SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 08/30/2013Revised (if Applicable):

Document Number: 5688
SNARF for: New Standard: GUIDE FOR OVERLAY PERFORMANCE ASSESSMENT FOR 3DS-IC PROCESS

Originating Global Technical Committee: 3DS-IC
Originating TC Chapter: Taiwan
Task Force (TF) in which work is to be carried out: Middle-End Process
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Various bonding processes have been developed and applied to specific products for 3D-IS process. Wafers can be bonded face to face (F2F) or face to back (F2B), where the choice of stacking direction is dictated by how the stacks are carried in the process and what the required functionality is. One of the challenges is to identify the perfectness of the overlay for the F2B and F2F. It will directly affect the device performance. A generic overlay performance assessment method will be described in order to provide criteria and common baselines of the middle-end process for related upstream and downstream manufacturers fabricating the 3DS-IC products. The guidelines will suggest generic overlay patterns, measurement methodologies, analysis methods for assessing the overlay performance.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
1. Address generic overlay target design methodology, instrument configuration, theoretical model and measurement algorithm consideration for F2F F2B wafer in 3D-IS process.

2. Develop criteria for describing overlay performance in terms of translation, expansion, rotation, residue errors and vector plots, measurement uncertainty will also be described.

This guide will provide a generic optical measurement methodology and linear dimensional parameters such as translation, expansion, rotation, residue errors and vector plots for overlay performance assessment in 3D-IC middle end process quality control. It includes generic overlay target design methodology, instrument configuration, theoretical model and measurement algorithm consideration for F2F and F2B wafer in 3D-IS process. This guide will focus on infrared measurement methods available rather than provide an exhaustive list of the state of the art of overlay methodology of 3D-IC process.


b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 08/30/2013b. 1st Draft by: 02/01/2014
c. (Optional) Informational Ballot by: 12/01/2014d. Letter Ballot by: 12/01/2015
e. TC Chapter Approval By:12/01/2015

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
NA 3DS-IC Committee

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:


If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:


Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS11/22/2013
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on