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(TFOFs By Committee)

Hide details for 3D Packaging and Integration3D Packaging and Integration
Hide details for JapanJapan
Hide details for 3D Packaging & Integration 5 Year Review Task Force3D Packaging & Integration 5 Year Review Task Force
TFOF3D Packaging & Integration 5 Year Review Task Force
Hide details for 3DS IC Bonded Layer Inspection Metrology TF3DS IC Bonded Layer Inspection Metrology TF
TFOF3DS IC Bonded Layer Inspection Metrology TF
Hide details for JA 450mm Assembly and Test Die Preparation Task ForceJA 450mm Assembly and Test Die Preparation Task Force
TFOFJA 450mm Assembly and Test Die Preparation Task Force
Hide details for Wafer Bond Strength Measurement by Double-cantilever Beam Task ForceWafer Bond Strength Measurement by Double-cantilever Beam Task Force
TFOFWafer Bond Strength Measurement by Double-cantilever Beam Task Force
Hide details for North AmericaNorth America
Hide details for 3DP&I Bonded Wafer Stacks Task Force3DP&I Bonded Wafer Stacks Task Force
TFOF3DP&I Bonded Wafer Stacks Task Force
Hide details for 3DP&I Inspection and Metrology Task Force3DP&I Inspection and Metrology Task Force
7099Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
7100Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
7101Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
7102Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology
TFOF3DP&I Inspection and Metrology Task Force
Hide details for Panel Level Packaging (PLP) Panel Task ForcePanel Level Packaging (PLP) Panel Task Force
TFOFPanel Level Packaging (PLP) Panel Task Force
Hide details for TaiwanTaiwan
Hide details for 3DP&I Middle-End Process Task Force3DP&I Middle-End Process Task Force
TFOF3DP&I Middle-End Process Task Force
Hide details for 3DP&I Testing Task Force3DP&I Testing Task Force
6921New Standard:Guide for Adding Maximum Allowable Current (MAC) Information for Wafer Testing Probe
TFOF3DP&I Testing Task Force
Hide details for Automated Test EquipmentAutomated Test Equipment
Hide details for North AmericaNorth America
Hide details for NA ATE 5-Year ReviewNA ATE 5-Year Review
TFOFNA ATE 5-Year Review
Hide details for Rich Interactive Test Database (RITdb)Rich Interactive Test Database (RITdb)
6973New Standard: Guide for Generic Model on Manufacturing Flow Impacting Semiconductor Test
6974New Standard: Specification for Rich Interactive Test Database Event Message Content
TFOFRich Interactive Test Database (RITdb)
Hide details for Standard Test Data Format (STDF) Task ForceStandard Test Data Format (STDF) Task Force
TFOFStandard Test Data Format (STDF) Task Force
Hide details for Test Cell CommunicationsTest Cell Communications
TFOFTest Cell Communications
Hide details for Tester Event Messaging for Semiconductors (TEMS)Tester Event Messaging for Semiconductors (TEMS)
TFOFTester Event Messaging for Semiconductors (TEMS)
Hide details for Automation TechnologyAutomation Technology
Hide details for JapanJapan
Hide details for A1 TFA1 TF
TFOFA1 TF
Hide details for F-GEM TFF-GEM TF
TFOFF-GEM TF
Hide details for SMT TFSMT TF
7168Line Item Revision to SEMI A2-0722 Specification for Surface Mount Assembler Smart Hookup (SMASH)
TFOFSMT TF
Hide details for TaiwanTaiwan
Hide details for Printed Circuit Board Equipment Communication Interface (PCBECI) Task ForcePrinted Circuit Board Equipment Communication Interface (PCBECI) Task Force
TFOFPrinted Circuit Board Equipment Communication Interface (PCBECI) Task Force
Hide details for Compound Semiconductor MaterialsCompound Semiconductor Materials
Hide details for ChinaChina
Hide details for SiC Epitaxial Wafer Task ForceSiC Epitaxial Wafer Task Force
TFOFSiC Epitaxial Wafer Task Force
Hide details for Silicon Carbide Substrate Task ForceSilicon Carbide Substrate Task Force
6767New Standard: Test Method for GBIR, SBIR, GF3R, SFQR and SORI of Silicon Carbide Wafers by Oblique Incident Interference Method
6769New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic
TFOFSilicon Carbide Substrate Task Force
Hide details for EuropeEurope
Hide details for 5 Year Review Task Force5 Year Review Task Force
7053Line Item Revision of SEMI M63, TEST METHOD FOR MEASURING THE Al FRACTION IN AlGaAs ON GaAs SUBSTRATES BY HIGH RESOLUTION X-RAY DIFFRACTION
TFOF5 Year Review Task Force
Hide details for EU Compound Semiconductor Materials CommitteeEU Compound Semiconductor Materials Committee
TFOFEU Compound Semiconductor Materials Committee
Hide details for SiC Epi Defects Task ForceSiC Epi Defects Task Force
7160New Standard: Guide for Defects found in Homoepitaxial Layers of Silicon Carbide
TFOFSiC Epi Defects Task Force
Hide details for SiC Material and Wafer Specification TFSiC Material and Wafer Specification TF
7111Revision of SEMI M81 Guide to Defects Found in Monocrystalline Silicon Carbide Substrates
TFOFSiC Material and Wafer Specification TF
Hide details for Silicon Carbide Engineered Substrate Task ForceSilicon Carbide Engineered Substrate Task Force
TFOFSilicon Carbide Engineered Substrate Task Force
Hide details for Test Methods Task ForceTest Methods Task Force
7161Line Item Revision of SEMI M93 - Test Method for Quantifying Basal Plane Dislocation Density in 4H-SiC by X-Ray Diffraction Topography/Imaging
TFOFTest Methods Task Force
Hide details for JapanJapan
Hide details for SiC Epitaxial Wafer liaison TFSiC Epitaxial Wafer liaison TF
7211Line Item Revision of SEMI M92-0423 Specification for 4H-SiC Homoepitaxial Wafer
TFOFSiC Epitaxial Wafer liaison TF
Hide details for Silicon Carbide Substrate liaison TFSilicon Carbide Substrate liaison TF
TFOFSilicon Carbide Substrate liaison TF
Hide details for North AmericaNorth America
Hide details for M86 Revision Task ForceM86 Revision Task Force
TFOFM86 Revision Task Force
Hide details for M9 Revision Task ForceM9 Revision Task Force
TFOFM9 Revision Task Force
Hide details for EH&SEH&S
Hide details for JapanJapan
Hide details for Japan Environmental Health and Safety CommitteeJapan Environmental Health and Safety Committee
TFOFJapan Environmental Health and Safety Committee
Hide details for Japan S2 major revision liaison TF (JA-S2 revision LTF) Japan S2 major revision liaison TF (JA-S2 revision LTF)
TFOFJapan S2 major revision liaison TF (JA-S2 revision LTF)
Hide details for S18 Revision Task ForceS18 Revision Task Force
6289Revision to SEMI S18-0312: ENVIRONMENTAL, HEALTH AND SAFETY GUIDELINE FOR FLAMMABLE SILICON COMPOUNDS
TFOFS18 Revision Task Force
Hide details for Japan and North AmericaJapan and North America
Hide details for Global Seismic Protection TFGlobal Seismic Protection TF
TFOFGlobal Seismic Protection TF
Hide details for S23 Revision Global Task ForceS23 Revision Global Task Force
TFOFS23 Revision Global Task Force
Hide details for North AmericaNorth America
Hide details for Control of Hazardous Energy (CoHE) Task ForceControl of Hazardous Energy (CoHE) Task Force
6942Line Item Revision to SEMI S2,  Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Related to CoHE/LOTO section of S2)
TFOFControl of Hazardous Energy (CoHE) Task Force
Hide details for EH&S CommitteeEH&S Committee
7159Reapproal of SEMI S25, Safety Guideline for Hydrogen Peroxide Storage & Handling Systems
Hide details for Energetic Materials EHS Task ForceEnergetic Materials EHS Task Force
TFOFEnergetic Materials EHS Task Force
Hide details for Environmental Performance Rating (EPR) Task ForceEnvironmental Performance Rating (EPR) Task Force
TFOFEnvironmental Performance Rating (EPR) Task Force
Hide details for Ergonomics Task ForceErgonomics Task Force
7134Revision to SEMI S8-0218, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
TFOFErgonomics Task Force
Hide details for Fire Protection Task ForceFire Protection Task Force
6784Line Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Changes to materials of construction criterion in fire and smoke risk for pre-evaluation figure)
TFOFFire Protection Task Force
Hide details for Flammable Gas Task ForceFlammable Gas Task Force
6980Line Item Revisions to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Re:Flammable gas)
TFOFFlammable Gas Task Force
Hide details for Manufacturing Equipment Safety SubcommitteeManufacturing Equipment Safety Subcommittee
TFOFManufacturing Equipment Safety Subcommittee
Hide details for NA Environmental Health and Safety CommitteeNA Environmental Health and Safety Committee
TFOFNA Environmental Health and Safety Committee
Hide details for S1 Revision Task ForceS1 Revision Task Force
7108Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (labels)
TFOFS1 Revision Task Force
Hide details for S10 Task ForceS10 Task Force
7109 Line Item Revisions to SEMI S1, S2, S10, S14, and S30 (regarding risk to buildings/facilities)
7169Revision of SEMI S10-0423 Safety Guideline for Risk Assessment and Risk Evaluation Process
TFOFS10 Task Force
Hide details for S12 (Equipment Decon) Review Task ForceS12 (Equipment Decon) Review Task Force
6888Revision of SEMI S12-0211e, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
TFOFS12 (Equipment Decon) Review Task Force
Hide details for S2 Major Revision Task ForceS2 Major Revision Task Force
TFOFS2 Major Revision Task Force
Hide details for S2 Mechanical Design Task ForceS2 Mechanical Design Task Force
7158Line Item Revision to SEMI S2-0821, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Section 18 and section 5)
TFOFS2 Mechanical Design Task Force
Hide details for S23 Revision Global Task ForceS23 Revision Global Task Force
7135Revision of SEMI S23-1021E2 - Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment
Hide details for S2/S22 Task ForceS2/S22 Task Force
7021Line Items Revisions of S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment
TFOFS2/S22 Task Force
Hide details for S3 Revision Task ForceS3 Revision Task Force
6830Revision to SEMI S3-1211 (Reapproved 1017)E SAFETY GUIDELINE FOR PROCESS LIQUID HEATING SYSTEMS
TFOFS3 Revision Task Force
Hide details for S6 Revision Task ForceS6 Revision Task Force
7133Revision of SEMI S6-0618 - Environmental, Health, and Safety Guideline for Exhaust Ventilation of Semiconductor Manufacturing Equipment
TFOFS6 Revision Task Force
Hide details for S7 Task ForceS7 Task Force
6907Revision to SEMI S7-0515 Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications
TFOFS7 Task Force
Hide details for TaiwanTaiwan
Hide details for Equipment Safety Task ForceEquipment Safety Task Force
TFOFEquipment Safety Task Force
Hide details for FacilitiesFacilities
Hide details for JapanJapan
Hide details for 5-year-review TF5-year-review TF
7205Line Item Revision to SEMI F44-0307 (Reapproved 0818), Specification for Machined Stainless Steel Weld Fittings
7206Line Item Revision to SEMI F45-0307 (Reapproved 0818), Specification for Machined Stainless Steel Reducing Weld Fittings
TFOF5-year-review TF
Hide details for F1 Revision TFF1 Revision TF
TFOFF1 Revision TF
Hide details for Gas Box Components Joint Task ForceGas Box Components Joint Task Force
TFOFGas Box Components Joint Task Force
Hide details for Japan Gases and Facilities CommitteeJapan Gases and Facilities Committee
TFOFJapan Gases and Facilities Committee
Hide details for KoreaKorea
Hide details for Voltage Sag Immunity Task ForceVoltage Sag Immunity Task Force
TFOFVoltage Sag Immunity Task Force
Hide details for North AmericaNorth America
Hide details for Building Information Modeling (BIM) for Semiconductor Capital Equipment Task ForceBuilding Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
6628New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling
TFOFBuilding Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Hide details for NA Facilities CommitteeNA Facilities Committee
6771Reapproval of SEMI E6-0914, Guide for Semiconductor Equipment Installation Documentation
6773Reapproval of SEMI E76-0299 (Reapproved 0913), Guide for 300 mm Process Equipment Points of Connection to Facility Services
TFOFNA Facilities Committee
Hide details for Power Grid Harmonics Task ForcePower Grid Harmonics Task Force
TFOFPower Grid Harmonics Task Force
Hide details for SEMI F51 Revision Task ForceSEMI F51 Revision Task Force
TFOFSEMI F51 Revision Task Force
Hide details for Voltage Sag Immunity Task ForceVoltage Sag Immunity Task Force
7196Revision to SEMI F47-0706 (Reapproved 0812), Specification for Semiconductor Processing Equipment Voltage Sag Immunity
TFOFVoltage Sag Immunity Task Force
Hide details for Flat Panel Display (FPD) - Materials & ComponentsFlat Panel Display (FPD) - Materials & Components
Hide details for JapanJapan
Hide details for Flexible Display Task ForceFlexible Display Task Force
7110Revision to SEMI D78: Test Method of Water Vapor Barrier Property for Plastic Films with High Barrier for Electronic Devices, with title change to Test Method of Water Vapor Barrier Property for Plastic Films with High Gas Barrier for Electronic Devices
7218Reapproval of SEMI D66-0519: Terminology for Plastic Substrates of Flexible Display
TFOFFlexible Display Task Force
Hide details for FPD Mask Task ForceFPD Mask Task Force
7157Line Item Revision to SEMI D38-0723, GUIDE FOR QUALITY AREA OF FLAT PANEL DHISPLAY (FPD) MASKS
TFOFFPD Mask Task Force
Hide details for FPD Materials & Components Maintenance Task ForceFPD Materials & Components Maintenance Task Force
7105Reapproval of SEMI D60-0818: TEST METHOD FOR SURFACE SCRATCH RESISTANCE FOR FPD POLARIZING FILM AND COVER PLASTICS FOR MOBILE DISPLAYS
7106REAPPROVARL TO SEMI D63-0818: TEST METHOD FOR DEPOLARIZATION EFFECT OF FPD COLOR FILTER
7107Reapproval of SEMI D77-0618: Test Method for Measurements of Dimension of Films for FPD – Contour Matching Method
7215Reapproval of SEMI D22-0818: Test Method for the Determination of Color, Transmittance of FPD Color Filter Assemblies
7216Reapproval of SEMI D29-0519: Test Method for Heat Resistance in Flat Panel Display Color Filters
7217Reapproval of SEMI SEMI D30-0519: Test Method for Light Resistance in Flat Panel Display Color Filters
7219Reapproval of SEMI D67-0819: Test method for Antifouling Property and Chemical Resistance of FPD Polarizing Films and Its Materials
TFOFFPD Materials & Components Maintenance Task Force
Hide details for Japan FPD Materials and Components CommitteeJapan FPD Materials and Components Committee
TFOFJapan FPD Materials and Components Committee
Hide details for Flat Panel Display (FPD) - MetrologyFlat Panel Display (FPD) - Metrology
Hide details for KoreaKorea
Hide details for Automotive Display Task ForceAutomotive Display Task Force
7155New Standard: Test Method for Optical Switchable Properties of Automotive Display
Hide details for Perceptual Image QualityPerceptual Image Quality
TFOFPerceptual Image Quality
Hide details for Perceptual Viewing AnglePerceptual Viewing Angle
TFOFPerceptual Viewing Angle
Hide details for Picture Quality Evaluation Task ForcePicture Quality Evaluation Task Force
6975New Standard, Test Method for Response Time Evaluation of Displays with Variable Refresh Rate
7154New Standard: Test Method for Flicker of Flat Panel Displays
7156Revision to SEMI D61-0723, Test Method of Perceptual Angle for OLED Dislays with title change to Test Method of Viewing Angle for Flat Panel Displays using Color Volume
TFOFPicture Quality Evaluation Task Force
Hide details for TaiwanTaiwan
Hide details for Flexible Displays Task ForceFlexible Displays Task Force
6632New Standard: Test Method of Flicker Nuisance for Wide-Visual-Field Displays
7221Reapproval of SEMI D62-0619, Test Method for Measurement of LED Light Bar for Liquid Crystal Displays
TFOFFlexible Displays Task Force
Hide details for Maintenance Task ForceMaintenance Task Force
6960Revision to SEMI D57-0310, Definition of Measurement Index (VCT) for MURA in FPD Image Quality Inspection
6961Line Item Revision to SEMI D58 Terminology and Test Pattern for the Color Breakup of Field Sequential Color Display
TFOFMaintenance Task Force
Hide details for Transparent Display Task ForceTransparent Display Task Force
6201New Standard: Guide for Tone Reproduction Curves for Transparent Displays
6737New Standard: Test Method of Binocular Image Fusion for Augmented Reality Transparent Displays
7220Reapproval of SEMI D59-0519, Terminology for 3D Display
TFOFTransparent Display Task Force
Hide details for Flexible Hybrid Electronics (FHE)Flexible Hybrid Electronics (FHE)
Hide details for JapanJapan
Hide details for FHE TerminologyFHE Terminology
6906New Standard:Terminology for Flexible Hybrid Electronics (FHE)
TFOFFHE Terminology
Hide details for Tactile texture characteristics for FHETactile texture characteristics for FHE
6978New Standard: Test Method for The Tactile Texture Characteristics of FHE Materials And Products
TFOFTactile texture characteristics for FHE
Hide details for North AmericaNorth America
Hide details for FHE Assembly Task ForceFHE Assembly Task Force
7222New Standard: Guide for Flexible Hybrid Electronics Assembly
TFOFFHE Assembly Task Force
Hide details for FHE Design Task ForceFHE Design Task Force
7193New Standard: Guide for Substrate and Interconnect Design of Flexible Hybrid Electronics
TFOFFHE Design Task Force
Hide details for FHE Inks Characterization Task ForceFHE Inks Characterization Task Force
7212New Standard: Guide for Inks Characterization for Flexible Hybrid Electronics
TFOFFHE Inks Characterization Task Force
Hide details for FHE Reliability and Testing Task ForceFHE Reliability and Testing Task Force
TFOFFHE Reliability and Testing Task Force
Hide details for TaiwanTaiwan
Hide details for FHE System for Wearable Task ForceFHE System for Wearable Task Force
6873New Standard: Guide for Salt Mist and Washability Test Flow for Control Module Connector of Electronic textiles
7104New Standard: Test Method of Electromyography Sensing Technology of Flexible Hybrid Electronics and Electronic Textiles
TFOFFHE System for Wearable Task Force
Hide details for FPD - MetrologyFPD - Metrology
Hide details for JapanJapan
Hide details for FPD Metrology Maintenance Task ForceFPD Metrology Maintenance Task Force
TFOFFPD Metrology Maintenance Task Force
Hide details for KoreaKorea
Hide details for Automotive Display Task ForceAutomotive Display Task Force
TFOFAutomotive Display Task Force
Hide details for GasesGases
Hide details for EuropeEurope
Hide details for Cleaning GasesCleaning Gases
6148Guide for F2/N2/Ar chamber cleaning gas mixtures use in semiconductor manufacturing
TFOFCleaning Gases
Hide details for Permeation Tubes for Trace Moisture CalibrationPermeation Tubes for Trace Moisture Calibration
TFOFPermeation Tubes for Trace Moisture Calibration
Hide details for North AmericaNorth America
Hide details for Filters and Purifiers Task ForceFilters and Purifiers Task Force
7197Line-Item Revision to SEMI F28-1103 (Reapproved 0815), Test Method for Measuring Particle Generation from Process Panels
7198Line-Item Revision to SEMI F43-0308 (Reapproved 0613), Test Method for Determination of Particle Contribution by Point-of-Use Gas Purifiers and Gas Filters
7199Line-Item Revision to SEMI F59-0302 (Reapproved 0613), Test Method for Determination of Filter or Gas System Flow Pressure Drop Curves
7200Line-Item Revision to SEMI F67-1101 (Reapproved 0713), Test Method for Determining Inert Gas Purifier Capacity
7201Line-Item Revision to SEMI F68-1101 (Reapproved 0713), Test Method for Determining Purifier Efficiency
TFOFFilters and Purifiers Task Force
Hide details for Gases Specification Task ForceGases Specification Task Force
7097Line-Item Revision to SEMI C54-1116, Specification for Oxygen
7098Line-Item Revision to SEMI C56-1116, Specification for Dichlorosilane
TFOFGases Specification Task Force
Hide details for Heater Jacket Task ForceHeater Jacket Task Force
6916Replacement of SEMI F109-0212, Guide for Heater Systems Requirements,
as a New Standard: Guide for Material Selection for Heaters
TFOFHeater Jacket Task Force
Hide details for Mass Flow Controller Task ForceMass Flow Controller Task Force
7092Line-Item Revision to SEMI E29-1110 (Reapproved 0417), Terminology for the Calibration of Mass Flow Controllers and Mass Flow Meters
7093Line-Item Revision to SEMI F62-1016, Test Method for Determining Mass Flow Controller Performance Characteristics for Ambient and Gas Temperature Effects
7151Line-Item Revision to SEMI E16-0517, Guide for Determining and Describing Mass Flow Controller Leak Rates
7152Line-Item Revision to SEMI E27-1017, Guide for Mass Flow Controller and Mass Flow Meter Linearity
7153Line-Item Revision to SEMI E66-0611 (Reapproved 0517), Test Method for Determining Particle Contribution by Mass Flow Controllers
TFOFMass Flow Controller Task Force
Hide details for Materials of Construction of Gas Delivery Systems Task ForceMaterials of Construction of Gas Delivery Systems Task Force
6394Line Item Revision to SEMI F74-1103 (Reapproved 0710), Test Method for the Performance and Evaluation of Metal Seal Designs for Use in Gas Delivery Systems
6612New Subordinate Standard: Test Method for the Determination of Conductance of Fluid Handling Components at Subatmoshperic and Vacuum Pressure, to SEMI F32-0211, Test Method for Determination of Flow Coefficient for High Purity Shutoff Valves
7202Line-Item Revision to SEMI F69-1213E, Test Method for Transport and Shock Testing of Gas Delivery Systems
7203Line-Item Revision to SEMI F78-0611 (Reapproved 0917), Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications
7204Line-Item Revision to SEMI F81-0611 (Reapproved 0917), Specification for Visual Inspection and Acceptance of Gas Tungsten Arc (GTA) Welds in Fluid Distribution Systems in Semiconductor Manufacturing Applications
TFOFMaterials of Construction of Gas Delivery Systems Task Force
Hide details for Pressure Measurement Task ForcePressure Measurement Task Force
TFOFPressure Measurement Task Force
Hide details for Surface Mount Sandwich Component Dimensions Task ForceSurface Mount Sandwich Component Dimensions Task Force
TFOFSurface Mount Sandwich Component Dimensions Task Force
Hide details for HB-LEDHB-LED
Hide details for ChinaChina
Hide details for GaN based LED Epitaxial Wafer Task ForceGaN based LED Epitaxial Wafer Task Force
TFOFGaN based LED Epitaxial Wafer Task Force
Hide details for HB-LED Equipment Communication InterfaceHB-LED Equipment Communication Interface
TFOFHB-LED Equipment Communication Interface
Hide details for Patterned Sapphire Substrate Task ForcePatterned Sapphire Substrate Task Force
6371New Standard: Test Method for Determining Geometrical Parameters of Patterns on Patterned Sapphire Substrate
TFOFPatterned Sapphire Substrate Task Force
Hide details for Sapphire Single Crystal Ingot Task ForceSapphire Single Crystal Ingot Task Force
TFOFSapphire Single Crystal Ingot Task Force
Hide details for Sapphire Single Crystal Orientation Task Force Sapphire Single Crystal Orientation Task Force
TFOFSapphire Single Crystal Orientation Task Force
Hide details for Single Crystal Sapphire Task ForceSingle Crystal Sapphire Task Force
TFOFSingle Crystal Sapphire Task Force
Hide details for North AmericaNorth America
Hide details for HB-LED AssemblyHB-LED Assembly
TFOFHB-LED Assembly
Hide details for HB-LED Equipment Automation InterfacesHB-LED Equipment Automation Interfaces
TFOFHB-LED Equipment Automation Interfaces
Hide details for HB-LED Equipment Communication Interfaces TFHB-LED Equipment Communication Interfaces TF
TFOFHB-LED Equipment Communication Interfaces TF
Hide details for HB-LED Source Materials TFHB-LED Source Materials TF
5984New Standard: Guide for Biscyclopentadienylmagnesium for HB-LED Manufacturing
5985New Standard: Guide for Triethylgallium for HB-LED Manufacturing
5986New Standard: Guide for Trimethylaluminum for HB-LED Manufacturing
5987New Standard: Guide for Trimethylgallium for HB-LED Manufacturing
5988New Standard: Guide for Trimethylindium for HB-LED Manufacturing
TFOFHB-LED Source Materials TF
Hide details for HB-LED Wafer TFHB-LED Wafer TF
TFOFHB-LED Wafer TF
Hide details for Impurities and Defects in HB-LED Sapphire WafersImpurities and Defects in HB-LED Sapphire Wafers
TFOFImpurities and Defects in HB-LED Sapphire Wafers
Hide details for NA HB-LED CommitteeNA HB-LED Committee
TFOFNA HB-LED Committee
Hide details for Patterned Sapphire Substrate (PSS) TFPatterned Sapphire Substrate (PSS) TF
TFOFPatterned Sapphire Substrate (PSS) TF
Hide details for Test Methods TFTest Methods TF
TFOFTest Methods TF
Hide details for Information & ControlInformation & Control
Hide details for ChinaChina
Hide details for Advanced Backend Factory Integration Task ForceAdvanced Backend Factory Integration Task Force
7018Line Item Revision to SEMI E87-0921, Specification For Carrier Management (CMS) and E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS)
TFOFAdvanced Backend Factory Integration Task Force
Hide details for GEM300 Task ForceGEM300 Task Force
7139Line Item Revisions to E40-1218, Standard For Processing Management and E40.1-1218, Specification For SECS-II Protocol For Processing Management
7140Line Item Revisions to E94-0819R, Specification For Control Job Management and E94.1-0819R, Specification For SECS-II Protocol For Control Job Management (CJM)
TFOFGEM300 Task Force
Hide details for JapanJapan
Hide details for Backend Factory Integration Task ForceBackend Factory Integration Task Force
TFOFBackend Factory Integration Task Force
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOFDiagnostic Data Acquisition Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
TFOFFab & Equipment Information Security Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
6920Line Item Revision to SEMI E171-0916: SPECIFICATION FOR PREDICTIVE CARRIER LOGISTICS(PCL) and SEMI E171.1-0216: SPECIFICATION FOR SECS-II PROTOCOL FOR PREDICTIVE CARRIER LOGISTICS
7173Line-Item Revision to SEMI E30-0423, SPECIFICATION FOR THE GENERIC MODEL FOR COMMUNICATIONS AND CONTROL OF MANUFACTURING EQUIPMENT (GEM)
TFOFGEM 300 Task Force
Hide details for JA I&C Maintenance Task ForceJA I&C Maintenance Task Force
6770Line-Item revision to E169-0615 Guide for Equipment Information System Security
6861Line Item Revision of E99-0317 Specification for Carrier ID Reader/Writer
6862Line Item Revision of E99.1-0317 Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer
7005Line Item Revision to SEMI E91-1217: SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL (PSEM)
TFOFJA I&C Maintenance Task Force
Hide details for Sensor Bus Task ForceSensor Bus Task Force
TFOFSensor Bus Task Force
Hide details for KoreaKorea
Hide details for Advanced Back-end Factory Integration TFAdvanced Back-end Factory Integration TF
TFOFAdvanced Back-end Factory Integration TF
Hide details for Diagnostic Data Acquisition Task ForceDiagnostic Data Acquisition Task Force
TFOFDiagnostic Data Acquisition Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
5832New Standard, Specification for Equipment Generic Counter Model (EGCM)
TFOFGEM 300 Task Force
Hide details for North AmericaNorth America
Hide details for Advanced Backend Factory IntegrationAdvanced Backend Factory Integration
6840New Standard: Specification for Equipment Adoption Criteria for GEM And GEM-Based Standards
6852Reapproval of SEMI E142.3-1016, Specification for Web Services for Substrate Mapping
6924New Standard: Specification for Equipment Management of Consumables and Durables
6925New Subordinate Standard: Specification for SECS-II Protocol for Equipment Management of Consumables and Durables
6948Line Item Revisions to SEMI E142-0921 - Specification for Substrate Mapping, SEMI E142.1-0921 - Specification for XML Schema for Substrate Mapping, Line Item Revision to SEMI E142.2-0921 - Specification for SECS II Protocol For Substrate Mapping, Line Item Revision to SEMI E142.3-0921 - Specification for Web Services Protocol for Substrate Mapping, Line Item Revision to SEMI E142.4-0921 - Specification for Secs II Protocol For Substrate Mapping Using Item Transfer
7213Line Item Revision to SEMI E142-1022 - Specification for Substrate Mapping, SEMI E142.1-0921E — Specification for XML Schema for Substrate Mapping,
SEMI E142.2-1016 — Specification for SECS II Protocol for Substrate Mapping,
SEMI E142.3-1016 — Specification for Web Services for Substrate Mapping,
SEMI E142.4-1022 — Specification for SECS II Protocol for Substrate Mapping Using Item Transfer
TFOFAdvanced Backend Factory Integration
Hide details for Diagnostic Data Acquisition Task Force NADiagnostic Data Acquisition Task Force NA
6930Revision to SEMI E164-0414 (Reapproved 0721): Specification for EDA Common Metadata
7126Reapproval of SEMI E145-0414 (Reapproved 0519), Classification for Measurement Unit Symbols in XML
7127Reapproval of SEMI E128-0414 (Reapproved 0519), Specification for XML Message Structures
7128Reapproval of SEMI E138-0217, Specification for XML Semiconductor Common Components
7174Line Item Revision to SEMI E128-0414 (Reapproved 0519), Specification for XML Message Structures
7175Line Item Revision to SEMI E132-0923 Specification for Equipment Client Authentication and Authorization and SEMI E132.2-0923 Specification for Protocol Buffers for Equipment Client Authentication and Authorization (ECA)
7176Line Item Revision to SEMI E134-0923 Specification for Data Collection Management and SEMI E134.2-0923 Specification for Protocol Buffers of Data Collection Management
7178Revision to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7179Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Generic Model for Communication and Control of Manufacturing Equipment (GEM) to
SEMI E164-0414 (0721), Specification for EDA Common Metadata
7180Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Processing Management to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7181Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Carrier Management (CMS) to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7182Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Substrate Tracking to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7183Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Control Job Management to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7184Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Equipment Performance Tracker to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7185Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Time Synchronization and Definition of the TS-Clock Object to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7186Revision to Add a New Subordinate Standard: Specification for EDA Common Metadata for Module Process Tracking to SEMI E164-0414 (0721), Specification for EDA Common Metadata
7191Line Item Revision to SEMI E179-0623 Specification for Protocol Buffers Common Components
TFOFDiagnostic Data Acquisition Task Force NA
Hide details for Energy Saving Equipment Communication Task ForceEnergy Saving Equipment Communication Task Force
6923Line Item Revisions to SEMI E167-1213: Specification for Equipment Energy Saving Mode Communications (EESM), SEMI E167.1-1213: Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications, and SEMI E175-1116: Specification for Subsystem Energy Saving Mode Communication (SESMC)
7187Revision to SEMI E167-1213 - Specification for Equipment Energy Saving Mode Communications (EESM) and SEMI E167.1-1213 - Specification for SECS-II Protocol for Equipment Energy Saving Mode Communications
TFOFEnergy Saving Equipment Communication Task Force
Hide details for Equipment Data Publication (EDP) Task ForceEquipment Data Publication (EDP) Task Force
7068New Standard: Specification for Equipment Data Publication
7069Revision to Add a New Subordinate Standard: Specification for Common Data for Etch Components to Specification for Equipment Data Publication
7070Revision to Add a New Subordinate Standard: Specification for Common Data for Vacuum Components to Specification for Equipment Data Publication
TFOFEquipment Data Publication (EDP) Task Force
Hide details for Fab & Equipment Computer and Device Security (CDS) Task ForceFab & Equipment Computer and Device Security (CDS) Task Force
6926New Standard: Specification for Equipment Operator Access Management and Monitoring
TFOFFab & Equipment Computer and Device Security (CDS) Task Force
Hide details for GEM 300 Task ForceGEM 300 Task Force
6835Line Item Revision to SEMI E87-XXXX, Specification for Carrier Management (CMS) and SEMI E87.1-XXXX, Specification for SECS-II Protocol for Carrier Management (CMS)
6836Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS) and SEMI E90-0921, Specification for Substrate Tracking and E90.1-0312 (Reapproved 0921), Specification for SECS-II Protocol Substrate Tracking
6991Line Item Revision to SEMI E4-0418, Specification for SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
6992Line Item Revision to SEMI E157-0611 (Reapproved 0616), Specification for Module Process Tracking
7063Reapproval of SEMI E39-1218, Specification for Object Services: Concepts, Behavior, and Services
7064Reapproval of SEMI E40-1218, Specification for Processing Management
7065Line Item Revision to SEMI E172-0320, Specification for SECS Equipment Data Dictionary (SEDD)
7066Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS)
7114Line Item Revision to SEMI E5-0323, Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM) and SEMI E30-0423, Specification for the Generic Model for Communications and Control of Manufacturing Equipment (GEM)
7115Line Item Revision to SEMI E40-1218, Specification for Processing Management and SEMI E40.1-1218, Specification for SECS-II Protocol for Processing Management
7116Line Item Revision to SEMI E87-0921, Specification for Carrier Management (CMS) and SEMI E87.1-0921, Specification for SECS-II Protocol for Carrier Management (CMS)
7117Line Item Revision to SEMI E90-0921, Specification for Substrate Tracking and SEMI E90.1-0312 (Reapproved 0921), Specification for SECS-II Protocol Substrate Tracking
7118Line Item Revision to SEMI E94-0314 (Reapproved 0819), Specification for Control Job Management and SEMI E94.1-0312 (Reapproved 0819), Specification for SECS-II Protocol for Control Job Management (CJM)
7119Line Item Revision to SEMI E116-0623, Specification for Equipment Performance Tracking and SEMI E116.1-0623, Specification for SECS-II Protocol for Equipment Performance Tracking (EPT)
7120Line Item Revision to SEMI E157-0611, Specification for Module Process Tracking
7121Reapproval of SEMI E39.1-1218, Specification for SECS-II Protocol for Object Services (OSS)
TFOFGEM 300 Task Force
Hide details for Graphical User Interfaces (GUI) Task ForceGraphical User Interfaces (GUI) Task Force
6743Revision to SEMI E95-1101, Specification for Human Interface for Semiconductor
Manufacturing Equipment
TFOFGraphical User Interfaces (GUI) Task Force
Hide details for NA Information and Control CommitteeNA Information and Control Committee
TFOFNA Information and Control Committee
Hide details for Process Control System NAProcess Control System NA
6722Reapproval of SEMI E54.11 - Specification for Sensor/Actuator Network Specific Device Model for Endpoint Devices
6724Reapproval of SEMI E54.3 - Specification for Sensor/Actuator Network Specific Device Model for Mass Flow Device
6951Reapproval of SEMI E126-0708 - Specification for Equipment Quality Information Parameters (EQIP)
7067Line Item Revision to SEMI E133-1218, Specification for Automated Process Control Systems Interface and SEMI E133.1-0318, Specification for XML Messaging for Process Control System (PCS)
7125Reapproval of SEMI E133.1-0318 - Specification for XML Messaging for Process Control System (PCS)
TFOFProcess Control System NA
TFOFProcess Control System NA
Hide details for Sensor Bus Task ForceSensor Bus Task Force
6563Reapproval for SEMI E54.18-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Pump Device
6564Reapproval for SEMI E54.22-0914: Specification for Sensor/Actuator Network Specific Device Model for Vacuum Preassure Gauges
6845Reapproval of SEMI E54-0316, Specification for Sensor/Actuator Network
6846Reapproval of SEMI E54.1-0316, Specification for Sensor/Actuator Network Common Device Model
6847Reapproval of SEMI E54.2-0316, Guide for Writing Sensor/Actuator Network (SAN) Letter Ballots
6848Reapproval of SEMI E54.20-0316, Specification for Sensor/Actuator Network Communications for EtherCAT
6849Reapproval of SEMI E54.24-1116, Specification for Sensor/Actuator Network Specific Device Model of a Generic Equipment Networked Sensor (GENsen)
7123Reapproval of SEMI E54.10-0600 (Reapproved 1017), Specification for Sensor/Actuator Network Specific Device Model for an In Situ Particle Monitor Device
7177Line Item Revision to SEMI E54.20-0316 Specification for Sensor/Actuator Network Communications for EtherCAT
7188Withdrawal of SEMI E54.15-1107 Sensor/Actuator Network Communication Specification for SafetyBUS p
7189Withdrawal of SEMI E54.16-1106 (Reapproved 1211) Specification for Sensor/Actuator Network Communications for Lonworks
7190Line Item Revision to SEMI E54.19-1018 Specification for Sensor/Actuator Network for MECHATROLINK
TFOFSensor Bus Task Force
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Hide details for Equipment Edge Data Governance (EEDG) Task ForceEquipment Edge Data Governance (EEDG) Task Force
6938New Standard: Guide for Equipment Edge Data Governance (EEDG)
TFOFEquipment Edge Data Governance (EEDG) Task Force
Hide details for Equipment Information Integration Task ForceEquipment Information Integration Task Force
TFOFEquipment Information Integration Task Force
Hide details for Fab & Equipment Information Security Task ForceFab & Equipment Information Security Task Force
7103
Line Item Revision to SEMI E187(0122)- Specification for Cybersecurity of Fab Equipment
TFOFFab & Equipment Information Security Task Force
Hide details for GEM300 Task Force GEM300 Task Force
TFOFGEM300 Task Force
Hide details for Liquid ChemicalsLiquid Chemicals
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Hide details for EU Gases and Liquid Chemicals CommitteeEU Gases and Liquid Chemicals Committee
TFOFEU Gases and Liquid Chemicals Committee
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TFOFPrecursor Specifications Task Force
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Hide details for Diaphragm Valves Task ForceDiaphragm Valves Task Force
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6979Revision to C77-0912, TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 30 nm AND 100 nm with title change to TEST METHOD FOR DETERMING THE COUNTING EFFICIENY OF LIQUID-BORNE PARTICLE COUNTERS FOR WHICH THE MINIMUM DETECTABLE PARTICLE SIZE IS BETWEEN 20 nm AND 100 nm
TFOFLiquid-Borne Particle Counter Task Force
Hide details for Liquid Filter Task ForceLiquid Filter Task Force
6883Reapproval of SEMI C89 - Test Method for Particle Removal Performance of Liquid Filter Rated Below 30 nm with Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS)
6911New Standard, Test Method For Metal Removal Performance Of Liquid Filter
TFOFLiquid Filter Task Force
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TFOFTrace Metal Analysis for High Pure IPA Task Force
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TFOFWelding Fitting Task Force
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Hide details for Chemical Analytical Methods Task ForceChemical Analytical Methods Task Force
7141Revision to SEMI C21-0618, Specification and Guide for Ammonium Hydroxide
7142Revision to SEMI C28-0618, Specification and Guide for Hydrofluoric Acid
7143Revision to SEMI C29-0618, Specification and Guide for 4.9% Hydrofluoric Acid (10:1 v/v)
7144Revision to SEMI C35-0118, Specification and Guide for Nitric Acid
7145Revision to SEMI C40-1110 (Reapproved 0618), Specification for Potassium Hydroxide, 45% Solution
7146Revision to SEMI C41-0618, Specification and Guide for 2-Propanol
7147Revision to SEMI C45-0518, Specification and Guide for Tetraethylorthosilicate (TEOS)
7148Revision to SEMI C62-0309 (Reapproved 0618), Specification for Porogen Precursors Used in Low K CVD Processes
7149Revision to SEMI C63-1108 (Reapproved 0618), Specification for Organosilicate Precursors Used in Low K CVD Processes
TFOFChemical Analytical Methods Task Force
Hide details for Chemical Mechanical Planarization Consumables (CMP-C) Task ForceChemical Mechanical Planarization Consumables (CMP-C) Task Force
6904New Standard: Guide for Reporting Performance Parameters of the Retaining Rings for Chemical Mechanical Planarization (CMP) used in Semiconductor Manufacturing
6970New Standard: Guide for Reporting Performance Parameters of Pressure Sensitive Adhesives (PSA) for Chemical Mechanical Planarization (CMP) Pads Used in Semiconductor Manufacturing
TFOFChemical Mechanical Planarization Consumables (CMP-C) Task Force
Hide details for High Purity Liquid Assemblies & Systems Task ForceHigh Purity Liquid Assemblies & Systems Task Force
6828Revision to SEMI F31-0313, Guide for Bulk Chemical Distribution Systems
7214Revision of SEMI F41-1116, Guide for Qualification of a Bulk Chemical Distribution System Used in Semiconductor Processing
TFOFHigh Purity Liquid Assemblies & Systems Task Force
Hide details for High Purity Polymer Materials and Components Task ForceHigh Purity Polymer Materials and Components Task Force
6601New Standard: Guide to Meet IRDS Yield Table Recommendations for High Purity Polymer Materials and Components Used in Ultrapure Water
7006Revision to SEMI C69-1015 (Reapproved 1220), Test Method for the Determination of Surface Areas of Polymer Pellets
7089Line-Item Revision to SEMI C78-0113 (Reapproved 1218), Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Atomic Force Microscopy
7090Line-Item Revision to SEMI C87-0515, Test Method for Determining Roughness of Polymer Surfaces Used in Ultrapure Water and Liquid Chemical Distribution Systems by Contact Profilometry
7091Revision to SEMI C90-1015, Test Method and Specification for Testing Perfluoroalkoxy (PFA) Materials Used in Liquid Chemical Distribution Systems, with title change to: Test Method and Specification for Perfluoroalkoxy (PFA) and Other Fluorinated Materials Used in Liquid Chemical Distribution Systems
TFOFHigh Purity Polymer Materials and Components Task Force
Hide details for Statistical Methods Task ForceStatistical Methods Task Force
6451Revision to SEMI C1-0310 (Reapproved 0618), Guide for the Analysis of Liquid Chemicals
6509Revision to SEMI C64-0308 (Reapproved 1214), SEMI Statistical Guidelines for Ship to Control, with title change
6935Revision to SEMI C10-1109 (Reapproved 1114), Guide for Determination of Method Detection Limits
TFOFStatistical Methods Task Force
Hide details for Ultra Pure Water Task ForceUltra Pure Water Task Force
6716Revision to SEMI C79-0819, Guide to Evaluate the Efficacy of Sub-15 nm Filters Used in Ultrapure Water (UPW) Distribution Systems
7086Revision to SEMI F61–0521, Guide for Design and Operation of a Semiconductor Ultrapure Water System
7087Revision to SEMI F63-0521, Guide for Ultrapure Water Used in Semiconductor Processing
7088Revision to SEMI F75-0521, Guide for Quality Monitoring of Ultrapure Water Used in Semiconductor Manufacturing
TFOFUltra Pure Water Task Force
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TFOFWater Management Task Force
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TFOFTerminology
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Hide details for MEMS and Miniaturized Gas Sensing Task ForceMEMS and Miniaturized Gas Sensing Task Force
TFOFMEMS and Miniaturized Gas Sensing Task Force
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TFOFMEMS Material Characterization Task Force
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TFOFMEMS Microfluidics Task Force
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TFOFMEMS Packaging Task Force
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7150New Standard: Guide to MEMS Manufacturing Readiness Levels
TFOFMEMS Reliability Task Force
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Hide details for Cycle Time Metrics Task ForceCycle Time Metrics Task Force
TFOFCycle Time Metrics Task Force
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6550Revision to SEMI E113-0306 (Reapproved 0518), Specification for Semiconductor Processing Equipment RF Power Delivery Systems
TFOFJapan RF Measurement liaison Task Force
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Hide details for Critical Chamber Components (CCC) Test Methods Task Force Critical Chamber Components (CCC) Test Methods Task Force
6931New Standard: Test Method for Measuring Organics Contamination Through Thermal Desorption or Solvent Extraction Gas Chromatography Mass Spectrometry of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection
7129New Standard: Test Method for Measuring Particles and Contamination by A Liquid Particle Counter of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection
7130New Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection
7167New Standard: Test Method for Measuring and Characterizing Surface Particle Contamination on Critical Chamber Components with Airborne Particle Counter and Dry Aerosolizing Chamber
TFOFCritical Chamber Components (CCC) Test Methods Task Force
Hide details for EMC Task ForceEMC Task Force
6894Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment
TFOFEMC Task Force
Hide details for Equipment Cost of Ownership Task ForceEquipment Cost of Ownership Task Force
TFOFEquipment Cost of Ownership Task Force
Hide details for Equipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task ForceEquipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
TFOFEquipment RAMP (Reliability, Availability, Maintainability, and Productivity) Metrics Task Force
Hide details for Equipment Training and Documentation Task ForceEquipment Training and Documentation Task Force
TFOFEquipment Training and Documentation Task Force
Hide details for ESD/ESC Task Force- N.AESD/ESC Task Force- N.A
6971Revision to SEMI E163-0212, Guide for the Handling of Reticles and Other Extremely Electrostatic Sensitive (EES) Items Within Specially Designated Areas
TFOFESD/ESC Task Force- N.A
Hide details for North America Metrics Technical CommitteeNorth America Metrics Technical Committee
TFOFNorth America Metrics Technical Committee
Hide details for RF Measurements Task ForceRF Measurements Task Force
7131Reapproval of SEMI E135-0918, Test Method for RF Generators to Determine Transient Response for RF Power Delivery Systems Used in Semiconductor Processing Equipment
7132Reapproval of SEMI E143-0306 (Reapproved 0518), Test Method for Measuring Power and Variation into a 50-Ω Load and Power Variation and Spectrum into a Load with a VSWR of 2.0 at any phase Angle
TFOFRF Measurements Task Force
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TFOFCurvilinear Format Task Force
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TFOFMask Orders Task Force
Hide details for Micropatterning CommitteeMicropatterning Committee
7026Reapproval of SEMI P44-1216 Specification for Open Artwork System Interchange Standard (OASIS ®) Specific to Mask Tools
7027Reapproval of SEMI P39-0416 Specification for OASIS® – Open Artwork System Interchange Standard
Hide details for NA Microlithography Committee for 5-Year ReviewNA Microlithography Committee for 5-Year Review
TFOFNA Microlithography Committee for 5-Year Review
Hide details for P47 Revision Task ForceP47 Revision Task Force
6516
Revision to SEMI P47 Test Method for Evaluation of Line-Edge Roughness and Linewidth Roughness
TFOFP47 Revision Task Force
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TFOFPatterning Metrology Task Force
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Hide details for Building Integrated Photovoltaic (BIPV) Task ForceBuilding Integrated Photovoltaic (BIPV) Task Force
TFOFBuilding Integrated Photovoltaic (BIPV) Task Force
Hide details for Crystalline Silicon Solar Cell Task ForceCrystalline Silicon Solar Cell Task Force
7050Reapproval of SEMI PV87-1018, Test Method for Peeling Force Between Electrode and Ribbon/Back Sheet
7166Revision to SEMI PV79-0818, Test Method for Exposure Durability of Photovoltaic (PV) Cells to Acetic Acid Vapor
TFOFCrystalline Silicon Solar Cell Task Force
Hide details for Perovskite Thin Film PV Materials and Modules Task Force Perovskite Thin Film PV Materials and Modules Task Force
7164New Standard: Specification of Terrestrial Perovskite Photovoltaic (PV) Module Sizes
7165New Standard: Specification of FAI for Perovskite Photovoltaic (PV) Industry
TFOFPerovskite Thin Film PV Materials and Modules Task Force
Hide details for PV Equipment Task ForcePV Equipment Task Force
7054Reapproval of SEMI PV81-0318, Guide for Specifying Low Pressure Horizontal Diffusion Furnace
7055New Standard: Guide for Tube PECVD Graphite Boat Materials for Solar Cell Production
TFOFPV Equipment Task Force
Hide details for PV Module Task ForcePV Module Task Force
7047Reapproval of SEMI PV82-0318, Specification for Terrestrial Dual-Glass Module with Crystalline Silicon Solar Cell
7048 Reapproval of SEMI PV83-0318, Guide for Sample Preparation Method for Photovoltaic Backsheet Performance Tests
7049Reapproval of SEMI PV85-1018, Practice for Metal Wrap Through (MWT) Back Contact Photovoltaic (PV) Module Assembly
TFOFPV Module Task Force
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TFOFThin Film PV Module Task Force
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Hide details for  Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
6297New Standard: Test Method for Current-Voltage (I-V) Performance Measurement of Perovskite Solar Cell (PSC)
6539New Standard :Specification of reference device for indoor lighting simulator
6540New Standard :Test Method for Durability of Flexible emerging PV
TFOF Organic and Dye Sensitized Solar Cell and Perovskite solar cell Task Force
Hide details for PV Reliability Test Method Task Force PV Reliability Test Method Task Force
6705Reapproval of PV72-0316 Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation
7207Reapproval of SEMI PV23-1011 (Reapproved 0818), Test Method for Mechanical Vibration of Crystalline Silicon Photovoltaic (PV) Modules in Shipping Environment
7208Reapproval of SEMI PV38-0912 (Reapproved 0818), Test Method for Mechanical Vibration of c-Si PV Cells in Shipping Environment
7209Reapproval of SEMI PV72-0316, Test Method to Evaluate an Accelerated Thermo Humidity Resistance of Photovoltaic (PV) Encapsulation
7210Reapproval of SEMI PV84-0818, Test Method for Polymer Foil Dependent Discoloration of Silver Fingers on Photovoltaic Modules
TFOFPV Reliability Test Method Task Force
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Hide details for PV Silicon Raw Materials Task ForcePV Silicon Raw Materials Task Force
7051Reapproval of SEMI PV88-1018, Test Method for Determination of Hydrogen in Photovoltaic (PV) Polysilicon by Inert Gas Fusion Infrared Absorption Method
TFOFPV Silicon Raw Materials Task Force
Hide details for PV Silicon Wafer Task ForcePV Silicon Wafer Task Force
6922New Standard: Classification of Reusable Silicon Material
TFOFPV Silicon Wafer Task Force
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Hide details for PV Material Degradation Task ForcePV Material Degradation Task Force
TFOFPV Material Degradation Task Force
Hide details for PV Silicon Materials Task ForcePV Silicon Materials Task Force
TFOFPV Silicon Materials Task Force
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Hide details for Japan PV Materials Task ForceJapan PV Materials Task Force
TFOFJapan PV Materials Task Force
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Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6833Reapproval of SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
6834Reapproval of SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
7000Line Item Revision to SEMI E84-1109, Specification for Enhanced Carrier Handoff Parallel I/O Interface
TFOFGlobal PIC Maintenance Task Force
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Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
7170Line-Item Revision to SEMI E184 -1221E Specification for 300 mm Tape Frame FOUP Load Port
7171Line-Item Revision to SEMI E185 -1222 Specification for 300 mm Tape Frame FOUP
Hide details for Japan Electron Microscopy Workflow liaison Task ForceJapan Electron Microscopy Workflow liaison Task Force
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Hide details for Next Gen Assembly / Test Material Handling Task ForceNext Gen Assembly / Test Material Handling Task Force
7172New Standard: Specification for Next Gen Assembly / Test Carrier
TFOFNext Gen Assembly / Test Material Handling Task Force
Hide details for Panel Level Packaging Panel FOUP Task ForcePanel Level Packaging Panel FOUP Task Force
7112
Line Item Revision to SEMI E181-0423 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING, SEMI E181.1-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS,
SEMI E181.2-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS,
SEMI E181.3-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and
SEMI E181.4-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
7113
Line Item Revision to SEMI E182-0621 - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING,
TFOFPanel Level Packaging Panel FOUP Task Force
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Hide details for Electron Microscopy Workflow Task ForceElectron Microscopy Workflow Task Force
6592New Standard: Specification for Container for Transport and Storage of Transmission Electron Microscope (TEM) Lamella Carriers within Electron Microscopy Workflows
6832New Standard: Specification for Shipping Container for Transport of Transmission Electron Microscope (TEM) Lamella Carriers (LC) from LC-supplier to LC-end user
TFOFElectron Microscopy Workflow Task Force
Hide details for Film Frame FOUP (FFF) Task ForceFilm Frame FOUP (FFF) Task Force
6896New Standard: Specification for 300 mm Frame Carrier FOUP
7194New Standard: Specification for 300 mm Film Frame FOUP Load Port
TFOFFilm Frame FOUP (FFF) Task Force
Hide details for Global PIC Maintenance Task ForceGlobal PIC Maintenance Task Force
6918Line-Item Revision to SEMI E63-0616, Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
Hide details for Integrated Workflows in Failure Analysis Task ForceIntegrated Workflows in Failure Analysis Task Force
TFOFIntegrated Workflows in Failure Analysis Task Force
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7195Revision to SEMI E72-1016, Specification and Guide for Equipment Footprint, Height, and Weight
TFOFSEMI E72 Revision Task Force
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
7163Reapproval of SEMI MF1530-0707 (Reapproved 1018): Test Method for Measuring Flatness, Thickness, and Total Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
7192Revision of SEMI M73-1013E (Reapproved 1019) Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles
Hide details for International Polished Wafers Task ForceInternational Polished Wafers Task Force
7024Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
7162New Standard: Test Method for epi-resistivity determination in Si wafers by Surface Charge Profiling
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Hide details for International Advanced Wafer Geometry Task ForceInternational Advanced Wafer Geometry Task Force
6983Revision for M49 “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 16 nm TECHNOLOGY GENERATIONS"
Hide details for International Test Methods Task ForceInternational Test Methods Task Force
6570New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique
6687Revision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity
Hide details for JA Shipping Box Task ForceJA Shipping Box Task Force
TFOFJA Shipping Box Task Force
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TFOFJapan AWG Task Force
Hide details for Japan TC Chapter of Global Technical TommitteeJapan TC Chapter of Global Technical Tommittee
TFOFJapan TC Chapter of Global Technical Tommittee
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5772Revision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
6702Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION
TFOFJapan Test Method Task Force
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TFOFTest Method Task Force
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Hide details for International SOI Wafers Task ForceInternational SOI Wafers Task Force
6583New Standard: Specification for SOI Wafers for RF Device Applications
Hide details for Silicon Wafer CommitteeSilicon Wafer Committee
TFOFSilicon Wafer Committee
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7137Reapproval of SEMI T15-0818, Specification for Jig ID: Concept
7138Reapproval of SEMI T22-0212 (Reapproved 0618), Specification for Traceability by Self Authentication Service Body and Authentication Service Body
TFOF5 Year Review TF
Hide details for Blockchain Task ForceBlockchain Task Force
6910New Standard: Specification of Blockchain for Semiconductor supply chain Traceability
TFOFBlockchain Task Force
Hide details for Japan Equipment & Materials Traceability liaison Task ForceJapan Equipment & Materials Traceability liaison Task Force
TFOFJapan Equipment & Materials Traceability liaison Task Force
Hide details for Japan Single Device Traceability liaison Task ForceJapan Single Device Traceability liaison Task Force
TFOFJapan Single Device Traceability liaison Task Force
Hide details for Panel Level Packaging (PLP) Glass Carrier ID Marking Task ForcePanel Level Packaging (PLP) Glass Carrier ID Marking Task Force
TFOFPanel Level Packaging (PLP) Glass Carrier ID Marking Task Force
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7136Reapproval of SEMI T3-1213 (Reapproved 0419), Specification for Wafer Box Labels
TFOF5 Year Review Task Force
Hide details for Equipment and Materials Traceability Task ForceEquipment and Materials Traceability Task Force
6449New Standard: Specification for Equipment and Materials Part Traceability
TFOFEquipment and Materials Traceability Task Force
Hide details for License Server CertificationLicense Server Certification
TFOFLicense Server Certification
Hide details for Single Device Traceability Task Force Single Device Traceability Task Force
6504New Standard: Specification for Counterfeit Prevention for the Electronics Manufacturing Supply Chain
TFOFSingle Device Traceability Task Force
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