SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 5636
SNARF for: Revision of SEMI G92-0412, Specification for Tape Frame Cassette for 450mm Wafer


Originating Global Technical Committee: Assembly & Packaging
Originating Technical Committee Region: Japan
Task Force in which work is to be carried out: JA 450mm Assembly and Test Die Preparation Task Force


1. Rationale: Equipment suppliers and IC makers have identified a need to develop standards for die prep factory interfaces to support 450mm equipment development and prototyping
Rate the Estimated Effect on the Industry
4: Slight effect or effect not determinable

Rate the Estimated Technical Difficulty of the Activity
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Develop specifications for the Frame Carrier used for dicing and die bonding processes and shipping. The specifications include:
1. Dimension of tape frame
2. Mechanical interface with AMHS
3. Mechanical interface with process equipment
4. Others


b: Expected result of activity
Revision to an existing Standard/Guideline

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 07/01/2013b. 1st Draft by: 08/01/2013
c. Preballot by: d. Technical Ballot by: 08/29/2013
e. Committee Approval By:11/11/2013




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on July 19, 2013