SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 01/17/2020Revised (if Applicable):

Document Number: 6628
SNARF for: New Standard: Guide for Facilities Data Package for Semiconductor Manufacturing Equipment Installation and Building Information Modeling

Originating Global Technical Committee: Facilities
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Semiconductor manufacturers are asking equipment suppliers to provide input for Building Information Modeling (BIM) software and the industry needs a standard format that will work with multiple different software applications (there are at least three software companies that work in this space). This is the latest trend in facilities planning. Basically, it is a 3D model of a piece of capital equipment with interconnect information (water, power, gas, exhaust, etc) defined in the model. The model needs to reflect the true dimensions of the tool and show the x, y, and z location of each interface point. It is also expected to contain information about idle, typical, and maximum usage of each interface point similar to what is currently defined in SEMI E6. This allows the user to build virtual models of their entire fab, optimize layouts, and plan all of the facilities requirements (routing and sizing of all of the equipment supplies). The benefit of BIM to the semiconductor manufacturers is large when designing new fabs or optimizing existing fabs and this effort is being driven by some of the largest semiconductor companies. With a common format that works for all semiconductor manufacturers and all BIM software, the equipment manufacturers will only have to create one BIM model per equipment configuration. It can take several hundred man hours to build such a model and this would become impractical without a common format.

b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Semiconductor Manufacturers (Fab Owners), Equipment Suppliers, Architecture/Engineering/Construction (AEC) service providers

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
1. This Guide would be applicable to all semiconductor wafer process and support equipment.
2. This Guide would define a digital format that can be easily exported from a wide array of 3D modeling programs and imported into any of the BIM software packages.
3. This Guide would define the format of the connection data with defined location tolerances, defined features, and defined terminology.
4. This Guide will recommend the data for each connection.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:

For Standards, identify the Standard Subtype below:

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 11/04/2019b. 1st Draft by: 01/06/2020
c. (Optional) Informational Ballot by: d. Letter Ballot by: 02/11/2020
e. TC Chapter Approval By:03/31/2020

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
GTC Information & Control

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual 7):

c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Information & Control
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required

NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

7. Comments, Special Circumstances:

8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 11/20/2019
Member Review End Date: 12/03/2019

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations 8.2.1)

9. SNARF Approval Dates:
TC Chapter or GCS01/17/2020
Recorded in TC Minutes03/31/2020


10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on

Attach Pictures and Files here:

SNARF_BIM (new)_v2_atm_v3.docSNARF_BIM (new)_v2_atm_v3.docSNARF_BIM (new)_v2.pdfSNARF_BIM (new)_v2.pdf