SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 5605
SNARF for: Line Item Revision to SEMI M1-1013, Specification for Polished Single Crystal Silicon Wafers (Subj:Flatness/SFQR change for 16nm technology generation )


Originating Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: International 450 mm Wafer Task Force


1. Rationale: Wafer for 16nm generation SFQR was defined based on ITRS technology node value. However because of the divergence between DRAM and Logic road maps we have an anomaly low value. It is suggested to use lithography requirements to adjust the SFQR values
Rate the Estimated Effect on the Industry
4: Slight effect or effect not determinable

Rate the Estimated Technical Difficulty of the Activity
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Will require update of M1, M76 to revise the values of SFQR

wafer SFQR specification for 16nm 450mm wafers to equal 20nm.


b: Expected result of activity
Revision to an existing Standard/Guideline

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 07/01/2013b. 1st Draft by: 10/01/2013
c. Preballot by: d. Technical Ballot by: 12/01/2013
e. Committee Approval By:03/01/2014




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on July 9, 2013