SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 09/21/2013Revised (if Applicable):

Document Number: 5655
SNARF for: Line Item Revision of SEMI M1-1013, Specifications for Polished Single Crystal Silicon Wafers, to update 450 mm wafers edge exclusion

Originating Global Technical Committee: Silicon Wafer
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: International Polished Wafers Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Line item change to reflect 450 mm wafers edge exclusion reduction from 2mm to 1.5mm at 16nm technology generation. This change will increase the wafer PUA.


b. Estimate effect on industry.
4: Slight effect or effect not determinable
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

___________________________________________________________________________
2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
SEMI M1-1013 SPECIFICATIONS FOR POLISHED SINGLE CRYSTAL SILICON WAFERS


1) Table1 Silicon Wafer Specification Format for Order Entry, Parts 1 and 2

2-1 GENERAL CHARACTERISTICS

4 SETUP PARAMETERS

Current
2-1.6
Norminal Edge Exclusion

[ ] 2mm; [ ] 3mm; [ ] 5mm;
[ ] Other. (specify)__________ mm

to be modified as

2-1.6
Norminal Edge Exclusion

[ ] 1.5mm; [ ] 2mm; [ ] 3mm; [ ] 5mm;
[ ] Other. (specify)__________ mm

2)Table 9 Specified Requirements for Notched 450mm Polished Single Crystal Silicon Wafers

current
2-1.6
FQA radius
223 mm

to be modified as
2-1.6
FQA radius
223.5 mm

3) RELATED INFORMATION 1 SPECIFICATION GUIDES FOR ADVANCED TECHNOLOGY GENERATIONS

Table R1-1 Guide for the Specification of 300mm and 450mm Diameter Silicon Wafers for the 32, 22, and 16nm Technology Generations

2-1 GENERAL CHARACTERISTICS

4 SETUP PARAMETERS

Current
2-1.6 FQA radius
300mm wafers
450mm wafers

148 mm
223 mm

to be modified as

2-1.6
2-1.6 FQA radius
300mm wafers
450mm wafers

148 mm
223.5 mm


b: Expected result of activity
Revision to an existing Standard/Guideline

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 10/01/2013b. 1st Draft by: 10/01/2013
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/01/2014
e. TC Chapter Approval By:07/01/2014

_____________________________________________________________________________
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Int'l Test Methods TF
Int'l Advanced Wafer Geometry TF

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

___________________________________________________________________________
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 14.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology or a copyrighted item(s) is NOT required

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 15 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

___________________________________________________________________________
7. Comments, Special Circumstances:
None.

__________________________________________________________________________
8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
__________________________________________________________________________
9.. SNARF Approval Dates:
TC Chapter or GCS10/10/2013
Recorded in TC Minutes
Attach Pictures and Files here: