SEMI International Standards
Task Force Organization Form (TFOF)
Task Force Name: International 450 mm Wafer Task Force
|Global Technical Committee: Silicon Wafer|
|Originating Technical Committee Region: International|
This task force will develop specifications for 450mm handling (mechanical) wafers and process test wafers.
R&D by some device makers and suppliers drives the need to provide a standard specification for a 450 mm handling wafer to support early designs, feasibility studies, and design of experiments. A standard specification provides a common reference for comparison and reduces cost. This effort is intended to serve an immediate need for research and early design investigation, including 450 mm wafers, carriers, load ports, AMHS, metrology, and selected equipment already in development. The first specification includes dimensional requirements for 450 mm wafers such as, diameter, thickness, .notch, edge polish, and surface polish. Learning from handling wafer tests will be applied to process test wafer and production test wafer specifications.
This task force will sponsor forums to bring stakeholders together to define the wafer characteristics required for a handling (mechanical) wafers, and process test wafers.
This task force will develop specifications for 450 mm handling (mechanical) wafers and process test wafers. Work with Polished Wafer TF on specifications and guides for 450 mm diameter prime wafers.
3. Formal linkages with Task Forces in other Regions:
Physical Interfaces and Carriers International Task Force
International Polished Wafer Task Force
Task Force formed on: 03/06/2007