SEMI International Standards
Date Prepared: 07/25/2006
Revised (if Applicable): 12/12/2006

Name of Task Force (TF): International Test Methods Task Force

Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: International

1. Charter: (State the objective of the proposed TF.)
In Semiconductor industry, most specifications and standards use metrology to confirm the quality of wafers and set and insure the processes. The charter of this Task Force is to write new Metrology Standards, maintain existing Metrology Standards, and maintain MF documents. Also it will be the charter of this Task Force to start activity that will be necessary to write or maintain Metrology Standards.
2. Scope: (Define the specific activities that the TF will conduct.)
1) New metrology standards 2) Maintain existing metrology standards 3) Maintain MF standards 4) Conduct Round Robins, if required. The purpose of the round robins will be to determine precision, accuracy or bias statements for a particular test method. The metrology standards already worked upon by Advanced Wafer Geometry, Advanced Surface Inspection, and other Task Forces will be excluded from this Task Force.
3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Japan Metrology Task Force and Europe Metrology Task Force
4. Formation Date:(TF formed on)

Task Force formed on: 07/25/2006
Task Force approved by Committee/GCS on: