SEMI International Standards
Task Force Organization Form (TFOF)

Task Force Name: 3DS-IC Inspection and Metrology

Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America

1. Charter:

Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process.

2. Scope:
Examples of needed standards include (but are not limited to):
* TSV physical properties i.e. depth, top, bottom CD, side wall….
* Bonded wafer stack properties i.e. overlay, bond inspection
* Defect metrology
* Dies ???

3. Formal linkages with Task Forces in other Regions:
Currently none but will liaise with appropriate regional committees as they are formed

4. Approval:
Task Force formed on: 01/25/2011