SEMI International Standards
Task Force Organization Form (TFOF)

Task Force Name: 3DS IC Testing Task Force

Global Technical Committee: 3DS-IC
Originating Technical Committee Region: Taiwan

1. Charter:

The Testing Task Force will develop standards, guidelines, and/or specifications for electrical testing related activities used in 3DS-IC manufacturing for the ultimate goal of yield enhancement

2. Scope:
Activities related to electrical testing of prebond and bonded wafers/devices include (but not limited to):

Design for Test (DfT) such as test structures and placement;
Test methodologies such as contact method and test procedures;
Test fixtures such as probe card and probe interfaces, and
Data mining test results

3. Formal linkages with Task Forces in other Regions:
No linkages reported

4. Approval:
Task Force formed on: 10/26/2011