SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 12/04/2012Revised (if Applicable): 11/05/2014

Document Number: 5540
SNARF for: Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers (Addition to Appendices 1 and 3: Illustration of Flatness and Shape Metrics for Silicon Wafers)

Originating Global Technical Committee: Silicon Wafer
Originating TC Chapter: Europe
Task Force (TF) in which work is to be carried out: International Advanced Wafer Geometry Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
SEMI M1 specifies wafer flatness and shape according to many different metrics. It also provides decision trees for flatness and shape metrics, but it does not illustrate the definitions of these metrics, which makes it difficult for newcomers to the field – such as groups attempting to specify other kind of wafers (HB-LED, 3D-IC) - to understand the specifics of the metrics. Figures added to SEMI M1 Appendix 1 (Flatness Decision Tree) and Appendix 3(Shape Decision Tree) illustrating these metrics would be beneficial for the industry and would help understanding the differences between the various flatness and shape metrics..


b. Estimate effect on industry.
4: Slight effect or effect not determinable
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
- Develop figures illustrating the flatness and shape metrics for Si wafers
- Define metrics if necessary
- Add figures and metrics to Appendices 1 and 3


b: Expected result of activity
Revision to an existing Standard/Guideline

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 01/01/2013b. 1st Draft by: 07/01/2013
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/01/2015
e. TC Chapter Approval By:07/01/2015

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Global Compound Semiconductor Materials Committee
Global HB-LED Committee
Global 3DS-IC Committee
Global Compound Semiconductor Materials Committee

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 14.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology or a copyrighted item(s) is NOT required

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 15 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS11/04/2014
Recorded in TC Minutes10/29/2013
Attach Pictures and Files here: