SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared: 10/26/2011Revised (if Applicable):

Name of Task Force (TF): 3DS IC Testing Task Force

Global Technical Committee: 3DS-IC
Originating Technical Committee Region: Taiwan


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1. Charter: (State the objective of the proposed TF.)
The Testing Task Force will develop standards, guidelines, and/or specifications for electrical testing related activities used in 3DS-IC manufacturing for the ultimate goal of yield enhancement
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2. Scope: (Define the specific activities that the TF will conduct.)
Activities related to electrical testing of prebond and bonded wafers/devices include (but not limited to):

Design for Test (DfT) such as test structures and placement;
Test methodologies such as contact method and test procedures;
Test fixtures such as probe card and probe interfaces, and
Data mining test results

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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

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4. Formation Date:(TF formed on)

Task Force formed on: 10/26/2011
Task Force approved by Committee/GCS on: 10/26/2011