SEMI International Standards
Date Prepared: 11/02/2009
Revised (if Applicable): 11/04/2019

Name of Task Force (TF): MEMS Reliability Task Force

Global Technical Committee: MEMS / NEMS
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)

Larger users/customers of MEMS devices spend extra resources developing their own qualification specifications and tests. MEMS Suppliers spend extra resources qualifying parts to many different customer standards. While large users can typically afford the infrastructure for their own qualification and testing procedures and laboratories, it does so at additional cost. MEMS users can demand specific testing as well, which requires the suppliers to perform testing for each user/customer in different ways. This is time consuming and adds cost, too. In addition, smaller users/customers could be unaware of potential issues they might be missing as they are not as staffed as the larger users/customers.

For these reasons, standards for MEMS reliability are needed. These standards may be similar to current semiconductor reliability standards and may include various environmental levels and lifetimes for MEMS. Reliability of MEMS topics may include, but not limited to, storage and shipping, and operational/lifetime testing, also. Some test methods will be common while others could be custom. Coverage of these issues in a standard is the goal of this TF.

2. Scope: (Define the specific activities that the TF will conduct.)

The task force will outline the selection of, potentially including, but not limited to a device type, the steps for process, materials and machines and parameters governing process reliability and end reproducibility. It will also outline reliability test and quality check details and recommend the guidelines and or standards to achieve high quality process for MEMS device types.

The task force will decide the technology timeline to achieve sets of guidelines and or standards for reliability of several MEMS device types.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

Global 3DP&I
Global Silicon Wafer
SEMI MSIG Manufacturing Working Group

4. Formation Date:(TF formed on)

Task Force formed on: 11/04/2019
Task Force approved by Committee/GCS on: 11/04/2019

Previous TFOF prepared 11/02/2009 by Dr. Ravi Doraiswami (CALCE, University of Maryland),, phone: 301-405-3884, fax: 301-314-9269