SEMI International Standards
Task Force Organization Form (TFOF)


Task Force Name: 3DS-IC Thin Wafer Handling


Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America


1. Charter:

* Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high volume manufacturing (HVM)
* Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing.
* Define shipping requirements, including packaging, reliability, and other relevant criteria. This will also include MPGA ship/handle requirements


2. Scope:
Formulate a common set of requirements and priorite critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs

* Thin wafer and Die Shipping related activities: Examples
- Shipping carriers for thin wafer – wafer cassette, box or frame
- Shipping carrier for dies (MPGA)
- Reliability Test methods
* Transportation vibration testing
* Drop-shock
* Other – new tests?

* Thin wafer handling-related activities:Examples
- Process and Metrology Tools and Test methods
* Whole wafer inspection for damage (crack, break etc)Macro level
* Damage to features – microbump, pad etc micro level
- Universal carrier concept
* Automation


3. Formal linkages with Task Forces in other Regions:
Global 3DS-IC Committee

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4. Approval:
Task Force formed on: 01/25/2011