SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 04/04/2017Revised (if Applicable):

Document Number: 6175
SNARF for: New Standard: Guide on Measurements of Openings and Vias in Glass

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DP&I Inspection and Metrology Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Through glass vias (TGV) is an emerging technology in the semiconductor industry. Openings in glass have been defined in SEMI 3D11, and a specification has been laid out in 3D16. However, there are few – or no –agreed upon test methods for measuring the physical and dimensional properties of either a through glass via or an opening in glass. For instance, surface roughness of the openings is critical to the filling process, but to date, no relevant measurement standards exist. This guide will discuss existing test methods for openings in glass.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: 3DS-IC Packaging

c. Estimate technical difficulty of the activity.
III: Difficult - Limited expertise and resources exist and/or achieving consensus is difficult

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This guide is for glass substrates with openings that will be used in semiconductor packaging and will cover all common types of openings in glass, including through glass vias (TGV), blind vias in glass, and other openings.
This guide covers glass substrates that are intended for permanent bonding applications.
This document will not cover metrology for filled vias.


b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 04/04/2017b. 1st Draft by: 11/08/2017
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/01/2018
e. TC Chapter Approval By:04/04/2018

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will not be issued

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.

**Passed A&R Cycle 8-2019


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8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 03/10/2017
Member Review End Date: 03/24/2017

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS04/04/2017
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
SNARF Guide on Measurements of Openings in Glass_LN.docSNARF Guide on Measurements of Openings in Glass_LN.doc