SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
12/08/2021
Revised (if Applicable):
07/12/2023
Name of Task Force (TF):
Film Frame FOUP (FFF) Task Force
Global Technical Committee:
Physical Interfaces & Carriers
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Develop film frame handling standards that minimize confusion and optimize commonality between advanced packaging factory requirements, AMHS, carriers and equipment in packaging and chip fabs.
Define and develop specifications for a) a small footprint, low weight FOUP that can hold 300mm tape frames, b) supporting standards such as load port, FIMS interfaces, 300mm tape frame, etc.
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2. Scope:
(Define the specific activities that the TF will conduct.)
The TF will focus on creating standards for a small footprint, low weight FOUP and FOUP load port that can accommodate 300mm tape frames. The scope will include, but is not necessarily limited to the following boundary conditions:
- 10mm pitch
- 13 wafer frame capacity
- 300mm wafer FOUP BOLTS (E63) compatible
- copy / reuse as much of the existing 300mm carrier standards as possible
The TF may, as needed, also propose changes / clarifications to the 300mm tape frame specification.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Japan PIC, Tape Frame FOUP WG
3D Packaging and Integration Committee
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4. Formation Date:
(TF formed on)
Task Force formed on:
12/08/2021
Task Force approved by Committee/GCS on:
12/08/2021
5. Comments
Original TF name: Packaging Tape Frame Handling Task Force, revised to FFF TF at SEMICON West 2023 (LNN)
TFOF_FC FOUP june 23 update SR.doc
