SEMI International Standards
Date Prepared: 01/12/2011Revised (if Applicable):

Name of Task Force (TF): 3DS-IC Thin Wafer Handling

Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
* Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high volume manufacturing (HVM)
* Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing.
* Define shipping requirements, including packaging, reliability, and other relevant criteria. This will also include MPGA ship/handle requirements

2. Scope: (Define the specific activities that the TF will conduct.)
Formulate a common set of requirements and priorite critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs

* Thin wafer and Die Shipping related activities: Examples
- Shipping carriers for thin wafer – wafer cassette, box or frame
- Shipping carrier for dies (MPGA)
- Reliability Test methods
* Transportation vibration testing
* Drop-shock
* Other – new tests?

* Thin wafer handling-related activities:Examples
- Process and Metrology Tools and Test methods
* Whole wafer inspection for damage (crack, break etc)Macro level
* Damage to features – microbump, pad etc micro level
- Universal carrier concept
* Automation

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Global 3DS-IC Committee
4. Formation Date:(TF formed on)

Task Force formed on: 01/25/2011
Task Force approved by Committee/GCS on: 01/25/2011

SEMI Staff Note: TF disbanded by NA 3DS-IC on November 4, 2014.