SEMI International Standards
Date Prepared: 01/14/2011
Revised (if Applicable):

Name of Task Force (TF): HB-LED Assembly

Global Technical Committee: HB-LED
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
Define physical and packaging attributes of die-level conductor elements as they relate to being optimized for handling and processing by common assembly and other equipment, employing automatic material handling, pattern recognition, interconnect, and assembly systems that are used in HB-LED manufacturing.
2. Scope: (Define the specific activities that the TF will conduct.)
Start with automated package assembly of HB LEDs from 150 mm diameter HB LED wafers. Include attributes that satisfy needs for:

a) material handling of wafers and subsequent intermediate assembly step formats as they are presented to or exit from assembly equipment such as pick and place, die attach, and wire bond

b) Unambiguous identification of a conductor element’s physical orientation on a strip or carrier element, and its relationship to the HB-LED chip substrate’s location, for purpose of appropriate future interconnect or assembly requirements.

Consider various common packaging and processing formats, either stand alone or in carriers, e.g. LEDs on ceramic substrates or other materials, long-axis strips such as lead frames

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
N.A. PIC Committee
N.A. Traceability Committee

4. Formation Date:(TF formed on)

Task Force formed on: 01/24/2011
Task Force approved by Committee/GCS on: 01/24/2011