SEMI International Standards
Date Prepared: 04/05/2016
Revised (if Applicable):

Name of Task Force (TF): MEMS Substrate Task Force

Global Technical Committee: MEMS / NEMS
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
Develop and ballot specifications for substrates used to produce MEMS devices. While substrates used in MEMS fabrication share similarities with those used for IC production, they differ in important elements. MEMS substrates normally use SOI (silicon on Insulator) technology and have a much thicker device layer than equivalent IC wafers.

This taskforce is an outgrowth of the work being done by the MSIG - MEMS & Sensors Industry Group, joint TF with SEMI.

2. Scope: (Define the specific activities that the TF will conduct.)
Eliminate current reliance on custom substrates by:
1. Identifying the key parameters needed to order MEMS substrates,
2. Specifying default parameter sets useful for the majority of MEMS fabrication / processing.
3. Develop and ballot specific for MEMS use.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
International Silicon Wafer Committee-
4. Formation Date:(TF formed on)

Task Force formed on: 04/05/2016
Task Force approved by Committee/GCS on: 04/05/2016