SEMI International Standards
Date Prepared: 09/03/2015
Revised (if Applicable):

Name of Task Force (TF): Backend Factory Integration Task Force

Global Technical Committee: Information & Control
Originating Technical Committee Region: Taiwan

1. Charter: (State the objective of the proposed TF.)
To develop the equipment automation standard suite and related standards for Backend tool (Bump, Chip Probing, Assembly and Final Test) to enable full automation process, including wafer and dice processing tools.
1) to maintain and improve the following SEMI equipment automation software standards:
. SEMI E4 SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
. SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS-II)
. SEMI E23 Specification for Cassette Transfer Parallel I/O Interface
. SEMI E30 Generic Model for Communications and Control of Manufacturing Equipment (GEM)
. SEMI E30.1 Inspection and Review Specific Equipment Model (ISEM)
. SEMI E37 High-Speed SECS Message Services (HSMS) Generic Services
. SEMI E39 Object Services Standard: Concepts, Behavior, and Services
. SEMI E40 Standard for Processing Management
. SEMI E42 Recipe Management Standard: Concepts, Behavior, and Message Services
. SEMI E53 Event Reporting
. SEMI E82 Specification for Interbay/Intrabay AMHS SEM (IBSEM)
. SEMI E84 Specification for Enhanced Carrier Handoff Parallel I/O Interface
. SEMI E87 Specification for Carrier Management (CMS)
. SEMI E88 Specification for AMHS Storage SEM (Stocker SEM)
. SEMI E90 Specification for Substrate Tracking
. SEMI E91 Specification for Prober Specific Equipment Model (PSEM)
. SEMI E94 Specification for Control Job Management
. SEMI E109 Specification for Reticle and Pod Management (RPMS)
. SEMI E116 Specification for Equipment Performance Tracking
. SEMI E122 Standard for Tester Equipment Specific Equipment Model (TSEM)
SEMI E130 Specification for Prober Specific Equipment Model for 300 mm Environment (PSEM300)
. SEMI E134 Specification for Data Collection Management
. SEMI E139 Specification for Recipe and Parameter Management (RaP)
. SEMI E142 Specification for Substrate Mapping
. SEMI E147 Guide for Equipment Data Acquisition (EDA)
. SEMI E153 Specification for AMHS SEM (AMHS SEM)
. SEMI E170 Specification for Production Recipe Cache (PRC)
2) to collaborate with other task forces dealing with these 300-mm standards.
3) to make related information for implementation of these 300-mm standards.

2. Scope: (Define the specific activities that the TF will conduct.)
The primary focus of the Backend Factory integration Task Force is to support and refine the equipment automation interface standard suite.

The characteristics that need to be addressed in Backend tool operation include:
1. GEM 300& HSMS Support
2. Dice operational scenario
3. Dice stacking capability and equipment automation specification
4. Traceability of multi-wafers and multi-dice operation
5. Discovery and management of data acquisition configuration
6. Discovery of the structure and organization of the equipment and its subsystems and components

Teleconferences will be held as necessary and face-to-face meetings will be held at the three annual Taiwan standards meetings.

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Backend Factory Integration will work with other TFs to assure standards produced are consistent with related standards. This coordination will be ensured by the Taiwan I&CC.
4. Formation Date:(TF formed on)

Task Force formed on: 09/03/2015
Task Force approved by Committee/GCS on: 09/03/2015