SEMI International Standards
Date Prepared: 01/12/2011
Revised (if Applicable):

Name of Task Force (TF): 3DP&I Bonded Wafer Stacks Task Force

Global Technical Committee: 3D Packaging and Integration
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process.
2. Scope: (Define the specific activities that the TF will conduct.)
* Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks
* Modify/create document to reflect adequate ranges for bonded wafer stacks
* Identify other SEMI standards that are adversely affected by BWS parameters
* Update referenced standards: create/modify standards to reflect BWS parameters

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Global 3DS-IC Committee
Global Silicon Committee
Global MEMS Committee
Will liaise with appropriate regional committees as they are formed

4. Formation Date:(TF formed on)

Task Force formed on: 01/25/2011
Task Force approved by Committee/GCS on: 01/25/2011

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.