SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Revised (if Applicable):
Name of Task Force (TF):
EMC Task Force
Global Technical Committee:
Originating Technical Committee Region:
(State the objective of the proposed TF.)
The mission is to minimize the impact on capital productivity due to the presence of electromagnetic interference (EMI) in semiconductor manufacturing environments. The first objective of this activity is:
a. to review and to update the E33-94 document which describes electromagnetic compatibility, to assure that semiconductor manufacturing facilities and the equipment used for manufacturing semiconductor devices will operate together reliably without failures caused by electromagnetic interference;
b. to update references to the EMC documents listed in the current revision of the standard in accordance with the latest regulatory situation.
c. To add necessary sections regarding regulatory responsibility levels, etc.
d. To add recommendations to the toolmakers and fab personnel regarding mitigation of EMI issues
The second objective is to eventually bring E33 in line with the specific requirements reflecting electromagnetic environment in the fabs by augmenting existing EMC requirements with the ones specific to the fab environment.
(Define the specific activities that the TF will conduct.)
The scope of the first task is limited to updating references to the existing EMC Standards in the E33-94 Standard, adding recommendation documents regarding mitigation of EMI issues, as well as adding compliance responsibility levels.
3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
ESD/ESC Task Force -Japan
Japan - Metrics Committee
Europe - Equipment Automation Committee
Reliability Center of Japan (RCJ)
IEEE EMC Society
4. Formation Date:
(TF formed on)
Task Force formed on:
Task Force approved by Committee/GCS on: