Task Force |
| |
| | | 6652 | | Line Item Revision to SEMI F39-0315, Guide for Chemical Blending Systems | |
| | | TFOF | | High Purity Liquid Assemblies & Systems Task Force | |
|
|
| High Purity Polymer Materials and Components Task Force |
| |
| | | 6561 | | [To be abandoned due to scope change] Line Item Revision to SEMI F40-0699E (Reapproved 0918) Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing | |
| | | 6601 | | New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water and Liquid Chemical Distribution Systems | |
| | | 6645 | | Revision to SEMI F40-0699E (Reapproved 0918): Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing | |
| | | TFOF | | High Purity Polymer Materials and Components Task Force | |
|
|
| Ultra Pure Water Task Force |
| |
| | | 6575 | | [To be abolished] Line Item Revision to SEMI F61-0617, Guide to Design and Operation of a Semiconductor Ultrapure Water System | |
| | | 6576 | | [To be abolished] Line Item Revision to SEMI F63-0918, Guide for Ultrapure Water Used in Semiconductor Processing | |
| | | 6577 | | [To be abolished] Line Item Revision to SEMI F75-0617, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing | |
| | | 6653 | | Revision to SEMI F61-0617, Guide to Design and Operation of a Semiconductor Ultrapure Water System | |
| | | 6654 | | Revision to SEMI F63-0918, Guide for Ultrapure Water Used in Semiconductor Processing | |
| | | 6655 | | Revision to SEMI F75-0617, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing | |
| | | TFOF | | Ultra Pure Water Task Force | |
|
|
| Water Management Task Force |
| |
| | | 6600 | | New Standard: Guide for Semiconductor Tool Water Reuse | |
| | | 6603 | | Revision to SEMI F98-0618, Guide for Water Reuse in Semiconductor Industry | |
| | | TFOF | | Water Management Task Force | |
| MEMS / NEMS |
| |
|
|
| International |
| |
|
|
| Terminology |
| |
| | | TFOF | | Terminology | |
|
|
| North America |
| |
|
|
| MEMS Material Characterization |
| |
| | | 6007 | | New Standard: Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process | |
| | | TFOF | | MEMS Material Characterization | |
|
|
| MEMS Microfluidics |
| |
| | | TFOF | | MEMS Microfluidics | |
|
|
| MEMS Packaging |
| |
| | | TFOF | | MEMS Packaging | |
|
|
| MEMS Reliability |
| |
| | | TFOF | | MEMS Reliability | |
|
|
| MEMS Substrate TF |
| |
| | | TFOF | | MEMS Substrate TF | |
|
|
| NA MEMS/NEMS Committee |
| |
| | | TFOF | | NA MEMS/NEMS Committee | |
|
|
| Wafer Bond |
| |
| | | TFOF | | Wafer Bond | |
| Metrics |
| |
|
|
| Japan |
| |
|
|
| Japan RF Measurement liaison Task Force |
| |
| | | 6550 | | Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems | |
| | | TFOF | | Japan RF Measurement liaison Task Force | |
|
|
| North America |
| |
|
|
| Critical Chamber Components (CCC) Test Methods Task Force |
| |
| | | 6473 | | New Subordinate Standard: Test Method for Measuring Surface Metal Contamination Through ICP-MS of Showerheads Used in Semiconductor Wafer Processing | |
| | | 6599 | | Line Item Revision to SEMI E180-1219, Test Method for Measuring Surface Metal Contamination Through ICP-MS of Critical Chamber Components Used in Semiconductor Wafer Processing. | |
| | | TFOF | | Critical Chamber Components (CCC) Test Methods Task Force | |
|
|
| EMC Task Force |
| |
| | | TFOF | | EMC Task Force | |
|
|
| Equipment Cost of Ownership Task Force |
| |
| | | TFOF | | Equipment Cost of Ownership Task Force | |
|
|
| Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force |
| |
| | | 6578 | | Revision to SEMI E10-0814E: Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM) and Utilization | |
| | | 6579 | | Revision to SEMI E79-0814E: Specification for Definition and Measurement of Equipment Productivity | |
| | | TFOF | | Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force | |
|
|
| ESD/ESC Task Force- N.A |
| |
| | | 6467 | | Line-Item Revision to SEMI E129-0912, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment | |
| | | 6468 | | Line-Item Revision to SEMI E78-0912, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment | |
| | | TFOF | | ESD/ESC Task Force- N.A | |
|
|
| North America Metrics Technical Committee |
| |
| | | TFOF | | North America Metrics Technical Committee | |
|
|
| RF Measurements Task Force |
| |
| | | TFOF | | RF Measurements Task Force | |
| Micropatterning |
| |
|
|
| North America |
| |
|
|
| Data Path |
| |
| | | TFOF | | Data Path | |
|
|
| Mask Orders Task Force |
| |
| | | 6456 | | Revision to SEMI P45-0211, Specification For Job Deck Data Format For Mask Tools | |
| | | TFOF | | Mask Orders Task Force | |
|
|
| NA Microlithography Committee for 5-Year Review |
| |
| | | TFOF | | NA Microlithography Committee for 5-Year Review | |
|
|
| P47 Revision Task Force |
| |
| | | 6516 | |
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
| |
| | | TFOF | | P47 Revision Task Force | |
|
|
| Patterning Metrology Task Force |
| |
| | | 6220 | | Line Item revision to SEMI P19-92 (Reapproved 0707)
SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE | |
| | | 6221 | | Revision to SEMI P18-92 (Reapproved 1104)
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS | |
| | | TFOF | | Patterning Metrology Task Force | |
| Photovoltaic |
| |
|
|
| China |
| |
|
|
| Building Integrated Photovoltaic (BIPV) Task Force |
| |
| | | 6541 | | New Standard: Classification of Building Integrated Photovoltaic (BIPV) | |
| | | 6542 | | New Standard: Guide for Scrap Judgement of Photovoltaic Modules in Building | |
| | | TFOF | | Building Integrated Photovoltaic (BIPV) Task Force | |
|
|
| Crystalline Silicon Solar Cell Task Force |
| |
| | | 5842 | | New Standard: Test Method for Metal-Wrap-Through Solar Cell Via Resistance | |
| | | 6611 | | Revision to SEMI PV54-0514, Specification for Silver Paste, Used to Contact with N+ Diffusion Layer of Crystalline Silicon Solar Cells | |
| | | 6664 | | Reapproval of SEMI PV65-0715, Test Method Based on RGB for C-Si Solar Cell Color | |
| | | 6665 | | Reapproval of SEMI PV66-0715, Test Method for Determining the Aspect Ratio of Solar Cell Metal Fingers by Confocal Laser Scanning Microscope | |
| | | 6666 | | Reapproval of SEMI PV67-0815, Test Method for the Etch Rate of a Crystalline Silicon Wafer by Determining the Weight Loss | |
| | | 6670 | | Revision to SEMI PV58-0115, Specification for Aluminum Paste, Used in Back Surface Field of Crystalline Silicon Solar Cells | |
| | | TFOF | | Crystalline Silicon Solar Cell Task Force | |
|
|
| PV Equipment Task Force |
| |
| | | 5983 | | New Standard: Test method for In-Line Sheet Resistance Inspection Using the Junction Photo-Voltage Method
| |
| | | 6191 | | New Standard: Guide for the Design of Testing and Sorting Equipment for Crystalline Silicon Solar Cells | |
| | | 6608 | | Reapproval of SEMI PV53-0514, Test Method for In-Line Monitoring of Flat Temperature Zone in Horizontal Diffusion Furnace | |
| | | 6667 | | Reapproval of SEMI PV68-0815, Test Method for the Wire Tension of Multi-Wire Saws | |
| | | TFOF | | PV Equipment Task Force | |
|
|
| PV Mobile Energy Task Force |
| |
| | | TFOF | | PV Mobile Energy Task Force | |
|
|
| PV Module Task Force |
| |
| | | 6069 | | New Standard: Specification for Silicone Adhesive for the Back Rail Fixture on PV Modules | |
| | | 6070 | | New Standard: Guide for Identifying Cell Defects In Crystalline Silicon PV Modules By Electroluminescence (EL) Imaging | |
| | | 6113 | | New Standard: Test Method for Abrasion Resistance of the Polymer Backsheet of Crystalline Silicon Solar Modules | |
| | | 6403 | | Reapproval of SEMI PV45-0513, Test Method for the Content of Vinyl Acetate (VA) in Ethylene-Vinyl Acetate (EVA) Applied in PV Modules Using Thermal Gravimetric Analysis (TGA) | |
| | | 6404 | | Reapproval of SEMI PV44-0513, Specification for Package Protection Technology for PV Modules | |
| | | 6610 | | Revision to SEMI PV86-1018, Specification for Crystalline Silicon Photovoltaic Module Dimensions | |
| | | 6660 | | Reapproval of SEMI PV61-0115, Specification for Framing Tape for Photovoltaic（PV）Modules | |
| | | 6661 | | Reapproval of SEMI PV62-0215, Terminology for Back Contact Photovoltaic (PV) Cells and Modules | |
| | | 6671 | | Revision to SEMI PV63-0215，Specification for UL TRA-THIN Glasses Used for Photovoltaic Modules | |
| | | TFOF | | PV Module Task Force | |
|
|
| Thin Film PV Module Task Force |
| |
| | | 6295 | | New Standard: Test Method for Extension of Flexible Thin Film PV Modules | |
| | | 6401 | | New Standard: Test Method for Indentation Force of Flexible Thin Film PV Modules | |
| | | 6402 | | New Standard: Test Method for Vibration Durability of Flexible Thin Film PV Module | |
| | | TFOF | | Thin Film PV Module Task Force | |
|
|
| Taiwan |
| |
|
|
| Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force |
| |
| | | 6297 | | New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC) | |
| | | 6537 | | Reapproval of SEMI PV56-1214,Test Method for Performance Criteria of Photovoltaic (PV) Cell and Module Package | |
| | | 6538 | | Reapproval of SEMI PV57-1214, Test Method for Current-Voltage (I-V) Performance Measurement of Dye Sensitized Solar Cell (DSSC) | |
| | | 6539 | | New Standard :Specification of reference device for indoor lighting simulator | |
| | | 6540 | | New Standard :Test Method for Durability of Flexible emerging PV | |
| | | TFOF | | Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force | |
|
|
| PV Reliability Test Method Task Force |
| |
| | | TFOF | | PV Reliability Test Method Task Force | |
| Photovoltaic (PV) - Materials |
| |
|
|
| China |
| |
|
|
| PV Silicon Raw Materials Task Force |
| |
| | | 6193 | | New Standard: Specification for Trichlorosilane Used in Polysilicon Production | |
| | | 6458 | | New standard : Specification for Silicon Powder Used in Polysilicon Production | |
| | | 6607 | | Reapproval of SEMI PV50-1114, Specification for Impurities in Polyethylene Packaging Materials for Polysilicon Feedstock | |
| | | 6662 | | Reapproval of SEMI PV59-0115, Test Method for Determination of Total Carbon Content in Silicon Powder by Infrared Absorption after Combustion in an Induction Furnace. | |
| | | 6663 | | Reapproval of SEMI PV64-0715, Test Method for Determining B, P, Fe, Al, Ca Contents in Silicon Powder for PV Applications by Inductively Coupled Plasma Optical Emission Spectrometry | |
| | | 6668 | | Reapproval of SEMI PV74-0216, Test Method for the Measurement of Chlorine in Silicon by Ion Chromatography | |
| | | TFOF | | PV Silicon Raw Materials Task Force | |
|
|
| PV Silicon Wafer Task Force |
| |
| | | 5767 | | New Standard: Guide for Material Requirements of Internal Feeders Used in Mono-crystal Silicon Growers | |
| | | 6609 | | Revision to SEMI PV22-0817，Specification for Silicon Wafers for Use in Photovoltaic Solar Cells | |
| | | TFOF | | PV Silicon Wafer Task Force | |
|
|
| Europe |
| |
|
|
| PV Material Degradation Task Force |
| |
| | | TFOF | | PV Material Degradation Task Force | |
|
|
| PV Silicon Materials Task Force |
| |
| | | TFOF | | PV Silicon Materials Task Force | |
|
|
| Japan |
| |
|
|
| Japan PV Materials Task Force |
| |
| | | TFOF | | Japan PV Materials Task Force | |
|
|
| North America |
| |
|
|
| International PV Analytical Test Methods, Metrology, and Inspection Task Force |
| |
| | | 6642 | | Reapproval of SEMI PV13 Test Method for Contactless Excess-Charge-Carrier Recombination Lifetime Measurement in Silicon Wafers, Ingots, and Bricks Using an Eddy-Current Sensor | |
| | | TFOF | | International PV Analytical Test Methods, Metrology, and Inspection Task Force | |
| Physical Interfaces & Carriers |
| |
|
|
| Europe |
| |
|
|
| EU Equipment Automation Committee (Physical Interfaces & Carriers) |
| |
| | | TFOF | | EU Equipment Automation Committee (Physical Interfaces & Carriers) | |
|
|
| International |
| |
|
|
| Global PIC Maintenance Task Force |
| |
| | | TFOF | | Global PIC Maintenance Task Force | |
|
|
| International Reticle SMIF Pod and Load Port Interoperability Task Force |
| |
| | | TFOF | | International Reticle SMIF Pod and Load Port Interoperability Task Force | |
|
|
| Japan |
| |
|
|
| 300mm Tape Frame PI&C Task Force |
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| | | 6521 | | New Standard – SPECIFICATION FOR 300mm TAPE FRAME FOUP LOAD PORT | |
| | | 6522 | | New Standard – SPECIFICATION FOR BOLTS OF 300mm TAPE FRAME FOUP LOAD PORT | |
| | | 6523 | | New Standard – SPECIFICATION FOR FRONT OPENING INTERFACE BETWEEN 300mm TAPE FRAME FOUP AND LOAD PORT | |
| | | 6524 | | New Standard – SPECIFICATION FOR INDICATOR PLACEMENT ZONE AND SWITCH PLACEMENT VOLUME OF 300mm TAPE FRAME FOUP LOAD PORT | |
| | | 6617 | | New Standard - SPECIFICATION FOR 300mm TAPE FRAME FOUP | |
| | | TFOF | | 300mm Tape Frame PI&C Task Force | |
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| Global PIC Maintenance Task Force |
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| | | 6525 | | Reapproval of SEMI E166-0814: Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard | |
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| Japan Electron Microscopy Workflow liaison Task Force |
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| | | TFOF | | Japan Electron Microscopy Workflow liaison Task Force | |
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| Panel Level Packaging Panel FOUP Task Force |
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| | | 6486 | | New Standard - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING | |
| | | 6618 | | New Standard - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING | |
| | | 6619 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 12 SLOTS | |
| | | 6620 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 510MM-515MM PANEL SIZE and 6 SLOTS | |
| | | 6621 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 12 SLOTS | |
| | | 6622 | | New Subordinate Standard - SPECIFICATION FOR PANEL FOUP FOR 600MM-600MM PANEL SIZE and 6 SLOTS | |
| | | TFOF | | Panel Level Packaging Panel FOUP Task Force | |
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| North America |
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| Electron Microscopy Workflow Task Force |
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| | | 6592 | | New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows | |
| | | TFOF | | Electron Microscopy Workflow Task Force | |
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| NA 450mm Assembly Test Die Prep Task Force |
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| | | TFOF | | NA 450mm Assembly Test Die Prep Task Force | |
| Silicon Wafer |
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| Europe |
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| International Advanced Wafer Geometry Task Force |
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| | | 6613 | | Reapproval of SEMI M20-0215, Practice for Establishing a Wafer Coordinate System | |
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| International Polished Wafers Task Force |
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| | | 6462 | | Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
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| International |
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| International 450 mm Shipping Box |
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| | | TFOF | | International 450 mm Shipping Box | |
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| International Advanced Wafer Geometry Task Force |
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| | | TFOF | | International Advanced Wafer Geometry Task Force | |
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| International Annealed Si Wafer Task Force |
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| | | TFOF | | International Annealed Si Wafer Task Force | |
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| International Automated Advanced Surface Inspection Task Force |
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| | | TFOF | | International Automated Advanced Surface Inspection Task Force | |
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| International Epitaxial Wafers Task Force |
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| | | TFOF | | International Epitaxial Wafers Task Force | |
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| International Polished Wafers Task Force |
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| | | TFOF | | International Polished Wafers Task Force | |
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| International SOI Wafers Task Force |
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| | | TFOF | | International SOI Wafers Task Force | |
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| International Terminology Task Force |
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| | | TFOF | | International Terminology Task Force | |
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| International Test Methods Task Force |
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| | | TFOF | | International Test Methods Task Force | |
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| Japan |
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| International Test Methods Task Force |
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| | | 6570 | | New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scatter Tomography Technique | |
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| JA Shipping Box Task Force |
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| | | TFOF | | JA Shipping Box Task Force | |
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| Japan AWG Task Force |
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| | | TFOF | | Japan AWG Task Force | |
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| Japan TC Chapter of Global Technical Tommittee |
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| | | TFOF | | Japan TC Chapter of Global Technical Tommittee | |
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| Japan Test Method Task Force |
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| | | 5769 | | New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption | |
| | | 5772 | | Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage | |
| | | 6526 | | New Standard Document: Test Method for Bulk Microdefect density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy after Preferential Etching
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| | | TFOF | | Japan Test Method Task Force | |
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| Test Method Task Force |
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| | | 5981 | | NEW STANDARD: TEST METHOD FOR RECOMBINATION LIFETIME OF THE EPILAYER OF THE SILICON EPITAXIAL WAFER (p/p+, n/n+) BY THE SHORT WAVELENGTH EXCITAION MICROWAVE PHOTOCONDUCTIVE DECAY METHOD | |
| | | TFOF | | Test Method Task Force | |
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| North America |
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| International Advanced Wafer Geometry Task Force |
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| | | 6168 | | Line item Revision for M67 “TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING THE ESFQR, ESFQD AND ESBIR METRICS to add exclusion windows to prevent distorted area data.
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| | | 6505 | | Line item Revision for M68“TEST METHOD FOR DETERMINING WAFER NEAR-EDGE GEOMETRY FROM A MEASURED THICKNESS DATA ARRAY USING Curvature Metric, ZDD” to add exclusion windows to prevent distorted area data
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| International Automated Advanced Surface Inspection Task Force |
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| | | 6363 | | Revision of SEMI M52-0214 GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 11 nm TECHNOLOGY GENERATIONS | |
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| International Polished Wafers Task Force |
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| | | 6097 | | Line Item Revision to SEMI M1-0416 Specification for Polished Single Crystal Silicon Wafers, to address issues with primary fiducials across text, table and figures.
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| | | 6425 | | Line Item Revision to SEMI M1 Specification for Polished Single Crystal Silicon Wafers | |
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| International SOI Wafers Task Force |
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| | | 6583 | | New Standard: Specification for SOI Wafers for RF Device Applications | |
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| International Test Methods Task Force |
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| | | 6554 | | New Standard: Practice for Carrier profiling of semiconductors by Scanning Capacitance Microscopy and Scanning Spreading Resistance Microscopy | |
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| Silicon Wafer Committee |
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| | | TFOF | | Silicon Wafer Committee | |
| Traceability |
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| Japan |
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| 5 Year Review TF |
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| | | TFOF | | 5 Year Review TF | |
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| Japan Equipment & Materials Traceability liaison Task Force |
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| | | TFOF | | Japan Equipment & Materials Traceability liaison Task Force | |
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| Japan Single Device Traceability liaison Task Force |
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| | | TFOF | | Japan Single Device Traceability liaison Task Force | |
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| Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force |
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| | | TFOF | | Panel Level Packaging (PLP) Glass Carrier ID Marking Task Force | |
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| North America |
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| 5 Year Review Task Force |
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| | | 6604 | | Line Item Revision to SEMI T5-1214: Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers | |
| | | 6605 | | Reapproval to SEMI T11-0703 (Reapproved 1014): Specification for Marking of Hard Surface Reticle Substrates | |
| | | 6669 | | Revision of SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers | |
| | | TFOF | | 5 Year Review Task Force | |
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| Equipment and Materials Traceability Task Force |
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| | | 6448 | | New Standard – Specification for Equipment and Materials Labels | |
| | | 6449 | | New Standard – Specification for Equipment and Materials Part Traceability | |
| | | TFOF | | Equipment and Materials Traceability Task Force | |
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| Single Device Traceability Task Force |
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| | | 6504 | | New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain | |
| | | TFOF | | Single Device Traceability Task Force | |