SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 02/10/2020Revised (if Applicable):

Document Number: 6641
SNARF for: Revision to SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DP&I Bonded Wafer Stacks Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Document 6511 was a Reapproval ballot in Cycle 4-2019. Comments and negatives were received, and it was decided by the TC Chapter to address these in a future major Revision ballot to reflect the change in Purpose and to address the comments received.


b. Estimate effect on industry.
4: Slight effect or effect not determinable
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:

Address the negatives and comments received during voting Cycle 4-2019, including but not limited to the below:
• Revise Purpose section.
• Comments received that will be addressed:
o Delete “5.3.11 wafer bond, permanent”: 6511 is for TBTB, so it should not include permanent bonding.
o Add debonding option after “5.3.4 debond” as followings,
▪ 5.3.4.1Thermal debond — debond under higher temperature.
▪ 5.3.4.2 laser debond — debond using laser.
▪ 5.3.4.3 mechanical debond — debond mechanically.




b: Expected result of activity
Major revision to an existing Standard or Safety Guideline

For a new Subordinate Standard, identify the Primary Standard here:


Modification of an existing part of Standard(s) or Safety Guideline(s) including Appendices, Complementary Files, and Supplementary Materials

For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 03/09/2020b. 1st Draft by: 04/02/2020
c. (Optional) Informational Ballot by: d. Letter Ballot by: 04/29/2020
e. TC Chapter Approval By:07/23/2020

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Silicon Wafer
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:


If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:

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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 03/02/2020
Member Review End Date: 03/15/2020

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS03/27/2020
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on

Attach Pictures and Files here:

SNARF_Revision to SEMI 3D8.docSNARF_Revision to SEMI 3D8.docSNARF_Revision to SEMI 3D8.pdfSNARF_Revision to SEMI 3D8.pdf