SEMI International Standards
Date Prepared: 10/07/2016
Revised (if Applicable):

Name of Task Force (TF): Advanced Back-end Factory Integration TF

Global Technical Committee: Information & Control
Originating Technical Committee Region: Korea

1. Charter: (State the objective of the proposed TF.)
To develop the equipment automation standards for Backend tools (Bump, Chip Probing, Assembly, Final Test and Sensor) to enable full automation process, including wafer and dice processing tools.
2. Scope: (Define the specific activities that the TF will conduct.)
1. GEM 300 & HSMS Support
2. Dice operational scenario
3. Dice stacking capability and equipment automation specification
4. Traceability of multi-wafers, multi-dice operation and raw packaging materials
5. Discovery and management of data acquisition configuration
6. Discovery of the structure and organization of the equipment and its subsystems and components
7. Marking operation
8. Standardization for lot indexing on based continuous processing

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
NA I&C TC chapter, Japan I&C TC chapter, Taiwan I&C TC chapter, Europe I&C TC chapter, Europe Automation Technology TC chapter, and Japan Automation Technology TC chapter
4. Formation Date:(TF formed on)

Task Force formed on: 10/07/2016
Task Force approved by Committee/GCS on: 10/07/2016

TF Member list was updated on 2017-01-04