SEMI International Standards
Date Prepared: 09/26/2019
Revised (if Applicable):

Name of Task Force (TF): Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
This taskforce will work on the development of standard for WLP/PLP encapsulation characteristics and measurement methodology
2. Scope: (Define the specific activities that the TF will conduct.)
This taskforce will develop the WLP/PLP encapsulants characteristics and testing methods of key properties. These include:
Material Characteristics. This includes
-the list of key characteristics of all types of encapsulate.
-Property measurement methods. This includes flowability or curability of materials.
-Measurement of key behaviors which related to encapsulated WLP wafers and PLP panels, etc. This includes the warpage measurement methods of wafer or panel.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
PLP Panel Task Force
North America 3D Packaging & Integration Technical Committee
Taiwan 3D Packaging & Integration Technical Committee

4. Formation Date:(TF formed on)

Task Force formed on: 11/18/2019
Task Force approved by Committee/GCS on: 10/11/2019