SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Revised (if Applicable):
Name of Task Force (TF):
International 450 mm Wafer Task Force
Global Technical Committee:
Originating Technical Committee Region:
(State the objective of the proposed TF.)
This task force will develop specifications for 450mm handling (mechanical) wafers and process test wafers.
R&D by some device makers and suppliers drives the need to provide a standard specification for a 450 mm handling wafer to support early designs, feasibility studies, and design of experiments. A standard specification provides a common reference for comparison and reduces cost. This effort is intended to serve an immediate need for research and early design investigation, including 450 mm wafers, carriers, load ports, AMHS, metrology, and selected equipment already in development. The first specification includes dimensional requirements for 450 mm wafers such as, diameter, thickness, .notch, edge polish, and surface polish. Learning from handling wafer tests will be applied to process test wafer and production test wafer specifications.
This task force will sponsor forums to bring stakeholders together to define the wafer characteristics required for a handling (mechanical) wafers, and process test wafers.
(Define the specific activities that the TF will conduct.)
This task force will develop specifications for 450 mm handling (mechanical) wafers and process test wafers. Work with Polished Wafer TF on specifications and guides for 450 mm diameter prime wafers.
3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Physical Interfaces and Carriers International Task Force
International Polished Wafer Task Force
4. Formation Date:
(TF formed on)
Task Force formed on:
Task Force approved by Committee/GCS on: