SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
New Standard: Specification of Backend Die Traceability
Originating Global Technical Committee:
Information & Control
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
Backend Factory Integration Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Wearable and home devices are likely to lead growth in the Internet of Things (IoT) business during the rest of this decade. The back-end technologies are on the trend from traditional BGA assembly towards 3D IC package (POP, TSV PIP, etc.). How to equip more capabilities of automating tool processing to improve the throughput and availability is one of key focuses.
In recent years, for the great progress of backend 3D IC technology development, the requirement of equipment automation has extended to smaller units on the wafer. Die tracing between equipment and wafer can help company for quality control and made benefit for downstream customers. Therefore, the large chip-based information can provide helpful solution in further big data analysis. For these reason, equipment performance capacity also become the primary focus in backend system. The variety of container is also a characteristic, and it is difficult to define and classify those carrier types in backend standards.
b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information:
c. Estimate technical difficulty of the activity.
III: Difficult - Limited expertise and resources exist and/or achieving consensus is difficult
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Promote new specification to identify the relationship between die and wafer including die location, die characteristics value, and die process data.
Three main KPI of Tool data collection and die traceability:
(1) Die Traceability of Equipment: output through defined map file and real time event report.
(2) Backend Equipment basic SECS ability and process flow definition: the format of Map file uploaded to EQP, feedback the remained die map file…etc.
(3) Backend tools’ special process data collection including content and flow
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)
For a new Subordinate Standard, identify the Primary Standard here:
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
1. North America TC Chapter of Information & Control Global Technical Committee
2. Japan TC Chapter of Information & Control Global Technical Committee
3. Korea TC Chapter of Information & Control Global Technical Committee
Europe TC Chapter of Information & Control Global Technical Committee
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
will not be issued
Identify the recipient global technical committee(s):
Information & Control
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
the use of patented technology is NOT required.
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
Attach Pictures and Files here: