SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 5174
SNARF for: New Standard: Specification for Identification and Marking for Bonded Wafer Stacks

Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Bonded Wafer Stacks

1. Rationale: Current wafer identification standards and wafer marking standards do not adequately address the needs of bonded wafer stacks. Location (e.g. backside near notch for SEMI T7) will be removed during backside thinning operations or edge-trim operations, or buried under an opaque layer of silicon and rendered un-readable by optical readers when bonded. Multiple wafer stacks will combine wafers with multiple process history, including tracking of temporary carrier wafers, and a standard needs to be developed to combine and track bonded wafer stacks with multiple wafer histories.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Develop an identification standard that will meet the needs of bonded wafer stacks. The initial focus will be temporary bonding and permanent bonding as driven by contributions.

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 03/29/2011b. 1st Draft by: 06/25/2011
c. Preballot by: d. Technical Ballot by: 01/01/2012
e. Committee Approval By:03/01/2012

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on March 29, 2011