SEMI International Standards
Date Prepared: 07/10/2019
Revised (if Applicable):

Name of Task Force (TF): Advanced Backend Factory Integration

Global Technical Committee: Information & Control
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
To explore, evaluate, discuss, and formulate consensus based specifications that, through voluntary compliance, will enhance assembly and test for semiconductor manufacturing.
2. Scope: (Define the specific activities that the TF will conduct.)

Its scope is limited to exploring and developing standards that pertain to the interface of manufacturing tools to each other, to control computers, or to human operators, for the purpose of transferring commands and data used during assembly and test processes such as Bump, Wafer Test, Package Assembly, Final Test and Final System Assembly. In particular the following topics will be addressed:
1. GEM 300 & HSMS Support
2. E142 enhancements for traceability of multi-project wafers, multi-dice operation and raw packaging materials
3. Dice stacking capability and equipment automation specification
4. Discovery and management of data acquisition configuration
5. Discovery of the structure and organization of the equipment and its subsystems and components

This activity will include liaison with other SDOs involved in downstream electronics manufacturing.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

Advanced Backend Factory Integration TF in Korea;
Backend Factory Integration TF in Taiwan;
Backend Factory Integration TF in Japan;

4. Formation Date:(TF formed on)

Task Force formed on: 07/10/2019
Task Force approved by Committee/GCS on: 07/10/2019


Formation of a new TF in NA to accommodate SEMI E142 and related standards development efforts