SEMI International Standards
Task Force Organization Form (TFOF)
Task Force Name: 3DS-IC Inspection and Metrology
|Global Technical Committee: 3DS-IC|
|Originating Technical Committee Region: North America|
Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process.
Examples of needed standards include (but are not limited to):
* TSV physical properties i.e. depth, top, bottom CD, side wall….
* Bonded wafer stack properties i.e. overlay, bond inspection
* Defect metrology
* Dies ???
3. Formal linkages with Task Forces in other Regions:
Currently none but will liaise with appropriate regional committees as they are formed
Task Force formed on: 01/25/2011
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