SEMI International Standards
Date Prepared:
Revised (if Applicable): 07/25/2013

Name of Task Force (TF): JA 450mm Assembly and Test Die Preparation Task Force

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
The TF will create 450mm standards needed by Assembly Test Die Prep equipment. Preliminary standards for die prep factory interfaces will enable development and prototyping of 450mm equipment.
-Enable availability of the 450mm wafer frame and frame carrier for assembly test die prep processing.
-Enable availability of equipment interfaces for process, metrology and other equipment.

2. Scope: (Define the specific activities that the TF will conduct.)
Standards to be developed:
450mm wafer frame
450mm frame carrier
450mm frame carrier loadport
About a method to align in Packaging Process of 450mm Notch-Free Wafer

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
450mm IPIC TF under Global PIC Committee
Assembly and Packaging Committee

4. Formation Date:(TF formed on)

Task Force formed on:
Task Force approved by Committee/GCS on:

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.