SEMI International Standards TASK FORCE ORGANIZATION FORM (TFOF)

Date Prepared: 01/26/2009

Revised (if Applicable): 04/01/2009

Name of Task Force (TF): NA 450mm Assembly Test Die Prep Task Force

Global Technical Committee: Physical Interfaces & Carriers

Originating Technical Committee Region: North America

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1. Charter: (State the objective of the proposed TF.)
The TF will create 450mm standards needed by Assembly Test Die Prep equipment. Preliminary standards for die prep factory interfaces will enable development and prototyping of 450mm equipment as outlined by the ISMI program and 450mm timeline in ITRS
Enable availability of the 450mm wafer frame and frame carrier for assembly test die prep processing.
Enable availability of equipment interfaces for process, metrology, AMHS, and other equipment.
NOTE: Eventual intent is to form international tf with a JA tf (probably in JA Packaging committee), per agreement between both committees.
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2. Scope: (Define the specific activities that the TF will conduct.)
Standards to be developed:
450mm wafer frame
450mm frame carrier
450mm frame carrier loadport
Other assembly test die prep standards as agreed to by the TF
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3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
450mm IPIC TF
Japan Packaging Committee
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4. Formation Date:(TF formed on)

Task Force formed on: 04/01/2009
Task Force approved by Committee/GCS on: 04/01/2009

5. Comments
None.