SEMI International Standards
Date Prepared: 01/19/2012
Revised (if Applicable): 02/09/2012

Name of Task Force (TF): 3DP&I Middle-End Process Task Force

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: Taiwan

1. Charter: (State the objective of the proposed TF.)
Develop the standards and define the specifications for middle-end process (MEOL) related manufacturing flow. Current Phase of Standard and Specification development focused on the middle-end process on wafers with or without TSVs, including post final metal temporary bonding, wafer thinning, TSV formation and reveal, micro-bumping, redistributed line (RDL) formation and carrier de-bond.

2. Scope: (Define the specific activities that the TF will conduct.)
Identify and suggest generic process flow for middle-end process.
Develop criteria for micro-bump dimensions, planarization and related. Dimensions can be determined into wafer-to-wafer level (WWL), die-to-wafer level (DWL), and die-to-die level (DDL).
Develop criteria for TSV CMP process and related. The via size, via surface roughness, post CMP Cu step height, and post CMP Cu bump planarization uniformity are a few of the related planarization criteria that will be critical to the micro bumping yield and inspection standard.
Develop standard for photo alignment mark and overlay mark. Alignment marks for patterning TSVs and stacking devices/wafers would be standardized for recognition.
Suggest wafer or die thickness variation and warpage before and after MEOL and identify thickness variation, void size, overall void percentage of temporary bonding glue layer, warpage control after temporary bonding and corresponding measure method.
Develop TSV quality criteria such as thickness uniformity, TSV depth variation, void, pattern density, TSV metal extrusion.
Research on in-process testing.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Some of the Tasks and Aspects of the MEOL TF are related but not associated with the following TFs of NA 3DS IC and Taiwan 3DS IC:

NA 3DS IC Standard Task Force- Bonded Wafer Stack working group activities
Taiwan 3DS IC Standard Task Force - Testing working group activities

4. Formation Date:(TF formed on)

Task Force formed on: 02/09/2012
Task Force approved by Committee/GCS on: 02/09/2012

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.