SEMI International Standards
Date Prepared: 12/14/2018
Revised (if Applicable):

Name of Task Force (TF): Backend Factory Integration Task Force

Global Technical Committee: Information & Control
Originating Technical Committee Region: Japan

1. Charter: (State the objective of the proposed TF.)
To develop the equipment automation standard suite and related standards for such backend tools as Bump, Chip Probing, Assembly, Final Test and other wafer or dice processing tools, in order to make fully automated process operation.
The word backend is not metal wiring processes onto active and passive electronics elements fabricated on a semiconductor wafer but assembly and packaging processes of semiconductor dice, including final test and inspection processes.

2. Scope: (Define the specific activities that the TF will conduct.)
1. GEM 300 & HSMS Support
2. Dice operational scenario
3. Dice stacking capability and equipment automation specification
4. Traceability of multi-wafers, multi-dice operation and raw packaging materials
5. Discovery and management of data acquisition configuration
6. Discovery of the structure and organization of the equipment and its subsystems and components
7. Marking operation
8. Standardization for lot indexing on based continuous processing

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Backend Factory Integration Task Force in Taiwan region
Advanced Back-end Factory Integration Task Force in Korea region

4. Formation Date:(TF formed on)

Task Force formed on: 12/14/2018
Task Force approved by Committee/GCS on: 12/14/2018