SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 09/26/2019

Revised (if Applicable):

Name of Task Force (TF): Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging

Global Technical Committee: 3D Packaging and Integration

Originating Technical Committee Region: Japan

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1. Charter: (State the objective of the proposed TF.)
This taskforce will work on the development of standard for WLP/PLP encapsulation characteristics and measurement methodology
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2. Scope: (Define the specific activities that the TF will conduct.)
This taskforce will develop the WLP/PLP encapsulants characteristics and testing methods of key properties. These include:
Material Characteristics. This includes
-the list of key characteristics of all types of encapsulate.
-Property measurement methods. This includes flowability or curability of materials.
-Measurement of key behaviors which related to encapsulated WLP wafers and PLP panels, etc. This includes the warpage measurement methods of wafer or panel.
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
PLP Panel Task Force
North America 3D Packaging & Integration Technical Committee
Taiwan 3D Packaging & Integration Technical Committee
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4. Formation Date:(TF formed on)

Task Force formed on: 11/18/2019
Task Force approved by Committee/GCS on: 10/11/2019

5. Comments
None.