SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 05/22/2019Revised (if Applicable):

Document Number: 6526
SNARF for: New Standard Document: Test Method for Bulk Microdefect density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy after Preferential Etching

Originating Global Technical Committee: Silicon Wafer
Originating TC Chapter: Japan
Task Force (TF) in which work is to be carried out: Japan Test Method Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
JEITA standard documents on test method for silicon wafer have been facing difficulties to be maintained due to the dissolution of corresponding JEITA committee. Those JEITA standards have been referred to by some of SEMI Standard documents. Therefore, important descriptions (or documents) in JEITA documents are required to be transferred to the corresponding SEMI Standards. The purpose of this activity is to transit effective descriptions from JEITA document as EM-3508 to SEMI Standard document, regarding “TEST METHOD FOR BULK MICRO DEFECT DENSITY AND DENUDED ZONE WIDTH IN ANNEALED SILICON WAFERS”. In conformity to a discussion at Test Method Task Force by e-mail, Japan TF decided divded into two documents which are "etching method"and "laser scattering metnod".
This document will be descirbed about "ettching method".


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This standard defines measurement techniques of BMD density and DZ width that form in silicon wafers after annealing the wafers with heat treatment. The techniques covered in this standard are intended to measure BMD density over a range of 107/cm3 to 1010/cm3 and DZ width up to 150 mm.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:


Modification of an existing part of Standard(s) or Safety Guideline(s) including Appendices, Complementary Files, and Supplementary Materials

For Standards, identify the Standard Subtype below:
Test Method

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 05/01/2018b. 1st Draft by: 05/01/2019
c. (Optional) Informational Ballot by: d. Letter Ballot by: 05/01/2019
e. TC Chapter Approval By:05/01/2019

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 03/25/2019.
Member Review End Date: 04/08/2019

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS04/19/2019
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on